Method for connecting microchips to an antenna arranged on a support strip for producing a transponder

• US 20040089408A1
• Filed: 09/29/2003
• Published: 05/13/2004
• Est. Priority Date: 04/25/2001
• Status: Active Grant

• Current Assignee: Muehlbauer GmbH & Co. KG
• Original Assignee: Muehlbauer AG
• Inventors: Brod, Volker, Overmeyer, Ludger
• Granted Patent: US 6,972,394 B2
• Time in Patent Office: Days
• US Class Current: 156/230
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna

Abstract

The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.

Claims

1. Method of connecting micro-chips to antennas arranged on a first carrier tape for the manufacture of a transponder, characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module (4) with electrical terminals (6) and are applied to a second carrier tape (5) and that the two carrier tapes (1, 5) are unwound from a reel (7, 9) and brought one above the other, whereby the chip modules (4) are removed from the second carrier tape (5) and placed at a predetermined point on the first carrier tape (1).

2. Method according to claim 1, characterised in that the first carrier tape (1) runs at a continuous speed while the second carrier tape (5) is fed to the first carrier tape (1) in synchronism with the passing antenna spaces via an indexer.

3. Method according to claim 1 or 2, characterised in that the chip module (4) is electrically connected to the appropriate antenna (2) by soldering or crimping immediately after placement on the first carrier tape (1).

4. Method according to one of the claims 1 to 3, characterised in that the transponder is tested immediately after the connection of the chip module (4) to the antenna (2).

5. Method according to one of the claims 1 to 4, characterised in that the chip module (4) is held by a transport tape (12), circulating endlessly at the same speed as the first carrier tape (1), on the first carrier tape (1) during the placement onto the first carrier tape (1) until the chip module (4) is firmly connected to the appropriate antenna (2).

6. Method according to one of the claims 1 to 5, characterised in that the electrical connection of the chip module (4) to the antenna (2) occurs by laser soldering.