Field replaceable packaged refrigeration module with capillary pumped loop for cooling electronic components

• US 20040079100A1
• Filed: 10/25/2002
• Published: 04/29/2004
• Est. Priority Date: 10/25/2002
• Status: Abandoned Application

• Current Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Monfarad, Ali Heydari
• Application Number:
  US10/280,923
• Publication Number:
  US 20040079100A1
• Time in Patent Office: Days
• US Class Current: 62/259.2
• CPC Class Codes: F04B 35/045 using solenoids
• CPC Class Codes: F25B 1/00 Compression machines, plants or systems with non-reversible cycle F25B3/00, F25B5/00, F25B6/00, F25B7/00, F25B9/00 take precedence
• CPC Class Codes: F25B 1/02 with compressor of reciprocating-piston type F25B1/005, F25B1/10 take precedence
• CPC Class Codes: F25B 1/04 with compressor of rotary type F25B1/005, F25B1/10 take precedence
• CPC Class Codes: F25B 23/006 boiling cooling systems
• CPC Class Codes: F25B 2400/073 Linear compressors
• CPC Class Codes: F25B 2400/21 Modules for refrigeration systems
• CPC Class Codes: F25B 25/005 using primary and secondary systems
• CPC Class Codes: F25B 2500/01 Geometry problems, e.g. for reducing size
• CPC Class Codes: F25B 2500/17 Size reduction
• CPC Class Codes: F25B 39/022 with plate-like or laminated elements
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A field and/or customer replaceable packaged refrigeration module with capillary pumped loop is suitable for use in standard electronic component environments. The field replaceable packaged refrigeration module portion is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. The field replaceable packaged refrigeration module is coupled to a capillary pumped loop and serves to lower the base temperature of the capillary pumped loop sub-system, thereby allowing intermittent operation of the field replaceable packaged refrigeration module with the capillary pumped loop sub-system.

Claims

1. A packaged refrigeration module with capillary pumped loop for cooling electronic components, said packaged refrigeration module with capillary pumped loop comprising:

a packaged refrigeration module, said packaged refrigeration module comprising;

a packaged refrigeration module housing;

refrigerant;

a compressor;

a condenser;

an evaporator; and

an expansion device;

wherein,

said compressor, said condenser, said evaporator and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and

a capillary pumped loop, said capillary pumped loop being operatively coupled to said packaged refrigeration module refrigeration loop.

2. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.

3. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a single piston linear compressor.

4. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a dual-piston linear compressor.

5. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a multi-piston linear compressor.

6. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a rotary compressor.

7. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a reciprocating compressor.

8. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a rolling piston compressor.

9. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a rotary vane compressor.

10. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a screw compressor.

11. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a swash-plate compressor.

12. The packaged refrigeration module with capillary pumped loop of claim 1;

wherein,

said compressor is a scroll compressor.

13. A circuit board, said circuit board comprising:

at least one electronic component;

a packaged refrigeration module for cooling said electronic component, said packaged refrigeration module comprising;

a packaged refrigeration module housing;

refrigerant;

a compressor;

a condenser;

an evaporator;

an expansion device;

wherein,

said compressor, said condenser, said evaporator and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and

a capillary pumped loop, said capillary pumped loop being operatively coupled to said packaged refrigeration module refrigeration loop;

wherein,

said capillary pumped loop includes a capillary pumped loop reservoir, said capillary pumped loop evaporator reservoir being thermally coupled to said packaged refrigeration module evaporator;

further wherein,

said packaged refrigeration module evaporator is mounted directly over a first surface of said electronic component.

14. The circuit board of claim 13;

wherein,

said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches

15. The circuit board of claim 13;

wherein,

said compressor is a single piston linear compressor.

16. The circuit board of claim 13;

wherein,

said compressor is a dual-piston linear compressor.

17. The circuit board of claim 13;

wherein,

said compressor is a multi-piston linear compressor.

18. The circuit board of claim 13;

wherein,

said compressor is a rotary compressor.

19. The circuit board of claim 13;

wherein,

said compressor is a reciprocating compressor.

20. The circuit board of claim 13;

wherein,

said compressor is a rolling piston compressor.

21. The circuit board of claim 13;

wherein,

said compressor is a rotary vane compressor.

22. The circuit board of claim 13;

wherein,

said compressor is a screw compressor.

23. The circuit board of claim 13;

wherein,

said compressor is a swash-plate compressor.

24. The circuit board of claim 13;

wherein,

said compressor is a scroll compressor.

25. The circuit board of claim 13;

wherein,

said electronic component is an integrated circuit.

26. The circuit board of claim 13;

wherein,

said electronic component is a microprocessor.

27. An electronic system, said electronic system comprising:

a rack unit, said rack unit comprising;

at least one electronic component;

a packaged refrigeration module, said packaged refrigeration module comprising;

a packaged refrigeration module housing;

refrigerant;

a compressor;

a condenser;

an evaporator;

an expansion device;

wherein,

said compressor, said condenser, and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and

a capillary pumped loop, said capillary pumped loop being operatively coupled to said packaged refrigeration module refrigeration loop;

wherein,

said capillary pumped loop includes a capillary pumped loop reservoir, said capillary pumped loop evaporator reservoir being thermally coupled to said packaged refrigeration module evaporator;

further wherein,

said packaged refrigeration module evaporator is mounted directly over a first surface of said electronic component.

28. The electronic system of claim 27;

wherein,

said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.

29. The electronic system of claim 27;

wherein,

said compressor is a single piston linear compressor.

30. The electronic system of claim 27;

wherein,

said compressor is a dual-piston linear compressor.

31. The electronic system of claim 27;

wherein,

said compressor is a multi-piston linear compressor.

32. The electronic system of claim 27;

wherein,

said compressor is a rotary compressor.

33. The electronic system of claim 27;

wherein,

said compressor is a reciprocating compressor.

34. The electronic system of claim 27;

wherein,

said compressor is a rolling piston compressor.

35. The electronic system of claim 27;

wherein,

said compressor is a rotary vane compressor.

36. The electronic system of claim 27;

wherein,

said compressor is a screw compressor.

37. The electronic system of claim 27;

wherein,

said compressor is a swash-plate compressor.

38. The electronic system of claim 27;

wherein,

said compressor is a scroll compressor.

39. The electronic system of claim 27;

wherein,

said electronic component is an integrated circuit.

40. The electronic system of claim 27;

wherein,

said electronic component is a microprocessor.