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Chip with molded cap array

  • US 20040082104A1
  • Filed: 12/08/2003
  • Published: 04/29/2004
  • Est. Priority Date: 01/10/2001
  • Status: Active Grant
First Claim
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1. An individual chip with one or more protective polymeric wafer scale caps, made by a method, the method including:

  • a) forming, in a two part mold, an array of first hollow molded caps, from a layer of thermoplastic material which is placed in a mold, the mold having first and second mold halves which are brought together to form the caps, each cap having a central portion and a perimeter wall;

    b) opening the mold so that the caps are carried by the first half;

    c) applying, using the first half, the first caps to one side of a wafer;

    then d) separating the wafer into individual chips.

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