×

Field replaceable packaged refrigeration module with capillary pumped loop for cooling electronic components

  • US 20040079100A1
  • Filed: 10/25/2002
  • Published: 04/29/2004
  • Est. Priority Date: 10/25/2002
  • Status: Abandoned Application
First Claim
Patent Images

1. A packaged refrigeration module with capillary pumped loop for cooling electronic components, said packaged refrigeration module with capillary pumped loop comprising:

  • a packaged refrigeration module, said packaged refrigeration module comprising;

    a packaged refrigeration module housing;

    refrigerant;

    a compressor;

    a condenser;

    an evaporator; and

    an expansion device;

    wherein, said compressor, said condenser, said evaporator and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and

    a capillary pumped loop, said capillary pumped loop being operatively coupled to said packaged refrigeration module refrigeration loop.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×