Molded wafer scale cap
First Claim
Patent Images
1. A wafer scale polymeric cap, made by a molding method, the method including:
- forming, in a two part mold, an array of first hollow molded caps, from a layer of thermoplastic material which is placed in the mold, the mold having first and second mold halves which are brought together to form the caps; and
separating the array into individual caps.
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Accused Products
Abstract
An array of caps is taught for protecting features on a semiconductor wafer. The array is fabricated by a novel method in which a two part mold is used. The array is made from a layer of thermoplastic material which is placed in the mold. Each cap in the array has a central portion and a perimeter wall. The mold is opened so that the array is carried by the first half. The array is applied to a wafer using the first half. After the arrays are applied, the wafer is separated into individual chips.
6 Citations
20 Claims
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1. A wafer scale polymeric cap, made by a molding method, the method including:
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forming, in a two part mold, an array of first hollow molded caps, from a layer of thermoplastic material which is placed in the mold, the mold having first and second mold halves which are brought together to form the caps; and
separating the array into individual caps. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification