Back side incident type image pickup sensor

• US 20040079865A1
• Filed: 09/30/2003
• Published: 04/29/2004
• Est. Priority Date: 10/09/2002
• Status: Abandoned Application

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Hoshi, Junichi
• Application Number:
  US10/673,289
• Publication Number:
  US 20040079865A1
• Time in Patent Office: Days
• US Class Current: 250/214.1
• CPC Class Codes: G01J 1/0209 Monolithic
• CPC Class Codes: G01J 1/04 Optical or mechanical part supplementary adjustable parts
• CPC Class Codes: G01J 1/0407 Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
• CPC Class Codes: G01J 1/42 using electric radiation detectors optical or mechanical part G01J1/04; by comparison with a reference light or electric value G01J1/10
• CPC Class Codes: G01T 1/20183 Arrangements for preventing or correcting crosstalk, e.g. optical or electrical arrangements for correcting crosstalk
• CPC Class Codes: H01L 27/14603 Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A back side incident type image pickup sensor in which lowering of spatial resolution is eliminated and influence of stray light is removed is provided. Electric circuits including a driver circuit for driving a photoelectric conversion portion and a signal processing circuit for processing signals from the photoelectric conversion portion are each placed on the front side of a single crystal silicon substrate at a given distance in the horizontal direction from an opening. Influence of stray light is thus eliminated. The semiconductor substrate has high refractive index, thereby essentially allowing little lowering of spatial resolution. Lowering of spatial resolution is further prevented if the substrate is thinned.

Claims

1. A back side incident type image pickup sensor having on the front side of a semiconductor substrate a photoelectric conversion portion and an electric circuit, and having on the back side of the semiconductor substrate an opening through which a radiation beam is incident, the incident radiation beam being detected by the photoelectric conversion portion formed on the front side of the semiconductor substrate, wherein the electric circuit is disposed at a given distance in the horizontal direction from the opening.

2. A back side incident type image pickup sensor according to claim 1, wherein the semiconductor substrate is a single crystal silicon substrate.

3. A back side incident type image pickup sensor according to claim 1, wherein the semiconductor substrate is reduced in thickness after a semiconductor integrated circuit that constitutes the photoelectric conversion portion is formed.

4. A back side incident type image pickup sensor according to claim 1, wherein the radiation beam is infrared light.

5. A back side incident type image pickup sensor according to claim 4, wherein the infrared light has a wavelength in a range of 975 to 1150 nm.

6. A back side incident type image pickup sensor according to claim 1, wherein the radiation beam is an X-ray.

7. A back side incident type image pickup sensor according to claim 1, wherein the photoelectric conversion portion is composed of a photodiode.

8. A back side incident type image pickup sensor according to claim 1, wherein the electric circuit serves as one of a driver circuit for driving the photoelectric conversion portion and a signal processing circuit for processing a signal from the photoelectric conversion portion.

9. A back side incident type image pickup sensor according to claim 1, wherein the given distance is 0.303 times the thickness of the semiconductor substrate or more.

10. A back side incident type image pickup sensor according to claim 1, wherein the given distance is 50 μ

m or more.

11. A back side incident type image pickup sensor according to claim 1, wherein a dummy pixel is formed in an offset portion between the electric circuit on the front side of the semiconductor substrate and the opening.

12. A back side incident type image pickup sensor according to claim 1, wherein a diffusion region for absorbing electric charges is formed in the offset portion between the electric circuit on the front side of the semiconductor substrate and the opening.