Sensor semiconductor package, provided with an insert, and method for making same

• US 20040077118A1
• Filed: 11/10/2003
• Published: 04/22/2004
• Est. Priority Date: 01/15/2001
• Status: Active Grant

• Current Assignee: STMicroelectronics SA (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SA (STMicroelectronics NV)
• Inventors: Prior, Christophe
• Granted Patent: US 7,095,123 B2
• Time in Patent Office: Days
• US Class Current: 438/51
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A semiconductor package includes a mounting and electrical connection plate, and a semiconductor component having front and rear surfaces and including a sensor. The rear surface of the semiconductor component is attached to the mounting and electrical connection plate and the front surface is attached to the sensor. An insert is adjacent the front face of the semiconductor component and the sensor and has an access passage for exposing the sensor. A plug is in the access passage of the insert. A body of encapsulation material surrounds the mounting and electrical connection plate, the semiconductor component and the insert.

Claims

1. A method of fabricating a semiconductor package, characterized in that it consists:

in placing, in an injection cavity (18) of an injection mold (21), a semiconductor component (5), a rear face of which is attached to a front face of mounting and electrical connection means (2) and a front face of which comprises a sensor (8), and an insert (11) that includes an open passage (14) lying in front of said sensor and provided with a plug (17) closing said passage and that has an end (13) bearing on the front face of said component, around said sensor, and a front face (22) bearing against a bottom (24) of said cavity,

and in injecting an encapsulation material (26) into said cavity so as to encapsulate said mounting and electrical connection means and, peripherally, said semiconductor component and said insert.

2. The method as claimed in claim 1, characterized in that it consists in placing an annular seal (40) constituting a spacer between said insert and said semiconductor component.

3. The method as claimed in either of claims 1 and 2, characterized in that it consists in placing in said injection cavity an insert fitted with centering fins (16) in this cavity.

4. The method as claimed in any one of claims 1 to 3, characterized in that it consists in placing in said injection cavity an insert fitted with a plug (17, 48) installed in its passage (14).

5. The method as claimed in any one of claims 1 to 4, characterized in that it consists, after demolding, in installing a transparent plug (27) in the passage of said insert.

6. A semiconductor package, obtained in particular by implementing the method according to any one of the preceding claims, characterized in that it comprises:

a semiconductor component (5), a rear face of which is attached to a front face of mounting and electrical connection means (2) and a front face of which comprises a sensor (8);

an insert (11) bearing on the front face of said optical component, around said sensor, and comprising an open passage (14) lying in front of said sensor;

a plug (17) installed in said passage of said insert; and

encapsulation means (26) for said mounting and electrical connection means, said semiconductor component and said insert, comprising an encapsulation material which surrounds this semiconductor component and this insert.

7. The package as claimed in claim 6, characterized in that said insert (34) bears on the front face of said optical component via an annular seal (40) constituting a spacer.

8. The package as claimed in either of claims 6 and 7, characterized in that said insert (11) is attached to the front face of said optical component by adhesive bonding.

9. The package as claimed in any one of claims 6 to 8, characterized in that said plug (27) is transparent.

10. The package as claimed in any one of claims 6 to 9, characterized in that said plug (48) is integrated in said insert.

11. The package as claimed in any one of claims 6 to 10, characterized in that said insert (11) comprises, in its front face, an annular groove (25).

12. The package as claimed in any one of claims 6 to 11, characterized in that said mounting and electrical connection means comprise a gate (2) having a platform or plate for mounting said semiconductor component and electrical connection leads extending outside the encapsulation material.

13. The package as claimed in any one of claims 6 to 12, characterized in that said mounting and electrical connection means comprise a mounting and electrical connection plate (33).

14. The package as claimed in either of claims 12 and 13, characterized in that the encapsulation material extends at least in front of said plate.