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Wiring structure on semiconductor substrate and method of fabricating the same

  • US 20040094841A1
  • Filed: 11/03/2003
  • Published: 05/20/2004
  • Est. Priority Date: 11/08/2002
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor substrate having a plurality of connecting pads on one surface;

    an insulating film formed on one surface of the semiconductor substrate, and having holes each corresponding to one of the connecting pads, an upper surface, and a recess having a bottom surface depressed from the upper surface in a direction of thickness; and

    interconnections formed on the upper surface of the insulating film or on the bottom surface of the recess, and connected to the connecting pads through the holes in the insulating film.

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