Method for forming metal pattern

• US 20040081762A1
• Filed: 09/04/2003
• Published: 04/29/2004
• Est. Priority Date: 03/26/2001
• Status: Abandoned Application

• Current Assignee: Nippon Paint Company Limited (Rainbow Light Limited)
• Original Assignee: Nippon Paint Company Limited (Rainbow Light Limited)
• Inventors: Tsushima, Hiroshi
• Application Number:
  US10/469,778
• Publication Number:
  US 20040081762A1
• Time in Patent Office: Days
• US Class Current: 427/304
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/16 in which all the silicon atoms are connected by linkages other than oxygen atoms
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1844 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/31 Coating with metals
• CPC Class Codes: C23C 18/54 Contact plating, i.e. electroless electrochemical plating
• CPC Class Codes: G03F 7/0757 Macromolecular compounds containing Si-O, Si-C or Si-N bonds G03F7/0752 takes precedence
• CPC Class Codes: G03F 7/265 Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H05K 3/185 by making a catalytic pattern by photo-imaging

Abstract

A method for forming a metal pattern on a substrate characterized in that a photosensitive resin composition comprising polysilane having weight-average molecular weight of 10000 or above and being soluble to an organic solvent, a photoradical generating agent, an oxidizing agent, a silicon compound containing alkoxy group, and organic solvent is applied onto the substrate to form a photosensitive layer, the photosensitive layer is exposed selectively to form a latent image part of the metal pattern, a liquid containing a salt or colloid of a metal having a standard electrode potential lower than that of a metal being deposited at the latent image part is touched to the photosensitive layer in order to adsorb a metal or metal colloid having a low standard electrode potential to the latent image part, and an electroless plating liquid is touched to the photosensitive layer in order to deposit a metal film on the latent image part where a metal or metal colloid having a low standard electrode potential is adsorbed thus forming a metal pattern.

Claims

1. A method of forming a metal pattern on a substrate characterized as including the steps of:

applying, to the substrate, a photosensitive resin composition containing polysilane soluble in an organic solvent and having a weight average molecular weight of 10,000 or higher, a photosensitive radical generator, an oxidizing agent, an alkoxy-containing silicone compound and an organic solvent to thereby provide a photosensitive layer;

selectively exposing said photosensitive layer to a radiation to form a latent image associated with a metal pattern;

contacting the photosensitive layer with a liquid containing a salt or colloid of a metal having a lower standard electrode potential so that said metal having a lower standard electrode potential or said metal colloid is adsorbed in said latent image portion; and

contacting the photosensitive layer with an electroless plating liquid so that a film of a metal having a higher standard electrode potential is deposited in the latent image portion where the metal having a lower standard electrode potential or the metal colloid has been adsorbed, thereby forming the metal pattern.

2. The method for forming a metal pattern as recited in claim 1, characterized in that said alkoxy-containing silicone compound is a silicone compound having a structure represented by the following general formula:

3. The method for forming a metal pattern as recited in claim 1 or 2, characterized in that said electroless plating liquid contains a metal ion of copper, nickel, palladium, gold, platinum or rhodium which forms said metal film when deposited.

4. The method for forming a metal pattern as recited in any one of claims 1-3, characterized in that said metal having a lower standard electrode potential is gold, silver, platinum or palladium.

5. The method for forming a metal pattern as recited in any one of claims 1-3, characterized in that said metal having a lower standard electrode potential is palladium.