Digital camera with a light-sensitive sensor
First Claim
Patent Images
1. A digital camera, comprising:
- a lens having a lens top side and a lens underside;
a camera housing;
a light-sensitive semiconductor sensor having a top side aligned with said lens and an underside;
said camera housing having a plastic body with a top side carrying said lens and an underside with said light-sensitive sensor;
a transparent plastic core filling an interspace between said lens underside and said top side of said semiconductor sensor; and
wherein a circular aperture is formed between said lens underside and said top side of said semiconductor sensor in said transparent plastic core.
1 Assignment
0 Petitions
Accused Products
Abstract
A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque layer with an aperture that improves the image quality. The invention also relates to a method for producing such a digital camera.
80 Citations
27 Claims
-
1. A digital camera, comprising:
-
a lens having a lens top side and a lens underside;
a camera housing;
a light-sensitive semiconductor sensor having a top side aligned with said lens and an underside;
said camera housing having a plastic body with a top side carrying said lens and an underside with said light-sensitive sensor;
a transparent plastic core filling an interspace between said lens underside and said top side of said semiconductor sensor; and
wherein a circular aperture is formed between said lens underside and said top side of said semiconductor sensor in said transparent plastic core. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
-
-
25. A method for producing a digital camera, which comprises the following method steps:
-
providing a lead frame for a plurality of semiconductor sensors and with flat conductors for external connections;
mounting semiconductor sensors onto the lead frame;
connecting contact surfaces on a top side of the semiconductor sensors to the external connections;
potting the lead frame with a transparent plastic to form a transparent lower plastic plate half while embedding the lead frame, the external connections, and the connections on an underside of the plastic plate;
selectively coating a top side of the lower plastic plate half with an aperture plate layer;
mounting an upper transparent plastic plate half, provided with dome-shaped protuberances on the top side, onto the aperture plate layer; and
separating the plastic plate into individual transparent digital cameras with an integral lens, with a built-in semiconductor sensor, and with external connections. - View Dependent Claims (26, 27)
-
Specification