HIGH FREQUENCY POWER AMPLIFIER APPARATUS AND POWER AMPLIFIER MODULE USE THE SAME

• US 20040090266A1
• Filed: 12/09/2003
• Published: 05/13/2004
• Est. Priority Date: 11/26/2001
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Sakai, Yukio, Kato, Hisayoshi, Yasui, Fumio
• Granted Patent: US 6,914,481 B2
• Time in Patent Office: Days
• US Class Current: 330/129
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H03F 1/0211 with control of the supply voltage or current
• CPC Class Codes: H03F 1/0216 Continuous control
• CPC Class Codes: H03F 2200/372 Noise reduction and elimination in amplifier
• CPC Class Codes: H03F 2200/451 the amplifier being a radio frequency amplifier
• CPC Class Codes: H03F 3/189 High-frequency amplifiers, e.g. radio frequency amplifiers
• CPC Class Codes: H03G 3/30 in amplifiers having semiconductor devices
• CPC Class Codes: H03G 3/3042 in modulators, frequency-changers, transmitters or power amplifiers transmission power control in bidirectional transmission systems H04W52/04
• CPC Class Codes: H04B 1/0475 with means for limiting noise, interference or distortion H04B1/0483 takes precedence

Abstract

In a high frequency power amplifier apparatus of the present invention, ground terminal (17e) of automatic power control circuit (17) is connected to ground terminal (13c) of power amplifier (13) through inductive reactance element (18) for preventing frequency supplied from power amplifier (13). Noise occurring from automatic power control circuit (17) can be prevented from disturbing power amplifier (13).

Claims

1. A high frequency power amplifier apparatus comprising:

an input terminal;

a power amplifier for receiving a signal supplied from said input terminal;

a directional coupler for receiving an output from said power amplifier;

an output terminal for receiving an output from said directional coupler; and

an automatic power control circuit, an input portion of said automatic power control circuit being connected to a coupling output terminal of said directional coupler, an output portion of said automatic power control circuit being connected to a power control terminal of said power amplifier,

wherein a ground terminal of said automatic power control circuit is connected to a ground terminal of said power amplifier through an inductive reactance element for preventing frequency supplied from said power amplifier.

2. A high frequency power amplifier apparatus according to claim 1,

wherein the inductive reactance element comprises a transmission line having a length substantially equal to one of ¼

wavelength of a frequency supplied from said power amplifier and an odd number times larger than the ¼

wavelength.

3. A high frequency power amplifier apparatus according to claim 1,

wherein the inductive reactance element comprises a pattern inductor.

4. A high frequency power amplifier apparatus according to claim 1,

wherein the inductive reactance element comprises a winding coil.

5. A high frequency power amplifier apparatus according to claim 1,

wherein said directional coupler is formed by intaglio printing.

6. A high frequency power amplifier apparatus according to claim 1,

wherein an input matching circuit is disposed between said input terminal and said power amplifier.

7. A high frequency power amplifier apparatus according to claim 1,

wherein an output matching circuit is disposed between said power amplifier and said directional coupler.

8. A high frequency power amplifier apparatus according to claim 1,

wherein said power control terminal is connected to said automatic power control circuit, and an amplification degree of said power amplifier is controlled with an output of said automatic power control circuit.

9. A high frequency power amplifier apparatus according to claim 1,

wherein said power control terminal is connected to said automatic power control circuit, and turning on or off of a power supply of said power amplifier is controlled with an output of said automatic power control circuit.

10. A power amplifier module including a high frequency power amplifier apparatus in one multilayer substrate, said high frequency power amplifier module comprising:

an input terminal;

a power amplifier for receiving a signal supplied from the input terminal;

a directional coupler for receiving an output from the power amplifier;

an output terminal for receiving an output from the directional coupler; and

an automatic power control circuit, an input portion of the automatic power control circuit being connected to a coupling output terminal of the directional coupler, an output portion of the automatic power control circuit being connected to a power control terminal of the power amplifier,

wherein a ground terminal of the automatic power control circuit is connected to a ground terminal of the power amplifier through an inductive reactance element for preventing frequency supplied from the power amplifier.

11. A power amplifier module according to claim 10,

wherein a component mounting surface of the multilayer substrate is covered with a shield case.

12. A power amplifier module according to claim 10,

wherein the power amplifier is mounted to the upper surface of an alumina substrate via inorganic glass, and heat of the power amplifier is released to the back surface of the alumina substrate from the power amplifier through a thermal via hole.

13. A power amplifier module according to claim 12,

wherein a printing pattern is disposed on the inorganic glass for supporting the power amplifier.

14. A power amplifier module according to claim 12,

wherein diameter of the thermal via hole is set to be smaller than thickness of the multilayer substrate.

15. A power amplifier module according to claim 12,

wherein a low-temperature baked substrate is disposed on the upper surface of the inorganic glass, and the automatic power control circuit is disposed on the low-temperature baked substrate.

16. A power amplifier module according to claim 12,

wherein the directional coupler is disposed on the upper surface of the alumina substrate and is formed by intaglio printing.