×

Linking to chemical array assemblies with metal layers

  • US 20040076963A1
  • Filed: 10/21/2002
  • Published: 04/22/2004
  • Est. Priority Date: 10/21/2002
  • Status: Active Grant
First Claim
Patent Images

1. A method of fabricating an array of multiple probes bonded to a front surface of a substrate at different features of the array, which substrate includes a metal layer, the method comprising:

  • (a) providing the substrate wherein the front surface displays functional groups;

    (b) contacting the front surface with linker molecules each having a group which binds the linker molecule to the front surface following a reaction with a surface displayed functional group, which reaction does not produce a reagent which attacks the metal layer; and

    (c) contacting the front surface with the probes or probe precursors to bind the probes or probe precursors to the front surface bound linker molecules and produce the array.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×