Microelectronic contact structures, and methods of making same
First Claim
1. In combination with an electronic component, a contact structure, comprising:
- a post component;
a beam component joined to the post component; and
a tip component joined to the beam component.
1 Assignment
0 Petitions
Accused Products
Abstract
Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.
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Citations
20 Claims
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1. In combination with an electronic component, a contact structure, comprising:
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a post component;
a beam component joined to the post component; and
a tip component joined to the beam component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of mounting a microelectronic contact structure to an electronic component, comprising:
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providing a post component on an electronic component;
fabricating a beam component;
fabricating a tip component;
joining the beam component to the post component; and
joining the tip component to the beam component. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. Method of mounting two microelectronic contact structures to an electronic component, comprising, for each microelectronic contact structure:
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providing a post component on an electronic component;
fabricating a beam component;
fabricating a tip component;
joining the beam component to the post component; and
joining the tip component to the beam component;
further comprising;
disposing the beam of a one of the two microelectronic contact structures at a different height from a surface of the electronic component than the beam component of another of the two microelectronic contact structures.
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Specification