Electrode assembly for a microstimulator

• US 20040088032A1
• Filed: 10/22/2003
• Published: 05/06/2004
• Est. Priority Date: 06/28/2002
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Advanced Bionics Corporation (Sonova Holding AG)
• Inventors: Haller, Matthew I., He, Tom Xiaohai, Daulton, Jay
• Granted Patent: US 7,103,408 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/36007 of urogenital or gastrointestinal organs, e.g. for incontinence control
• CPC Class Codes: A61N 1/3605 Implantable neurostimulators for stimulating central or peripheral nerve system
• CPC Class Codes: A61N 1/37205 Microstimulators, e.g. implantable through a cannula
• CPC Class Codes: A61N 1/37217 characterised by the communication link, e.g. acoustic or tactile
• CPC Class Codes: A61N 1/37223 Circuits for electromagnetic coupling
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: A61N 1/37235 Aspects of the external programmer
• CPC Class Codes: A61N 1/3727 characterised by the modulation technique
• CPC Class Codes: A61N 1/37276 characterised by means for reducing power consumption during telemetry
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3787 from an external energy source
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H02J 2310/23 : The load being a medical device, a medical implant, or a life supporting device
• CPC Class Codes: H02J 50/10 : using inductive coupling
• CPC Class Codes: H02J 7/345 : using capacitors as storage or buffering devices
• CPC Class Codes: H04B 5/26 : using coils
• CPC Class Codes: H04B 5/79 : for data transfer in combination with power transfer
• CPC Class Codes: H04L 27/02 : Amplitude-modulated carrier systems, e.g. using on-off keying; Single sideband or vestigial sideband modulation H04L27/32 takes precedence
• CPC Class Codes: H04L 27/10 : Frequency-modulated carrier systems, i.e. using frequency-shift keying H04L27/32 takes precedence
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 : by winding or coiling
• CPC Class Codes: Y10T 29/49073 : by assembling coil and core
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49945 : by driven force fit
• CPC Class Codes: Y10T 29/49968 : Metal fusion joining
• CPC Class Codes: Y10T 428/12264 : having outward flange, gripping means or interlocking feature
• CPC Class Codes: Y10T 428/12271 : having discrete fastener, marginal fastening, taper, or end structure
• CPC Class Codes: Y10T 428/12347 : Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
• CPC Class Codes: Y10T 428/12375 : having member which crosses the plane of another member [e.g., T or X cross section, etc.]
• CPC Class Codes: Y10T 428/12396 : Discontinuous surface component
• CPC Class Codes: Y10T 428/12535 : with additional, spatially distinct nonmetal component
• CPC Class Codes: Y10T 428/12806 : Refractory [Group IVB, VB, or VIB] metal-base component

Abstract

An electrode assembly includes an electrode electrically connected to a capacitor with a wire. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.

Claims

1. An electrode assembly for use with a microstimulator, comprising:

a conductive electrode with a core defining a hole through the center of the core of the electrode;

a conductive wire electrically connected to the electrode through the core of the electrode; and

a capacitor electrically connected to the wire.

2. The electrode assembly of claim 1, wherein the electrode is attached to a braze assembly, the braze assembly comprising:

a metal member including an exterior flange of the metal member, the exterior flange including an inner surface;

a braze material including titanium and nickel; and

a ceramic member including a formed end, wherein the formed end of the ceramic member adjoins the inner surface of the exterior flange and is brazed to metal member with the braze material.

3. The electrode assembly of claim 1, wherein at least one of the wire and the electrode is titanium.

4. The electrode assembly of claim 1, wherein the wire contains slack in between the electrode and the capacitor.

5. The electrode assembly of claim 1, wherein the wire is electrically connected to the electrode by laser spot welding.

6. The electrode assembly of claim 1, wherein the wire is electrically connected to the capacitor with conductive epoxy.

7. The electrode assembly of claim 1, wherein the wire is electrically connected to the capacitor using solder.

8. The electrode assembly of claim 1, wherein the wire forms a u-loop at the site of electrical connection between the wire and the capacitor.

9. An assembly carrier for housing the components of a microstimulator during assembly, comprising:

a groove in the assembly carrier, wherein the groove is capable of securing a microstimulator housing and a wire in the carrier;

a wedge adjacent the groove, wherein the wedge is capable of pivoting and securing the wire within the groove; and

an elevator in communication with the assembly carrier, wherein the elevator is capable of facilitating attachment of a capacitor to the wire;

wherein a wire may exit the groove adjacent the capacitor.

10. The carrier of claim 9, wherein the elevator is a screw that is capable of elevating the capacitor in a substantially vertical direction until the capacitor is adjacent to the wire.

11. A method of electrically attaching a wire to a capacitor and an electrode of a microstimulator, comprising:

providing an electrode;

forming a hole through the electrode;

providing a wire;

preparing the wire to prevent the wire from slipping through the hole in the electrode;

threading the wire through the hole in the electrode;

providing a capacitor;

creating an electrical connection between the wire and the capacitor; and

electrically connecting the wire to the electrode.

12. The method of claim 11, further comprising:

bending an end of the wire before creating an electrical connection between the wire and the capacitor;

creating an electrical connection between the bent end of the wire and the capacitor;

removing excess wire from the bent end of the wire after creating an electrical connection between the wire and the capacitor;

removing excess wire from the wire where the wire electrically connects to the electrode after electrically connecting the wire to the electrode.

13. The method of claim 12, wherein electrically connecting the wire to the electrode includes laser spot welding and wherein removing excess wire includes laser spot welding.

14. The method of claim 12, further comprising:

securing the electrode, wire, and capacitor in an assembly carrier before creating an electrical connection between the wire and the capacitor;

tightening an elevator screw on the assembly carrier to raise the capacitor until the capacitor touches the wire; and

vertically housing the electrode, wire, and capacitor in an assembly carrier before electrically connecting the wire where it exits the electrode.

15. The method of claim 11, further comprising providing slack in the wire between the electrode and the capacitor.

16. The method of claim 11, wherein providing an electrode includes providing an electrode that is attached to a braze assembly.

17. The method of claim 11, wherein forming a hole through the electrode includes drilling a small diameter hole with a small diameter drill bit.

18. The method of claim 11, wherein preparing the wire includes at least one of:

bending the wire, clipping another structure to the wire, and attaching at least one other structure to the wire.

19. The method of claim 11, wherein bending an end of the wire further includes bending the wire to a shape that permits maximum electrical contact with the capacitor.

20. The method of claim 11, wherein the electrode is attached to a braze assembly of a microstimulator.