High intensity photocuring system

• US 20040090794A1
• Filed: 11/08/2002
• Published: 05/13/2004
• Est. Priority Date: 11/08/2002
• Status: Active Grant

• Current Assignee: Smd Software Incorporated
• Original Assignee: Smd Software Incorporated
• Inventors: Ollett, Scott H., Lampe, Ross W. Jr.
• Granted Patent: US 6,880,954 B2
• Time in Patent Office: Days
• US Class Current: 362/555
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A method and apparatus for curing photosensitive materials uses LEDs and an optical concentrator to generate high optical power intensities. An LED array, comprising a plurality of LED assemblies, generates collimated light. A collection lens functions as an optical concentrator and focuses the collimated light to a desired spot size at a desired location. The LED assemblies may be at least partially disposed in a cooling plenum, where the cooling plenum is at least partially defined by the collection lens. Each LED assembly within the LED array may be detachably coupled to a mounting surface, enabling easy replacement of individual LED assemblies within the LED array. The photocuring assembly may also include a redirecting assembly disposed between the collection lens and the desired location that may further concentrate the light at the desired location. The photocuring assembly may include more than one of the above features.

Claims

1. A photocuring assembly, comprising:

an LED array comprising a plurality of LED assemblies for generating collimated light;

at least one collection lens optically downstream from said LED array; and

a cooling plenum at least partially defined by said collection lens and having a cooling fluid flowing therein, wherein said LED array is disposed in said cooling plenum.

2. The photocuring assembly of claim 1 wherein each of said LED assemblies comprises a base and an LED insert and wherein at least one of said LED inserts is detachably coupled to said base.

3. The photocuring assembly of claim 1 wherein at least one of said LED assemblies is detachably coupled to a mounting surface.

4. The photocuring assembly of claim 3 wherein said mounting surface comprises an electrical substrate and wherein each of said LED assemblies is electrically coupled to said electrical substrate.

5. The photocuring assembly of claim 1 further comprising a fan to cause said cooling fluid to flow through said cooling plenum.

6. The photocuring assembly of claim 1 wherein said plurality of LED assemblies comprises a plurality of ultra-violet LEDs.

7. The photocuring assembly of claim 1 further comprising a light guide for collecting said light optically downstream from said collection lens.

8. The photocuring assembly of claim 7 further comprising a redirection assembly disposed between said collection lens and said light guide for reflectively redirecting at least a portion of said light to said light guide.

9. A photocuring assembly, comprising:

an LED array comprising a plurality of LED assemblies, each of said LED assemblies comprising a base and an LED insert coupled to said base;

wherein, for each of said LED assemblies, at least the LED insert is detachably coupled to a mounting surface; and

at least one collection lens optically downstream from said LED array.

10. The assembly of claim 9 wherein each of said LED assemblies, including their respective LED inserts, are individually detachably coupled to said mounting surface.

11. The assembly of claim 9 wherein said LED inserts are detachably coupled to their respective bases.

12. The photocuring assembly of claim 9 wherein said LED assembly is threadably coupled to said mounting surface.

13. The photocuring assembly of claim 9 wherein said mounting surface comprises an electrical substrate and wherein each of said LED assemblies is electrically coupled to said electrical substrate

14. The photocuring assembly of claim 9 further comprising a cooling plenum having a cooling fluid flowing therein, wherein said bases are disposed in said cooling plenum, and further wherein said cooling plenum is at least partially defined by said collection lens.

15. The photocuring assembly of claim 9 further comprising a light guide for collecting light generated by said LED array optically downstream from said collection lens.

16. The photocuring assembly of claim 15 further comprising a redirection assembly disposed between said collection lens and said light guide for redirecting at least a portion of said light to said light guide.

17. The photocuring assembly of claim 9 wherein said LED assembly comprises an ultra-violet LED.

18. A photocuring assembly, comprising:

an LED array comprising one or more LED assemblies for generating collimated light;

at least one collection lens optically downstream from said LED array to converge a majority of said light to within a predetermined area at a collection location distant from said collection lens; and

a redirecting assembly disposed between said collection lens and said collection location, said redirecting assembly redirecting at least a portion of said light other than said majority to fall within said area at said collection location.

19. The photocuring assembly of claim 18 wherein said redirecting assembly causes at least an additional 5% of said light to fall within said area at said collection location.

20. The photocuring assembly of claim 18 wherein said redirecting assembly causes at least an additional 10% of said light to fall within said area at said collection location.

21. The photocuring assembly of claim 18 wherein said redirecting assembly uses refraction to redirect said light other than said majority to said collection location.

22. The photocuring assembly of claim 18 wherein said redirecting assembly uses reflection to redirect said light other than said majority to said collection location.

23. The photocuring assembly of claim 22 wherein said redirecting assembly comprises a reflective conical area.

24. The photocuring assembly of claim 18 further comprising a light guide for collecting said light at said collection location and delivering said light to a remote location.

25. The photocuring assembly of claim 24 wherein said light guide comprises at least one optical fiber and wherein said light guide collects said light within a predetermined collection angle.

26. A photocuring assembly, comprising:

an LED array comprising a plurality of LED assemblies for generating collimated light, each of said LED assemblies comprising a base and an LED insert coupled to said base;

wherein, for each of said LED assemblies, at least the LED insert is detachably coupled to a mounting surface;

at least one collection lens optically downstream from said LED array to converge a majority of said light to within a predetermined area at a collection location distant from said collection lens; and

a cooling plenum at least partially defined by said collection lens and having a cooling fluid flowing therein, wherein said bases of said plurality of LED assemblies are disposed at least partially in said cooling plenum.

