Vinyl ether resins for structural applications
First Claim
1. Cured parts or cured structural elements with a thickness of at least 1 mm obtainable by curing radically curable resin compositions, with the aid of a radicalforming system that is unstable in the temperature range from -20C to +110C, the radically curable resin compositions comprising at least (i) a resinous component with one or more vinyl ether group(s), and (ii) one or more reactive monomers as a solvent, characterized in that the resinous component with one or more vinyl ether group(s) in the curable resin composition Is a resin obtained by reaction of appropriate amounts of;
- a) a first compound (the HVE-compound) containing at least one hydroxyl group and at least one vinyl ether group, and b) a second compound (the D/HIC—
compound), being a dilsocyanate (or higher isocyanate), reacting with formation of one or more urethane group(s), and c) a third compound (the G/P/HP-compound) chosen from the groups of (1) C24 glycols, (2) C5-20 polyols having 2-5 hydroxyl groups and (3) saturated or (ethylenically) unsaturated hydroxyl terminated polyester compounds, not being alkyd resins, having 1-5 free hydroxyl groups and from 2-50 monomeric ester units (the G/P/HP-compound), or mixtures thereof, the content of vinyl ether groups in the resin composition being from 0.5 to 50 wt. %, calculated as the weight percentage of the HVE-compound relative to the total weight of the resin composition (excluding the weight of additives, fillers and the like), and the total acid number of the radically curable resin composition with the reactive monomer(s) being less than 10 mg of KOH per 9.
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Accused Products
Abstract
The invention relates to radically curable resin compositions comprising at least a resinous component with one or more vinyl ether group(s), and one or more reactive monomers, wherein said resinous component is obtained by reaction of a mixture of appropriate amounts of a) a compound containing at least one hydroxyl group and at least one vinyl ether group; b) a diisocyanate (or higher isocyanate) compound, reacting with formation of one or more urethane group(s); and c) a compound chosen from the groups of C2-6 glycols, C5-20 polyols having 2-5 hydroxyl groups and (un)saturated hydroxyl terminated polyester compounds, with 1-5 free hydroxyl groups and from 2-50 monomeric ester units, the content of vinyl ether groups in the resin composition being from 0.5 to 50 wt. %, calculated as the weight percentage of the HVE-compound relative to the total weight of the resin composition (excluding the weight of additives, fillers and the like), the total acid number of the radically curable resin composition being less than 10 mg of KOH per g, and wherein the curing is effected with the aid of a radical-forming system that is unstable in the temperature range from −20° C. to +110° C.
The invention also relates to a process for the preparation of such resin compositions and uses thereof.
29 Citations
12 Claims
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1. Cured parts or cured structural elements with a thickness of at least 1 mm obtainable by curing radically curable resin compositions, with the aid of a radicalforming system that is unstable in the temperature range from -20C to +110C, the radically curable resin compositions comprising at least (i) a resinous component with one or more vinyl ether group(s), and (ii) one or more reactive monomers as a solvent, characterized in that
the resinous component with one or more vinyl ether group(s) in the curable resin composition Is a resin obtained by reaction of appropriate amounts of; -
a) a first compound (the HVE-compound) containing at least one hydroxyl group and at least one vinyl ether group, and b) a second compound (the D/HIC—
compound), being a dilsocyanate (or higher isocyanate), reacting with formation of one or more urethane group(s), andc) a third compound (the G/P/HP-compound) chosen from the groups of (1) C24 glycols, (2) C5-20 polyols having 2-5 hydroxyl groups and (3) saturated or (ethylenically) unsaturated hydroxyl terminated polyester compounds, not being alkyd resins, having 1-5 free hydroxyl groups and from 2-50 monomeric ester units (the G/P/HP-compound), or mixtures thereof, the content of vinyl ether groups in the resin composition being from 0.5 to 50 wt. %, calculated as the weight percentage of the HVE-compound relative to the total weight of the resin composition (excluding the weight of additives, fillers and the like), and the total acid number of the radically curable resin composition with the reactive monomer(s) being less than 10 mg of KOH per 9. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. Process for the preparation of a radically curable resin composition for being cured to cured parts or cured structural elements with a thickness of at least 1 mm with the aid of a radical-forming system that is unstable in the temperature range from −
- 20°
C. to +110°
C., which composition comprises at least (i) a resinous component with one or more vinyl ether group(s), and (ii) one or more other reactive monomers, characterized in thatA. first there are reacted, in a mixture of appropriate amounts of (a) a first compound (the HVE-compound) containing at least one hydroxyl group and at least one vinyl ether group, and (b) a second compound (the D/HIC-compound), being a diisocyanate (or higher isocyanate), reacting with formation of one or more urethane group(s), and (c) a third compound (the G/P/HP-compound) chosen from the groups of (1) C2-6 glycols, (2) C5-20 polyols having 2-5 hydroxyl groups and (3) saturated or (ethylenically) unsaturated hydroxyl terminated polyester compounds, not being alkyd resins, having 1-5 free hydroxyl groups and from 2-50 monomeric ester units (the G/PlHP-compound), or mixtures thereof, thereby obtaining a resinous component with one or more vinyl ether group(s) and at least two urethane groups, wherein the content of vinyl ether groups in the resin composition is from 0.5 to 50 wt. %, calculated as the weight percentage of the HVE-compound relative to the total weight of the resin composition (excluding the weight of additives, fillers and the like), and B. dissolving said resin in one or more reactive monomers, C. and adding any fillers and/or additives that may be required, with the proviso that the total acid number of the, optionally unsaturated, prepolymer so obtained is less than 10 mg of KOH per g (as determined according to ISO-2114). - View Dependent Claims (10, 11, 12)
- 20°
Specification