Power surface mount light emitting die package
First Claim
1. A light emitting die package comprising:
- a substrate comprising an electrically and thermally conductive material and having a first surface;
a thermally conductive, electrically insulating film covering at least a portion of said first surface;
a first conductive element on said insulating film, said conductive element insulated from said substrate by said insulating film;
a second conductive element on said insulating film, said second conductive element spaced apart from said first conductive element and electrically insulated from said substrate by said insulating film wherein at least one of said first and second conductive elements comprises a mounting pad for mounting a light emitting die thereon;
a reflector plate coupled to said substrate and substantially surrounding the mounting pad; and
a lens substantially covering the mounting pad.
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Accused Products
Abstract
A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conductive. In embodiments wherein the substrate is made from an electrically conductive material, the substrate further includes an electrically insulating, thermally conductive material formed on the electrically conductive material. The substrate has traces for connecting to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens substantially covers the mounting pad. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.
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Citations
27 Claims
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1. A light emitting die package comprising:
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a substrate comprising an electrically and thermally conductive material and having a first surface;
a thermally conductive, electrically insulating film covering at least a portion of said first surface;
a first conductive element on said insulating film, said conductive element insulated from said substrate by said insulating film;
a second conductive element on said insulating film, said second conductive element spaced apart from said first conductive element and electrically insulated from said substrate by said insulating film wherein at least one of said first and second conductive elements comprises a mounting pad for mounting a light emitting die thereon;
a reflector plate coupled to said substrate and substantially surrounding the mounting pad; and
a lens substantially covering the mounting pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A light emitting die package comprising:
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a metal substrate having a first surface;
an electrically insulating film covering at least a portion of said first surface;
a first conductive trace on said insulating film, said conductive trace insulated from said substrate by said insulating film;
a mounting pad for mounting a light emitting device, said mounting pad electrically connected to said first conductive trace;
a reflector plate coupled to said substrate and substantially surrounding the mounting pad; and
a lens substantially covering the mounting pad.
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26. A light emitting die package comprising:
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a metal substrate having a first surface;
a conductive trace on said first surface, said conductive trace insulated from said metal substrate by an insulating film;
said conductive trace forming a mounting pad for mounting a light emitting device; and
a metal lead electrically connected to said conductive trace and extending away from said first surface.
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27. A light emitting die package comprising:
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a metal substrate having a first surface and a second surface opposite said first surface;
a via hole through said substrate;
a conductive trace extending from said first surface to said second surface, said conductive trace insulated from said metal substrate by insulating film; and
a metal contact pad on one of said first and second surfaces electrically connected to said conductive trace.
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Specification