Electromagnetic coupling characteristic adjustment method in non-contact power supply system, power supply device, and non-contact power supply system
First Claim
1. An electromagnetic coupling characteristic adjustment method for adjusting an electromagnetic coupling characteristic between a power supply device and a semiconductor device which are used in a non-contact power supply system in which a power transmission antenna coil provided in the power supply device and a power receiving antenna coil provided in the semiconductor device are electromagnetically coupled so that the power supply device supplies power to the semiconductor device without contact with the semiconductor device, the power supply device including a first adjustment impedance element connected in series to the power transmission antenna coil and a second adjustment impedance element connected in parallel with the power transmission antenna coil, the electromagnetic coupling characteristic adjustment method comprising the step of:
- (a) determining impedances of the first and second adjustment impedance elements so that the semiconductor device receives greatest power when a power supply distance, which is a distance between the power transmission antenna coil and the power receiving antenna coil, has a predetermined value not less than 0.
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Accused Products
Abstract
An electromagnetic coupling characteristic adjustment method for adjusting an electromagnetic coupling characteristic between a reader/writer device and an IC card which are used in a non-contact communication system in which a power transmission antenna coil provided in the reader/writer device and a power receiving antenna coil provided in the IC card are electromagnetically coupled so that the reader/writer device supplies power to the IC card without contact with the IC card. The power supply device includes adjustment impedance elements respectively connected in series and in parallel with the power transmission antenna coil. Impedances of these adjustment impedance elements are determined so that the semiconductor device receives greatest power when a power supply distance, which is a distance between the power transmission antenna coil and the power receiving antenna coil, has a predetermined value not less than 0. On this account, heat generation due to the difference of received power can be reduced with a simple structure.
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Citations
22 Claims
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1. An electromagnetic coupling characteristic adjustment method for adjusting an electromagnetic coupling characteristic between a power supply device and a semiconductor device which are used in a non-contact power supply system in which a power transmission antenna coil provided in the power supply device and a power receiving antenna coil provided in the semiconductor device are electromagnetically coupled so that the power supply device supplies power to the semiconductor device without contact with the semiconductor device,
the power supply device including a first adjustment impedance element connected in series to the power transmission antenna coil and a second adjustment impedance element connected in parallel with the power transmission antenna coil, the electromagnetic coupling characteristic adjustment method comprising the step of: (a) determining impedances of the first and second adjustment impedance elements so that the semiconductor device receives greatest power when a power supply distance, which is a distance between the power transmission antenna coil and the power receiving antenna coil, has a predetermined value not less than 0. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electromagnetic coupling characteristic adjustment method for adjusting an electromagnetic coupling characteristic between a power supply device and a semiconductor device which are used in a non-contact power supply system in which a power transmission antenna coil provided in the power supply device and a power receiving antenna coil provided in the semiconductor device are electromagnetically coupled so that the power supply device supplies power to the semiconductor device without contact with the semiconductor device,
the power supply device including a first adjustment impedance element connected in series to the power transmission antenna coil and a second adjustment impedance element connected in parallel with the power transmission antenna coil, the electromagnetic coupling characteristic adjustment method comprising the step of: (a) determining impedances of the first and second adjustment impedance elements so that the semiconductor device receives greater power than a minimum power for operation of the semiconductor device when a power supply distance, which is a distance between the power transmission antenna coil and the power receiving antenna coil, is within a predetermined range. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A power supply device including a power transmission antenna coil which is electromagnetically coupled with a power receiving antenna coil provided in a semiconductor device so as to supply power to the semiconductor device without contact with the semiconductor device, comprising:
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a first adjustment impedance element connected in series to the power transmission antenna coil; and
a second adjustment impedance element connected in parallel with the power transmission antenna coil, impedances of the first and second adjustment impedance elements being determined so that the semiconductor device receives greatest power when a power supply distance, which is a distance between the power transmission antenna coil and the power receiving antenna coil, is within a predetermined range whose lower limit is greater than 0. - View Dependent Claims (16, 17, 18)
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19. A non-contact power supply system including a power supply device and a semiconductor device having a power receiving antenna coil which is electromagnetically coupled with a power transmission antenna coil of the power supply device so as to supply power from the power supply device to the semiconductor device without contact therebetween,
the power supply device including a first adjustment impedance element connected in series to the power transmission antenna coil and a second adjustment impedance element connected in parallel with the power transmission antenna coil, impedances of the first and second adjustment impedance elements being determined so that the semiconductor device receives greatest power when a power supply distance, which is a distance between the power transmission antenna coil and the power receiving antenna coil, is within a predetermined range whose lower limit is greater than 0.
Specification