Manufacturing method for electric device
First Claim
1. A method of manufacturing an electric device including a bonding step wherein a semiconductor chip and a substrate are aligned so that a connection terminal on the semiconductor chip and a connection terminal on the substrate face each other, the semiconductor chip is placed onto an adhesive applied on the substrate, and heat is applied while pressing the semiconductor chip so as to connect the opposing connection terminals to each other, the bonding step including the steps of:
- a temporary bonding step of pressing the semiconductor chip onto the adhesive in a state wherein the adhesive is heated to a first temperature; and
a permanent bonding step of heating the adhesive to a second temperature higher than the first temperature while applying pressure to the semiconductor chip, wherein when the semiconductor chip is pressed onto the adhesive in the temporary bonding step, pressure is applied to the semiconductor chip to an extent that does not cause the opposing connection terminals to be in contact with each other.
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Abstract
The present invention provides a method of manufacturing an electric device, wherein an adhesive applied on a flexible wiring board is heated to a first temperature to lower its viscosity to a sufficient level, after which a semiconductor chip is placed onto the adhesive at a preset location, so that no air is trapped in the adhesive. The adhesive is heated to a second temperature higher than the first temperature in a permanent bonding step to increase its viscosity, whereby any remaining voids are removed with residual adhesive being pushed aside. Having no voids in the adhesive, the resultant electric device is highly reliable in respect of conductivity.
121 Citations
13 Claims
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1. A method of manufacturing an electric device including a bonding step wherein a semiconductor chip and a substrate are aligned so that a connection terminal on the semiconductor chip and a connection terminal on the substrate face each other, the semiconductor chip is placed onto an adhesive applied on the substrate, and heat is applied while pressing the semiconductor chip so as to connect the opposing connection terminals to each other, the bonding step including the steps of:
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a temporary bonding step of pressing the semiconductor chip onto the adhesive in a state wherein the adhesive is heated to a first temperature; and
a permanent bonding step of heating the adhesive to a second temperature higher than the first temperature while applying pressure to the semiconductor chip, wherein when the semiconductor chip is pressed onto the adhesive in the temporary bonding step, pressure is applied to the semiconductor chip to an extent that does not cause the opposing connection terminals to be in contact with each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification