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Semiconductor package structure and method for manufacturing the same

  • US 20040089929A1
  • Filed: 06/18/2003
  • Published: 05/13/2004
  • Est. Priority Date: 11/13/2002
  • Status: Abandoned Application
First Claim
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1. A semiconductor package structure, comprising:

  • a substrate;

    a semiconductor die attached to the substrate;

    a plurality of wires, each of the wires having a center conductive layer connecting the substrate to the semiconductor die, a dielectric layer covering the center conductive layer and a metal layer covering the dielectric layer; and

    a molding compound encapsulating the semiconductor die and the wires.

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