27. The photocuring assembly of claim 26 further comprising a redirecting assembly disposed between said collection lens and said collection location, said redirecting assembly redirecting at least a portion of said light other than said majority to fall within said area at said collection location.

28. The photocuring assembly of claim 26 wherein at least one of said LED inserts is detachably coupled to its respective base.

29. The photocuring assembly of claim 26 wherein at least one of said plurality of LED assemblies is detachably coupled to said mounting surface.

30. The photocuring assembly of claim 29 wherein at least one of said plurality of LED assemblies is threadably coupled to said mounting surface.

31. The photocuring assembly of claim 26 wherein each of said bases comprises a heatsink located on a first end of said base and a reflective collimating cavity located on a second end of said base opposite said first end, and further wherein said heatsinks are disposed in said cooling plenum.

32. The photocuring assembly of claim 26 further comprising a light guide for collecting said light at said collection location and delivering said light to a remote location.

33. The photocuring assembly of claim 26 wherein said mounting surface comprises an electrical substrate and wherein said plurality of LED assemblies are electrically coupled to said electrical substrate.

34. A method of operating a photocuring assembly, comprising:

providing an LED array comprising a plurality of LED assemblies, each of said LED assemblies including an LED insert coupled to a heatsink;

generating collimated light with said LED array;

intensifying said light with at least one collection lens optically downstream from said LED array; and

routing a flow of cooling fluid via a cooling plenum at least partially defined by said collection lens, wherein said heatsinks are disposed at least partially in said cooling plenum.

35. The method of claim 34 wherein routing said flow of cooling fluid comprises using a fan for routing said flow of cooling fluid through said cooling plenum.

36. A method of operating a photocuring assembly, comprising;

providing an LED array comprising a plurality of LED assemblies, each of said LED assemblies comprising a base and an LED insert coupled to said base, including a first LED assembly comprising a first base and a first LED insert;

detachably coupling said first LED assembly to a mounting surface;

generating collimated light from said LED array using at least said first LED assembly;

thereafter, replacing at least one LED assembly in said LED array by decoupling at least said first LED insert from said mounting surface and detachably coupling a second LED insert to said mounting surface; and

generating collimated light from said LED array using at least said second LED assembly.

37. The method of claim 36 wherein replacing at least one LED assembly in said LED array comprises decoupling at least said first LED assembly, including its first LED insert, from said mounting surface and detachably coupling a second LED assembly to said mounting surface, said second LED assembly comprising a second base and said second LED insert.

38. The method of claim 36 wherein detachably coupling comprises threadably coupling.

39. The method of claim 36 wherein generating collimated light from said LED array comprises generating collimated light at a first operating wavelength, wherein said first LED assembly emits light at said first operating wavelength.

40. The method of claim 39 wherein said first and second LED assemblies emit light at substantially equivalent operating wavelengths.

41. The method of claim 39 wherein said first and second LED assemblies emit light at different operating wavelengths.

42. A method of curing a photosensitive material at a curing location, comprising:

generating an intensified curing light, the steps comprising;

generating collimated light with an LED array comprising a plurality of LED assemblies;

generating said intensified curing light by converging a majority of said light to within a predetermined area at a predetermined location with at least one collection lens optically downstream from said LED array; and

routing a flow of cooling fluid through a cooling plenum at least partially defined by said at least one collection lens, wherein said LED array is at least partially disposed in said cooling plenum; and

delivering said intensified curing light to said curing location.

43. The method of claim 42 further comprising placing a photosensitive material at said curing location and exposing said photosensitive material with said intensified curing light.

44. The method of claim 43 wherein the step of delivering said curing light to said curing location comprises placing said photosensitive material at said predetermined location.

45. The method of claim 42 wherein the step of delivering said curing light to said curing location comprises collecting said intensified light at said predetermined location with a light guide and delivering said collected light through said light guide to said curing location.

46. The method of claim 45 wherein converging said majority of said light to within said predetermined area at said predetermined location further comprises placing a redirection assembly between said collection lens and said light guide and redirecting at least a portion of said light with said redirecting assembly to fall within said predetermined area at said predetermined location.

47. The method of claim 42 wherein said photosensitive material comprises material sensitive to light at a first wavelength and wherein generating said collimated light with said LED array comprises generating collimated light at said first wavelength with an LED array comprising at least one LED assembly that emits light at said first wavelength.

48. The method of claim 42 wherein at least one of said plurality of LED assemblies is detachably coupled in said LED array, and wherein generating said collimated light at said first wavelength comprises decoupling at least one LED assembly that emits light at a second wavelength and replacing said decoupled LED assembly that emits light at said second wavelength by detachably coupling an LED assembly to said LED array that emits light at said first wavelength.

49. The method of claim 48 wherein decoupling said at least one LED assembly comprises threadably decoupling said at least one LED assembly from said mounting surface.

50. The method of claim 48 wherein detachably coupling said second LED assembly comprises threadably coupling said second LED assembly to said mounting surface.

51. The method of claim 42 wherein each of said LED assemblies comprises a base and an LED insert detachably coupled to said base, and wherein generating said collimated light at said first wavelength comprises decoupling at least one LED insert that emits light at a second wavelength and replacing said decoupled LED insert by detachably coupling a different LED insert that emits light at said first wavelength.

52. The method of claim 51 wherein decoupling said at least one LED insert comprises threadably decoupling said at least one LED insert from said base.

53. The method of claim 51 wherein detachably coupling said second LED insert comprises threadably coupling said second LED insert to said base.