Substrate holder for retaining a substrate within a processing chamber
First Claim
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1. A wafer holder for retaining a substrate within a processing chamber comprising:
- an electrode; and
one or more layers covering a portion of the wafer holder in contact with the wafer where at least one of the layers is compliant.
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Abstract
A wafer chuck is designed to allow the substrate to thermally deform during charged particle beam lithography. The wafer chuck includes a compliant layer disposed over an chuck body. During lithography processing the wafer is electrostatically held in contact with a flexible compliant layer and the wafer is exposed to the charged particle beam resulting in thermal deformation of the wafer. The compliant layer deforms with the substrate and allows the wafer to deform in a predictable manner.
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Citations
40 Claims
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1. A wafer holder for retaining a substrate within a processing chamber comprising:
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an electrode; and
one or more layers covering a portion of the wafer holder in contact with the wafer where at least one of the layers is compliant. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An apparatus for projecting patterned charged particles onto a substrate comprising:
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a processing chamber;
a charged particle source for generating a charged particle beam that impinges on the substrate; and
an electrostatic chuck comprising an electrode and one or more layers covering a portion of the wafer holder in contact with the wafer where at least one of the layers is compliant. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method for patterning a photoresist layer on a substrate comprising the steps of:
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forming a photoresist layer on the substrate;
positioning the substrate on an electrostatic chuck having one or more layers covering a portion of the wafer chuck in contact with the wafer where at least one of the layers is compliant; and
exposing portions of the photoresist layer on the substrate to a charged particle beam;
- View Dependent Claims (20, 21, 22, 23, 24, 25)
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26. An electrostatic chuck for use in substrate processing, the chuck having an electrode covered by an insulative layer for receiving the substrate wherein the improvement comprises:
- the insulative layer which is elastic and can withstand 10% shear stress without exceeding the material yield strength.
- View Dependent Claims (27, 28)
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29. A method for holding a wafer on a chuck having an electrode and one or more layers covering a portion of the wafer holder in contact with the wafer where at least one of the layers is compliant comprising the steps of:
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placing the wafer on one of the layers of the chuck; and
energizing the electrode. - View Dependent Claims (30, 31, 32, 33, 34, 35)
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36. An apparatus for handling a substrate for use in semiconductor processing comprising:
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a wafer holder; and
one or more layers covering a portion of the wafer holder in contact with the wafer where at least one of the layers is compliant. - View Dependent Claims (37, 38, 39, 40)
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Specification