Memory card and its manufacturing method
First Claim
1. A memory card having a first surface and a second surface as a back surface of the first surface, the memory card comprising:
- a wiring substrate having a main surface and a back surface;
a plurality of external electrode terminals formed on the back surface of the wiring substrate;
a plurality of wiring lines formed over the main surface of the wiring substrate;
a semiconductor element disposed over the main surface of the wiring substrate and connected electrically to the plural external electrode terminals through a plurality of wiring lines; and
a sealing member formed of an insulating resin on the back surface of the wiring substrate to cover the semiconductor element, wherein the external electrode terminals and the back surface of the wiring substrate are exposed to the first surface of the memory card, and wherein the sealing member is exposed to the second surface of the memory card.
5 Assignments
0 Petitions
Accused Products
Abstract
A less expensive memory card is provided. An electronic device according to the present invention comprises a substrate having wiring lines with plural external electrode terminals exposed to a first surface of the substrate, a sealing member formed of an insulating resin to cover the whole of a second surface as a back surface opposite to the first surface, and one or plural semiconductor elements covered with the sealing member and fixed to the second surface of the substrate, the semiconductor element(s) having electrodes connected electrically to the wiring lines through a connecting means. The substrate is quadrangular in shape and a card-shaped package is constituted by the substrate and the sealing member. One or plural semiconductor elements constituting a memory chip(s), as well as a control chip for controlling the memory chip(s), are fixed to the substrate to form a memory card. A direction recognizing portion is formed at edges of the substrate and the sealing member.
90 Citations
51 Claims
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1. A memory card having a first surface and a second surface as a back surface of the first surface, the memory card comprising:
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a wiring substrate having a main surface and a back surface;
a plurality of external electrode terminals formed on the back surface of the wiring substrate;
a plurality of wiring lines formed over the main surface of the wiring substrate;
a semiconductor element disposed over the main surface of the wiring substrate and connected electrically to the plural external electrode terminals through a plurality of wiring lines; and
a sealing member formed of an insulating resin on the back surface of the wiring substrate to cover the semiconductor element, wherein the external electrode terminals and the back surface of the wiring substrate are exposed to the first surface of the memory card, and wherein the sealing member is exposed to the second surface of the memory card. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A memory card comprising:
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a wiring substrate having a main surface and a back surface;
a plurality of external electrode terminals formed on the back surface of the wiring substrate;
a plurality of wiring lines formed over the main surface of the wiring substrate;
a semiconductor element disposed over the main surface of the wiring substrate and connected electrically to the plural external electrode terminals through the plural wiring lines; and
a sealing member formed of an insulating resin on the back surface of the wiring substrate to cover the semiconductor element, wherein an interface where the wiring substrate and the sealing member are bonded together is exposed to a side face of the memory card.
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8. A method of manufacturing an electronic device, comprising the steps of:
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(a) providing a wiring substrate, the wiring substrate having unit substrate areas over a main surface thereof and a plurality of external electrode terminals on a back surface thereof;
(b) arranging semiconductor chips on the unit substrate areas and connecting the semiconductor chips electrically to the plural external electrode terminals;
(c) forming a sealing member for sealing the semiconductor chips over the unit substrate areas and also over the main surface portion of the wiring substrate located around the unit substrate areas;
(d) cutting the sealing member and the wiring substrate simultaneously at positions between the unit substrate areas and the surrounding portions to afford individual pieces, the individual pieces each comprising the wiring substrate of the unit substrate area, the sealing member on the unit substrate area, the semiconductor chip on the unit substrate area, and the plural external electrode terminals;
(e) providing a case having a recess; and
(f) bonding the sealing member to a bottom of the recess and fixing each of the individual pieces to the interior of the recess. - View Dependent Claims (9, 10, 11, 12)
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13. A method of manufacturing an electronic device, comprising the steps of:
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(a) providing a wiring substrate, the wiring substrate having first and second unit substrate areas over a main surface thereof, also having a plurality of first external electrode terminals on a back surface of the first unit substrate area, and further having a plurality of second external electrode terminals on a back surface of the second unit substrate area;
(b) disposing a first semiconductor chip in the first unit substrate area, connecting the first semiconductor chip electrically to the plural first external electrode terminals, disposing a second semiconductor chip in the second unit substrate area, and connecting the second semiconductor chip electrically to the plural second external electrode terminals;
