Decoupling capacitor closely coupled with integrated circuit
First Claim
1. An integrated circuit chip module comprising:
- a substrate;
an integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate;
a plurality of substrate bonding pads positioned on the substrate adjacent the integrated circuit die; and
a decoupling capacitor assembly mounted on each integrated circuit die, said decoupling capacitor assembly comprising a capacitor carrier secured onto the exposed surface of the integrated circuit die, and a decoupling capacitor carried by the capacitor carrier; and
a wire bond extending from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
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Accused Products
Abstract
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
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Citations
37 Claims
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1. An integrated circuit chip module comprising:
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a substrate;
an integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate;
a plurality of substrate bonding pads positioned on the substrate adjacent the integrated circuit die; and
a decoupling capacitor assembly mounted on each integrated circuit die, said decoupling capacitor assembly comprising a capacitor carrier secured onto the exposed surface of the integrated circuit die, and a decoupling capacitor carried by the capacitor carrier; and
a wire bond extending from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An integrated circuit chip module comprising:
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a substrate;
an integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate;
a plurality of substrate bonding pads positioned on the substrate adjacent the integrated circuit die; and
a decoupling capacitor assembly mounted on the integrated circuit die, said decoupling capacitor assembly comprising a capacitor carrier secured onto the exposed surface of the integrated circuit die, a decoupling capacitor carried by said capacitor carrier;
a thin film metallization layer positioned on said capacitor carrier; and
a conductive adhesive layer engaging said decoupling capacitor and thin film metallization layer and securing said decoupling capacitor to said capacitor carrier;
a wire bond extending from the thin film metallization layer to a logic pin of the integrated circuit die and from a logic pin to a substrate bonding pad. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A multi-chip module comprising:
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a ceramic substrate;
a plurality of integrated circuit die mounted on the ceramic substrate, each integrated circuit die including die pads and an exposed surface opposite from the ceramic substrate;
a plurality of substrate bonding pads mounted on the substrate adjacent the plurality of integrated circuit die; and
a plurality of decoupling capacitor assemblies positioned on each integrated circuit die, each decoupling capacitor assembly comprising an aluminum nitride capacitor carrier secured onto the exposed surface of the integrated circuit die, and a decoupling capacitor carried by the capacitor carrier; and
at least one wire bond extending from each decoupling capacitor assembly to a logic pin and from a logic pin to a substrate bonding pad. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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28. A decoupling capacitor assembly used for decoupling integrated circuit die comprising:
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a capacitor carrier formed as an aluminum nitride substrate that is about 5 mil to about 50 mil thickness;
a decoupling capacitor carried by said capacitor carrier; and
an adhesive securing said decoupling capacitor to said capacitor carrier. - View Dependent Claims (29, 30, 31)
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32. A method of forming an integrated circuit chip module comprising the steps of:
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adhesively securing a decoupling capacitor onto a capacitor carrier to form a decoupling capacitor assembly;
adhesively securing the decoupling capacitor assembly onto an integrated circuit die that had been mounted onto a substrate; and
wire bonding from the decoupling capacitor assembly to the integrated circuit die and from the integrated circuit die onto substrate bonding pads positioned on the substrate. - View Dependent Claims (33, 34, 35, 36, 37)
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Specification