Mold making method for wafer scale caps
First Claim
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1. A method of fabricating a mold for protective caps which will be applied to a wafer, the method comprising the steps of:
- fabricating a first and a second cooperating mold halves from a semiconductor material using lithography;
the first half and second halves, when brought together defining an array of mold cavities for an array of wafer scale protective caps.
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Abstract
Disclosed is a method for fabricating a mold. The mold is used for protective caps which will be applied to a wafer. The method comprises the steps of fabricating first and second cooperating mold halves from a semiconductor material using lithography. The first half and second half, when brought together define mold cavities for the wafer scale protective caps.
22 Citations
20 Claims
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1. A method of fabricating a mold for protective caps which will be applied to a wafer, the method comprising the steps of:
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fabricating a first and a second cooperating mold halves from a semiconductor material using lithography;
the first half and second halves, when brought together defining an array of mold cavities for an array of wafer scale protective caps. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification