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Mold making method for wafer scale caps

  • US 20040082115A1
  • Filed: 12/08/2003
  • Published: 04/29/2004
  • Est. Priority Date: 01/10/2001
  • Status: Active Grant
First Claim
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1. A method of fabricating a mold for protective caps which will be applied to a wafer, the method comprising the steps of:

  • fabricating a first and a second cooperating mold halves from a semiconductor material using lithography;

    the first half and second halves, when brought together defining an array of mold cavities for an array of wafer scale protective caps.

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