Micromirror systems with open support structures
First Claim
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1. A micromirror device comprising:
- a substrate with electrical components including address circuitry, and an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror portion and a plurality of electrode portions, wherein at least one portion of each micromechanical light modulating element is held above said substrate by an open support.
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Abstract
Micromirror devices, especially for use in digital projection are disclosed. Other applications are contemplated as well. The devices employ a superstructure that includes a mirror supported over a hinge set above a substructure. Various improvements to the superstructure over known micromirror devices are provided. The features described are applicable to improve manufacturability, enable further miniaturization of the elements and/or to increase relative light return. Devices can be produced utilizing the various optional features described herein, possibly offering cost savings, lower power consumption, and higher resolution.
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Citations
17 Claims
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1. A micromirror device comprising:
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a substrate with electrical components including address circuitry, and an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror portion and a plurality of electrode portions, wherein at least one portion of each micromechanical light modulating element is held above said substrate by an open support. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9)
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2. A micromirror device comprising:
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a substrate with electrical components including address circuitry, and an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror portion and a plurality of electrode portions, wherein at least one portion of each micromechanical light modulating element is held above said substrate by a support located at a border region.
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10. A method of manufacturing support structures in a micromirror device comprising, a substrate with electrical components including address circuitry, and an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror portion and a plurality of electrode portions, said method comprising:
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producing a precursor structure comprising two columns and an upper surface, removing portions of said columns and said upper surface, leaving only a spanning segment of said precursor upper surface located between said precursor columns, and support portions of said columns attached to said spanning segment. - View Dependent Claims (11, 12, 13)
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14. A method of manufacturing electrodes in a micromirror device, comprising, a substrate with electrical components including address circuitry, and an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror and a plurality of electrode portions, said method comprising:
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providing a sacrificial layer of mater and on a first surface of said substrate, depositing electrode material over said first surface and a second surface of said sacrificial layer, and removing said sacrificial layer, leaving at least one electrode with an upper portion supported by a support portion above an electrode lower portion on said substrate. - View Dependent Claims (15, 16, 17)
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Specification