Microelectronic contact structures, and methods of making same

• US 20040072452A1
• Filed: 10/23/2003
• Published: 04/15/2004
• Est. Priority Date: 02/13/1998
• Status: Abandoned Application

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Mathieu, Gaetan L., Eldridge, Benjamin N., Grube, Gary W., Khandros, Igor Y.
• Application Number:
  US10/692,174
• Publication Number:
  US 20040072452A1
• Time in Patent Office: Days
• US Class Current: 439/69
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01L 2224/02335 Free-standing redistribution layers
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49218 with deforming
• CPC Class Codes: Y10T 29/49316 Impeller making

Abstract

Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.

Claims

1. In combination with an electronic component, a contact structure, comprising:

a post component;

a beam component joined to the post component; and

a tip component joined to the beam component.

2. A contact structure, according to claim 1, wherein:

the beam component is elongate, has a one end and an opposite end;

the post component is joined to the one end of the beam component; and

the tip component is joined to the opposite end of the beam component.

3. A contact structure, according to claim 1, wherein:

the beam component has a one surface and an opposite surface;

the post component is joined to the one surface of the beam component; and

the tip component is joined to the opposite surface of the beam component.

4. A contact structure, according to claim 1, wherein:

the beam component is elongate, has a one end, has an opposite end, has a one surface and has an opposite surface;

the post component is joined to the one end and to the one surface of the beam component; and

the tip component is joined to the opposite end and to the opposite surface of the beam component.

5. A contact structure, according to claim 1, wherein:

the post component is joined to an electronic component.

6. A contact structure, according to claim 1, further comprising an electronic component with a terminal, wherein:

the post component is joined to a terminal of the electronic component.

7. A contact structure, according to claim 1, further comprising an electronic component wherein:

the post component is built up upon the electronic component.

8. A contact structure, according to claim 1, further comprising an electronic component with a terminal, wherein:

the post component is built up upon a terminal of the electronic component.

9. A contact structure, according to claim 1, wherein:

the contact structure is a spring contact element.

10. An electronic component, according to claim 1, further comprising a second contact structure according to claim 1 mounted thereon, wherein:

a spacing between the tip components of the two contact structures is different than a spacing between the post components of the two contact structures.

11. An electronic component, according to claim 1, further comprising a second contact structure according to claim 1 mounted thereon, wherein:

the beam component of a one of the two contact structures is disposed at a different height from a surface of the electronic component than the beam component of another of the two contact structures.

12. A method of mounting a microelectronic contact structure to an electronic component, comprising:

providing a post component on an electronic component;

fabricating a beam component;

fabricating a tip component;

joining the beam component to the post component; and

joining the tip component to the beam component.

13. Method, according to claim 12, further comprising providing the post component on the electronic component by:

fabricating a the post component on a sacrificial substrate;

joining the post component to the electronic component; and

removing the sacrificial substrate.

14. Method, according to claim 12, wherein:

the beam component is fabricated on a sacrificial substrate; and

further comprising joining the beam component to the post component by;

joining the beam component to the post component; and

removing the sacrificial substrate.

15. Method, according to claim 12, wherein:

the tip component is fabricated on a sacrificial substrate; and

further comprising joining the tip component to the beam component by;

joining the tip component to the beam component; and

removing the sacrificial substrate.

16. Method, according to claim 12, wherein:

the post component is built up upon the electronic component.

17. Method, according to claim 12, wherein:

the beam component is elongate, has a one end and an opposite end;

joining the post component to the one end of the beam component; and

joining the tip component to the opposite end of the beam component.

18. Method, according to claim 12, wherein:

the beam component has a one surface and an opposite surface;

joining the post component to the one surface of the beam component; and

joining the tip component to the opposite surface of the beam component.

19. Method, according to claim 12, wherein:

the beam component is elongate, has a one end, has an opposite end, has a one surface and has an opposite surface;

joining the post component to the one end and to the one surface of the beam component; and

joining the tip component to the opposite end and to the opposite surface of the beam component.

20. Method of mounting two microelectronic contact structures to an electronic component, comprising, for each microelectronic contact structure:

providing a post component on an electronic component;

fabricating a beam component;

fabricating a tip component;

joining the beam component to the post component; and

joining the tip component to the beam component;

further comprising;

disposing the beam of a one of the two microelectronic contact structures at a different height from a surface of the electronic component than the beam component of another of the two microelectronic contact structures.