Chip with molded cap array
First Claim
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1. An individual chip with one or more protective polymeric wafer scale caps, made by a method, the method including:
- a) forming, in a two part mold, an array of first hollow molded caps, from a layer of thermoplastic material which is placed in a mold, the mold having first and second mold halves which are brought together to form the caps, each cap having a central portion and a perimeter wall;
b) opening the mold so that the caps are carried by the first half;
c) applying, using the first half, the first caps to one side of a wafer;
then d) separating the wafer into individual chips.
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Abstract
A chip is made by a method. The method provides an array of caps for protecting features on a semiconductor wafer. The array is fabricated by a novel method in which a two part mold is used. The array is made from a layer of thermoplastic material which is placed in the mold. Each cap in the array has a central portion and a perimeter wall. The mold is opened so that the array is carried by the first half. The array is applied to a wafer using the first half. After the arrays are applied, the wafer is separated into individual chips.
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Citations
19 Claims
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1. An individual chip with one or more protective polymeric wafer scale caps, made by a method, the method including:
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a) forming, in a two part mold, an array of first hollow molded caps, from a layer of thermoplastic material which is placed in a mold, the mold having first and second mold halves which are brought together to form the caps, each cap having a central portion and a perimeter wall;
b) opening the mold so that the caps are carried by the first half;
c) applying, using the first half, the first caps to one side of a wafer;
thend) separating the wafer into individual chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification