Non-volatile memory device to protect floating gate from charge loss and method for fabricating the same
First Claim
1. A method for fabricating a non-volatile memory device, the method comprising:
- forming at least a pair of floating gate lines on a semiconductor substrate, the pair of floating gate lines defining a gap therebetween;
etching a portion of the substrate between the pair of floating gate lines to form a trench therein;
forming a gap-fill dielectric layer in the trench and also in the gap; and
implanting the gap-fill dielectric layer.
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Abstract
Disclosed are a non-volatile memory device to protect a floating gate from charge loss and a method for forming the same. At least a pair of floating gate lines are formed on a semiconductor substrate. A portion of the substrate between the floating gate lines is etched to form a trench therein. A gap-fill dielectric layer is formed in the trench and also in the gap between the pair of floating gate lines. The gap-fill dielectric layer is implanted with impurities so that positive mobile ions that may permeate the floating gate through the gap-fill dielectric layer can be trapped in the gap-fill dielectric layer.
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Citations
19 Claims
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1. A method for fabricating a non-volatile memory device, the method comprising:
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forming at least a pair of floating gate lines on a semiconductor substrate, the pair of floating gate lines defining a gap therebetween;
etching a portion of the substrate between the pair of floating gate lines to form a trench therein;
forming a gap-fill dielectric layer in the trench and also in the gap; and
implanting the gap-fill dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for fabricating a non-volatile memory device, the method comprising:
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forming at least a pair of lower floating gate lines on a substrate having a tunnel dielectric layer formed thereon, the pair of lower floating gate lines defining a gap therebetween;
forming a polishing stop layer pattern on the lower floating gate lines;
etching a portion of the substrate between the pair of lower floating gate lines to form a trench therein;
forming a gap-fill dielectric layer in the trench and also in the gap;
removing the polishing stop layer pattern to expose surface of the pair of lower floating gate lines;
forming a upper floating gate conductive layer on the exposed lower floating gate lines and on the gap-fill dielectric layer;
forming a hard mask layer pattern on the upper floating gate conductive layer;
etching a portion of the upper floating gate conductive layer, until the gap-fill dielectric layer is exposed, to form upper floating gate lines on the lower floating gate lines, using the hard mask layer pattern as an etch mask;
removing the hard mask layer pattern;
forming an inter-gate dielectric layer on the upper floating gate lines and on the gap-fill dielectric layer;
forming a conductive layer on the inter-gate dielectric layer;
patterning the conductive layer, the upper floating gate lines, and the lower floating gate lines to form a word line and a floating gate; and
implanting the gap-fill dielectric layer with impurities. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification