Planar and wafer level packaging of semiconductor lasers and photo detectors for transmitter optical sub-assemblies
First Claim
1. A method for packaging a surface emitting laser, the method comprising:
- attaching a laser to a first substrate, wherein the laser emits a laser beam from a surface of the laser;
attaching a photo detector to the first substrate, wherein the photo detector receives light from the laser; and
attaching a second substrate to the first substrate, wherein the first substrate and the 10 second substrate enclose the laser and the photo detector in a cavity, wherein one of the first substrate and the second substrate includes at least one lens element, and wherein the at least one lens element is constructed and positioned with respect to the laser to shape and direct the laser beam into a light guide.
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Abstract
A planar wafer-level packaging method is provided for a laser and a monitor photo detector. The laser and photo detector are affixed to a planar substrate. The planar substrate provides electrical connections to the components. A lens cap with a microlens is formed and affixed to the substrate with a seal. The lens cap forms a hermetically sealed cavity enclosing the laser and photo detector. The inside surface of the lens cap has a reflective coating with a central opening over the emitting aperture of the laser. The central opening has an anti-reflective coating. Light from the laser is directed and shaped by the lens cap to couple into an external light guide. Residual light from the edge of the laser reflects off the inside surface of the lens cap and is incident upon the photo detector. In an alternate method, the laser may be packaged using flip-chip assembly.
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Citations
41 Claims
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1. A method for packaging a surface emitting laser, the method comprising:
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attaching a laser to a first substrate, wherein the laser emits a laser beam from a surface of the laser;
attaching a photo detector to the first substrate, wherein the photo detector receives light from the laser; and
attaching a second substrate to the first substrate, wherein the first substrate and the 10 second substrate enclose the laser and the photo detector in a cavity, wherein one of the first substrate and the second substrate includes at least one lens element, and wherein the at least one lens element is constructed and positioned with respect to the laser to shape and direct the laser beam into a light guide. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for packaging a surface emitting laser, the method comprising:
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attaching a laser to a first substrate, wherein the laser emits a laser beam from a first edge of the laser;
attaching a photo detector to the first substrate, wherein the photo detector receives light from the laser;
attaching an interposer to the first substrate; and
attaching a second substrate to the interposer, wherein the first substrate, the interposer, and the second substrate enclose the laser and the photo detector in a cavity, wherein one of the first substrate and the second substrate includes at least one lens element, and wherein the at least one lens element is constructed and positioned with respect to the laser to receive the laser beam from the first edge of the laser via reflection from an inside surface of the interposer and to shape and direct the laser beam into a light guide. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A laser assembly, comprising:
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a first substrate;
a second substrate; and
a laser attached to the second substrate, wherein the laser emits a laser beam, wherein one of the first substrate and the second substrate has formed therein a lens element, wherein the first substrate and the second substrate form a sealed cavity enclosing the laser, and wherein the lens element directs and shapes the laser beam into a light guide. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A laser assembly, comprising:
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a substrate;
a laser attached to the substrate, wherein the laser emits at least one laser beam from a surface of the laser;
a photo detector attached to the substrate, wherein the photo detector receives light from an edge of the laser; and
a lens cap attached to the substrate, wherein the lens cap includes at least one lens element and wherein the substrate and the lens cap form a sealed cavity enclosing the laser and the photo detector, wherein substrate provides electrical connections from a portion of the substrate inside the sealed cavity to a portion of the substrate outside the sealed cavity, and wherein the at least one lens element is constructed and positioned with respect to the laser to shape and direct the at least one laser beam into at least one light guide.
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41. A laser assembly, comprising:
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a substrate;
a laser attached to a bottom surface of the substrate, wherein the laser emits at least one laser beam from a surface of the laser;
a photo detector attached to the bottom surface of the substrate, wherein the photo detector receives light from an edge of the laser; and
a cap attached to the substrate, wherein the substrate and the cap form a sealed cavity enclosing the laser and the photo detector, wherein the substrate includes at least one lens element on a top surface of the substrate, wherein substrate provides electrical connections from a portion of the substrate inside the sealed cavity to a portion of the substrate outside the sealed cavity, and wherein the at least one lens element is constructed and positioned with respect to the laser to shape and direct the at least one laser beam into at least one light guide.
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Specification