×

Manufacturing method for electric device

  • US 20040079464A1
  • Filed: 08/25/2003
  • Published: 04/29/2004
  • Est. Priority Date: 02/26/2001
  • Status: Active Grant
First Claim
Patent Images

1. A method of manufacturing an electric device including a bonding step wherein a semiconductor chip and a substrate are aligned so that a connection terminal on the semiconductor chip and a connection terminal on the substrate face each other, the semiconductor chip is placed onto an adhesive applied on the substrate, and heat is applied while pressing the semiconductor chip so as to connect the opposing connection terminals to each other, the bonding step including the steps of:

  • a temporary bonding step of pressing the semiconductor chip onto the adhesive in a state wherein the adhesive is heated to a first temperature; and

    a permanent bonding step of heating the adhesive to a second temperature higher than the first temperature while applying pressure to the semiconductor chip, wherein when the semiconductor chip is pressed onto the adhesive in the temporary bonding step, pressure is applied to the semiconductor chip to an extent that does not cause the opposing connection terminals to be in contact with each other.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×