(c) forming over the first and second unit substrate areas a sealing member for sealing the first and second semiconductor chips;
(d) cutting the sealing member and the wiring substrate simultaneously at a position between the first and second unit substrate areas to form a first individual piece and a second individual piece, the first individual piece comprising the wiring substrate located in the first unit substrate area, a first sealing portion formed over the first unit substrate area, the first semiconductor chip, and the first plural external electrode terminals, the second individual piece comprising the wiring substrate located in the second unit substrate area, a second sealing portion formed over the second unit substrate area, the second semiconductor chip, and the plural second external electrode terminals;
(e) providing a first case having a recess; and
(f) bonding the first sealing portion to a bottom of the recess in the first case and fixing the first individual piece to the interior of the recess in the first case. - View Dependent Claims (14, 15, 16, 17, 18)
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19. An electronic device comprising:
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a substrate having wiring lines with a plurality of external electrode terminals exposed to a first surface of the substrate;
a groove formed in a second surface as a back surface opposite to the first surface of the substrate or in the first surface in the direction of arrangement of the external electrode terminals and throughout the overall length of the substrate;
a sealing member formed of an insulating resin, the sealing member being buried in the groove to fill up the groove; and
at least one semiconductor element covered with the sealing member, fixed to a bottom of the groove, and having electrodes connected electrically to the wiring lines through a connecting means. - View Dependent Claims (20, 21, 22, 23)
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24. A method of manufacturing an electronic device, comprising the steps of:
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providing a substrate, the substrate having unit substrate areas arranged in order lengthwise and crosswise, with a plurality of external electrode terminals being exposed to a first surface of the substrate in each of the unit substrate areas, the substrate also having a groove formed in a second surface as a back surface opposite to the first surface or in the first surface in the direction of arrangement of the external electrode terminals and throughout the overall length of the substrate, the substrate further having wiring lines;
fixing at least one semiconductor element to a bottom of the groove in each of the unit substrate areas of the substrate;
connecting electrodes on the semiconductor element and the wiring lines electrically with each other through a connecting means;
filling up the groove with an insulating resin so as to cover the semiconductor element and the connecting means, thereby forming a sealing member; and
separating the substrate and the sealing member for each of the unit substrate areas. - View Dependent Claims (25, 26, 27, 28)
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29. An electronic device comprising:
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a substrate having wiring lines with a plurality of external electrode terminals exposed to a first surface of the substrate;
a groove formed in a second surface as a back surface opposite to the first surface or in the first surface in the direction of arrangement of the external electrode terminals and throughout the overall length of the substrate;
a sealing member formed of an insulating resin, the sealing member being buried in the groove so as to fill up a part of the groove;
at least one semiconductor element covered with the sealing member, fixed to a bottom of the groove, and having electrodes connected electrically to the wiring lines through a connecting means; and
at least one semiconductor element fixed to the groove portion not covered with the sealing member and having electrodes connected electrically to the wiring lines through a connecting means. - View Dependent Claims (30, 31, 32)
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33. A method of manufacturing an electronic device, comprising the steps of:
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providing a substrate, the substrate having unit substrate areas arranged in order lengthwise and crosswise, with a plurality of external electrode terminals being exposed to a first surface of the substrate in each of the unit substrate areas, the substrate also having a groove formed in a second surface opposite to the first surface or in the first surface in the direction of arrangement of the external electrode terminals and throughout the overall length of the substrate, the substrate further having wiring lines;
fixing at least one semiconductor element to a bottom of the groove in each of the unit substrate areas of the substrate at an offset position;
connecting electrodes on the semiconductor element and the wiring lines electrically with each other through a connecting means;
filling up a part of the groove with an insulating resin so as to cover the semiconductor element and the connecting means, thereby forming a sealing member;
fixing a semiconductor element to a groove bottom portion not covered with the sealing portion and connecting electrodes formed on the semiconductor element electrically with the wiring lines through a connecting means; and
separating the substrate and the sealing member for each of the unit substrate areas. - View Dependent Claims (34, 35, 36)
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37. An electronic device comprising:
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a substrate having wiring lines with a plurality of external electrode terminals exposed to a first surface of the substrate;
