Dual chamber vacuum processing system
First Claim
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1. A photoresist ashing system comprising two processing chambers configured for alternate operation and a single pump in fluid communication with the two chambers, the pump being configured to perform both pump down and process pumping of the two chambers.
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Abstract
A photoresist ashing system includes two processing chambers configured for alternate operation in processing substrates. The system includes a single pump that performs both pump-down and process pumping of both of the chambers. In operation, one of the chambers is pumped down and processed while the other chamber is vented, unloaded and re-loaded.
39 Citations
17 Claims
- 1. A photoresist ashing system comprising two processing chambers configured for alternate operation and a single pump in fluid communication with the two chambers, the pump being configured to perform both pump down and process pumping of the two chambers.
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12. A dual chamber processing system for continuously processing a plurality of workpieces comprising:
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a common power source switchable between a first plasma applicator of a first chamber and a second plasma applicator of a second chamber, the first chamber for processing a second workpiece in a vacuum to completion therein when the power source is applied thereto and switched ON, a robot for removing at substantially atmospheric pressure a first workpiece from the second chamber after processing and reloading the second chamber with a third workpiece to be processed while the second workpiece is being processed in the first chamber, the second chamber for processing the third workpiece in a vacuum to completion therein when the power source is applied to the second plasma applicator and switched ON, the robot for removing at substantially atmospheric pressure the second workpiece from the first chamber after processing and reloading the first chamber with a fourth workpiece to be processed while the third workpiece is being processed in the second chamber, and exactly one pump adapted to be in fluid communication with the first and second chambers, the pump being configured to perform both process pumping and pump-down pumping of both chambers;
a computer configured to repeatedly synchronously alternately control the power source application, the robot movement, the chamber processing, and the pump. - View Dependent Claims (13)
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14. A method of processing substrates in a processing apparatus, the method comprising:
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providing a first processing chamber and a second processing chamber;
providing a single vacuum pump adapted to selectively communicate with the first processing chamber via a first vacuum line, and with the second processing chamber via a second vacuum line;
alternately pumping the first and second chambers with the single pump. - View Dependent Claims (15, 16)
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17. The method of claim 17, wherein said unloading a second substrate, and loading a third substrate are performed simultaneously with said pumping down the first processing chamber with the pump.
Specification