Modularized image sensor

• US 20040089927A1
• Filed: 11/12/2002
• Published: 05/13/2004
• Est. Priority Date: 11/12/2002
• Status: Abandoned Application

• Current Assignee: Kingpak Technology Inc.
• Original Assignee: Kingpak Technology Inc.
• Inventors: Tu, Hsiu Wen
• Application Number:
  US10/293,035
• Publication Number:
  US 20040089927A1
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A modularized image sensor includes a flexible/hard combination board, signal input terminals, electrical devices, a photosensitive chip and a transparent layer. The combination board has a first surface, a second surface and an opening. The signal input terminals are formed at a periphery of the opening. The electrical devices are mounted on the combination board. The photosensitive chip has a plurality of bonding pads and a photosensitive region. The photosensitive chip is mounted on the first surface with the photosensitive region exposed from the opening. The bonding pads are electrically connected to the signal input terminals. The transparent layer is mounted on the second surface and positioned above the opening, so that the photosensitive region may receive optical signals passing through the transparent layer. Accordingly, the overall volume of the modularized image sensor may be effectively reduced, and the manufacturing processes may be simplified.

Claims

1. A modularized image sensor, comprising:

a flexible/hard combination board having a first surface, a second surface and an opening penetrating from the first surface to the second surface;

a plurality of signal input terminals formed at a periphery of the opening;

at least one electrical device mounted on the flexible/hard combination board;

a photosensitive chip having a plurality of bonding pads and a photosensitive region, the photosensitive chip being mounted on the first surface of the flexible/hard combination board with the photosensitive region exposed from the opening of the flexible/hard combination board, and the plurality of bonding pads being electrically connected to the signal input terminals of the flexible/hard combination board; and

a transparent layer mounted on the second surface of the flexible/hard combination board and positioned above the opening, so that the photosensitive region of the photosensitive chip may receive optical signals passing through the transparent layer.

2. The modularized image sensor according to claim 1, wherein the flexible/hard combination board includes two hard boards and a flexible board interposed between the two hard boards.

3. The modularized image sensor according to claim 2, wherein the at least one electrical device is mounted on at least one of the hard boards.

4. The modularized image sensor according to claim 1, wherein the at least one electrical device is an active device.

5. The modularized image sensor according to claim 1, wherein the bonding pads of the photosensitive chip are electrically connected to the signal input terminals of the flexible/hard combination board in a flip-chip manner.

6. The modularized image sensor according to claim 1, wherein through holes are formed at the periphery of the opening of the flexible/hard combination board, when the photosensitive chip is mounted on the flexible/hard combination board, the bonding pads are exposed from the through holes, and the bonding pads are electrically connected to the signal input terminals of the flexible/hard combination board via a plurality of wires.

7. The modularized image sensor according to claim 1, further comprising a glue layer applied to the photosensitive chip for covering the photosensitive chip.

8. The modularized image sensor according to claim 6, wherein the through holes of the flexible/hard combination board are filled with the glue layer.

9. The modularized image sensor according to claim 1, wherein the at least one electrical device is a passive device.