Conductive metal particles, conductive composite metal particles and applied products using the same

• US 20040079193A1
• Filed: 09/15/2003
• Published: 04/29/2004
• Est. Priority Date: 09/29/2000
• Status: Active Grant

• Current Assignee: ISC Incorporated (Svenska Cellulosa AB)
• Original Assignee: JSR Corporation
• Inventors: Kokubo, Terukazu, Yanadori, Naoki
• Granted Patent: US 6,926,751 B2
• Time in Patent Office: Days
• US Class Current: 75/252
• CPC Class Codes: H01B 1/02 mainly consisting of metals or alloys
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/31 Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01016 Sulfur [S]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01026 : Iron [Fe]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01043 : Technetium [Tc]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/0134 : Quaternary Alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01R 12/52 : connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 1/095 : for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 7/1061 : co-operating by abutting
• CPC Class Codes: Y10T 428/12181 : Composite powder [e.g., coated, etc.]
• CPC Class Codes: Y10T 428/2991 : Coated

Abstract

Disclosed are provides conductive metal particles and conductive composite metal particles by which conductive materials having stable conductivity can be provided, and applied product thereof.

The conductive metal particles have a number average particle diameter of 5 to 100 μm, a BET specific surface area of 0.01×10³ to 0.7×10³ m²/kg, a sulfur element content of at most 0.1% by mass, an oxygen element content of at most 0.5% by mass and a carbon element content of at most 0.1% by mass. The conductive composite metal particles are obtained by coating the surfaces of the conductive metal particles with a high-conductive metal.

Claims

1. Conductive metal particles having a number average particle diameter of 5 to 100 μ

m, a BET specific surface area of 0.01×

10³ to 0.7×

10³ m²/kg, a sulfur element content of at most 0.1% by mass, an oxygen element content of at most 0.5% by mass and a carbon element content of at most 0.1% by mass.

2. The conductive metal particles according to claim 1, wherein the coefficient of variation of the particle diameter is at most 50%.

3. The conductive metal particles according to claim 1, wherein the saturation magnetization of the particles is at least 0.1 Wb/m².

4. Conductive composite metal particles obtained by coating the surfaces of the conductive metal particles according to claim 1 with a high-conductive metal.

5. The conductive composite metal particles according to claim 4, wherein the thickness t of the coating layer of the high-conductive metal, which is calculated out in accordance with the following numerical expression, is at least 10 nm:

t=[1/(Sw·

ρ

)]×

(N/(1−

N)]

wherein t is the thickness (nm) of the coating layer of the high-conductive metal, Sw is the BET specific surface area (m²/kg) of the conductive metal particles, ρ

is a specific gravity (kg/m³) of the high-conductive metal, and N is a ratio of a weight of the coating layer of the high-conductive metal to a weight of the conductive composite metal particles.

6. The conductive composite metal particles according to claim 5, wherein the high-conductive metal is gold.

7. The conductive composite metal particles according to claim 5, wherein the content of the high-conductive metal in each surface layer portion of the conductive composite metal particles is at least 50% by mass.

8. The conductive composite metal particles according to claim 5, wherein the BET specific surface area of the conductive composite metal particles is 0.01×

10³ to 0.7×

10³ m²/kg.

9. The conductive composite metal particles according to claim 8, wherein the composite metal particles are obtained by coating the surfaces of the conductive metal particles whose saturation magnetization is at least 0.1 Wb/m² with the high-conductive metal, and the electric resistance value R as measured in the following manner is at most 1 Ω

;

Electric resistance value;

A paste composition is prepared by kneading 0.6 g of the conductive composite metal particles with 0.8 g of liquid rubber, the paste composition is arranged between a pair of electrodes each having a diameter of 1 mm and arranged so as to be opposed to each other at a clearance of 0.5 mm, a magnetic field of 0.3 T is applied to this pair of electrodes, and the pair of electrodes are left to stand in this state until the electric resistance value between the pair of electrodes is stabilized, thereby measuring an electric resistance value at this time.

10. A conductive paste composition comprising the conductive composite metal particles according to claim 3 or 9.

11. A conductive sheet comprising the conductive composite metal particles according to claim 3 or 9 in an organic polymeric substance.

12. A circuit board comprising a conductor containing the conductive composite metal particles according to claim 3 or 9 in an organic polymeric substance.

13. A conductive connection structure connected by a connecting member formed by the conductive paste composition according to claim 10.

14. A conductive connection structure connected through the conductive sheet according to claim 11.

15. An electrical inspection apparatus for circuit devices, comprising the conductive sheet according to claim 11, wherein electrical connection to electrodes to be inspected of a circuit device to be inspected is achieved through the conductive sheet.