Manufacturing method for a wireless communication device and manufacturing apparatus
First Claim
1. A method of producing a wireless communication device, comprising:
- adjustably cutting a first tab for use as a first antenna element;
adjustably cutting a second tab for use as a second antenna element; and
securing said first and second tabs to a wireless communication chip, thereby forming a wireless communication device.
3 Assignments
0 Petitions
Accused Products
Abstract
A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.
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Citations
45 Claims
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1. A method of producing a wireless communication device, comprising:
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adjustably cutting a first tab for use as a first antenna element;
adjustably cutting a second tab for use as a second antenna element; and
securing said first and second tabs to a wireless communication chip, thereby forming a wireless communication device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of producing a wireless communication device, comprising:
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passing a conductive foil having a backing material through a first roller to generate a first cut;
passing the metal foil having a backing material through a second roller to generate a second cut thereby forming a first antenna element; and
passing the conductive foil having a backing material through a third roller to generate a third cut thereby forming a second antenna element. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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21. A method of forming a wireless communication device comprising:
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passing a tape comprising a plurality of tabs disposed thereon under a first roller and a second roller;
testing capacitance formed by said tabs;
varying the spacing between the first and second rollers; and
cutting two of the tabs to form antenna elements for the wireless communication device. - View Dependent Claims (22, 23, 24, 25)
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26. An apparatus for producing wireless communication devices, comprising:
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a plurality of rollers adapted to receive a production line;
means for cutting antenna elements from the production line; and
means for securing a wireless communication chip to said antenna elements and a substrate to form the wireless communication device. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. A method of preparing wireless communication chips for later processing, comprising:
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positioning a wireless communication chip in a container in carrier tape;
stripping a protective adhesive from the carrier tape;
passing the carrier tape over a roller; and
forcing the wireless communication chip into contact with an adhesive tape for later processing. - View Dependent Claims (39, 40)
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41. A method of preparing an antenna for use on a wireless communication device, comprising:
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passing a metal foil on an adhesive backing through a pair of rollers, one of said pair being a die cut roller;
die-cutting the metal foil with the die cut roller into a pair of antenna tabs;
removing unused foil from the adhesive backing; and
passing the adhesive backing with the antenna tabs positioned thereon downstream for securement to a substrate. - View Dependent Claims (42, 43, 44)
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45. A method of preparing an antenna for use on a wireless communication device, comprising:
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passing a metal foil through a pair of rollers, one of said pair being a die cut roller;
die-cutting the metal foil with the die cut roller into a pair of antenna tabs; and
passing the antenna tabs downstream for securement to a substrate.
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Specification