a sealing member formed of an insulating resin to cover the whole of a second surface as a back surface opposite to the first surface;
a groove formed in the first surface of the substrate in the direction of arrangement of the external electrode terminals and throughout the overall length of the substrate;
a sealing member formed of an insulating resin, the sealing member being buried in the groove to fill up the groove; and
at least one semiconductor element disposed in each of the sealing members so as to be covered with the sealing member, the semiconductor element being fixed to the substrate and having electrodes formed thereon, the electrodes being connected electrically to the wiring lines through a connecting means. - View Dependent Claims (38, 39)
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40. A method of manufacturing an electronic device, comprising the steps of:
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providing a substrate, the substrate having unit substrate areas arranged in order lengthwise and crosswise, with a plurality of external electrode terminals being exposed to a first surface of the substrate in each of the unit substrate areas, the substrate also having a groove formed in the first surface in the direction of arrangement of the external electrode terminals and throughout the overall length of the substrate, the substrate further having wiring lines;
fixing at least one semiconductor element to a bottom of the groove in each of the unit substrate areas of the substrate;
fixing at least one semiconductor element to a second surface as a back surface opposite to the first surface of the substrate in each of the unit substrate areas;
connecting electrodes formed on each of the semiconductor elements and the wiring lines with each other through a connecting means;
burying an insulating resin in the groove to fill up the groove, thereby forming a sealing member which covers the semiconductor elements and the connecting means, forming a sealing member throughout the whole of the second surface of the substrate with use of an insulating resin so as to cover the semiconductor element on the second surface and the connecting means; and
separating the substrate and the sealing member for each of the unit substrate areas. - View Dependent Claims (41, 42)
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43. An electronic device comprising:
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a case having a recess formed in one surface thereof; and
a COB package fitted in and bonded to the recess, the COB package comprising;
a substrate having wiring lines with a plurality of external electrode terminals exposed to a first surface of the substrate;
a groove formed in a second surface as a back surface opposite to the first surface of the substrate or in the first surface in the direction of arrangement of the external electrode terminals and throughout the overall length of the substrate;
a sealing member formed of an insulating resin, the sealing member being buried in the groove to fill up the groove; and
at least one semiconductor element covered with the sealing member, fixed to a bottom of the groove, and having electrodes connected electrically to the wiring lines through a connecting means, the COB package being bonded to the case so that the external electrode terminals are exposed. - View Dependent Claims (44, 45)
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46. An electronic device comprising:
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a case having a recess formed in one surface thereof; and
a COB package fitted in and bonded to the recess, the COB package comprising;
a substrate having wiring lines with a plurality of external electrode terminals exposed to a first surface of the substrate;
a groove formed in a second surface as a back surface of the first surface or in the first surface in the direction of arrangement of the external electrode terminals and throughout the overall length of the substrate;
a sealing member formed of an insulating resin, the sealing member being buried in the groove to fill up the groove;
at least one semiconductor element covered with the sealing member, fixed to a bottom of the groove, and having electrodes connected electrically to the wiring lines through a connecting means; and
at least one semiconductor element fixed to the groove portion not covered with the sealing portion and having electrodes connected electrically to the wiring lines through a connecting means, the COB package being bonded to the case so that the external electrode terminals are exposed. - View Dependent Claims (47, 48)
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49. An electronic device, comprising:
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a case having a recess formed in one surface thereof; and
a COB package fitted in and bonded to the recess, the COB package comprising;
a substrate having wiring lines with a plurality of external electrode terminals exposed to a first surface of the substrate;
a sealing member formed of an insulating resin to cover the whole of a second surface as a back surface opposite to the first surface;
a groove formed in the first surface in the direction of arrangement of the external electrode terminals and throughout the overall length of the substrate;
a sealing member formed of an insulating resin, the sealing member being buried in the groove to fill up the groove; and
at least one semiconductor element provided in each of the sealing members so as to be covered with the sealing member, the semiconductor element being fixed to the substrate and having electrodes connected electrically to the wiring lines through a connecting means, the COB package being bonded to the case so that the external electrode terminals are exposed. - View Dependent Claims (50, 51)
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Specification