Circuit substrate and fabrication method thereof
First Claim
Patent Images
1. A circuit substrate, comprising:
- a board having a plurality of conductive traces layers and insulating layers, and a via formed in the board;
a plurality of metal layers formed on an inner wall of the via, wherein each of the metal layers electrically connects to said corresponding conductive traces layer respectively; and
an insulator formed in the via to electrically isolate from each of the metal layers.
1 Assignment
0 Petitions
Accused Products
Abstract
A circuit substrate includes a board, a plurality of metal layers and an insulator. The board has a plurality of conductive traces layers and a via formed therein. The metal layers are formed on the inner wall of the via and each of the metal layers is electrically connected to its corresponding conductive traces layer. The via is filled with the insulator so that each of the metal layers is electrically isolated from each other. In addition, this invention also provides a fabrication method of the circuit substrate.
-
Citations
28 Claims
-
1. A circuit substrate, comprising:
-
a board having a plurality of conductive traces layers and insulating layers, and a via formed in the board;
a plurality of metal layers formed on an inner wall of the via, wherein each of the metal layers electrically connects to said corresponding conductive traces layer respectively; and
an insulator formed in the via to electrically isolate from each of the metal layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A fabrication method of a circuit substrate, comprising:
-
providing a board;
forming a via in the board;
forming a metal layer on an inner wall of the via;
cutting the via to form a cutting street to separate the metal layer into a plurality of separated metal layers; and
filling an insulator in the via and the cutting street. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
-
Specification