Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance

• US 20040095727A1
• Filed: 07/03/2003
• Published: 05/20/2004
• Est. Priority Date: 09/29/2000
• Status: Active Grant

• Current Assignee: Sabina J. Houle
• Original Assignee: Sabina J. Houle
• Inventors: Houle, Sabina J.
• Granted Patent: US 7,190,585 B2
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]

Abstract

A heat spreader, comprising a metal body with attached standoffs located approximately above the integrated circuit, is described. The standoffs should improve bond layer thickness control between the integrated circuit and the heat spreader, leading to a lower cost and lower mass package, as well as a more reliable device with increased thermal performance.

Claims

5. A heat spreader, comprising:

a body formed from heat conductive material; and

a non-contiguous wall structure formed around the periphery of said body.

6. The heat spreader of claim 5, wherein the heat conductive material is further plated with nickel.

7. The heat spreader of claim 5 wherein the heat conductive material is coated with a heat-conductive organic material.

8. A heat spreader, comprising:

a body formed from heat conductive material;

a wall structure formed around the periphery of said body; and

a plurality of standoffs formed on the inside surface of said body.

9. The heat spreader of claim 8, wherein the wall structure is non-contiguous.

10. The heat spreader of claim 9, wherein the heat conductive material is further plated with nickel.

11. The heat spreader of claim 9, wherein the heat conductive material is coated with a heat-conductive organic material.

12. A heat spreader, comprising:

a body formed from heat-conductive material; and

a pedestal formed on said body.

13. The heat spreader of claim 12, wherein the heat conductive material is further plated with nickel.

14. The heat spreader of claim 12, wherein the heat conductive material is coated with heat-conductive organic material.

15. A heat spreader, comprising:

a body formed from heat-conductive material;

a wall structure on the periphery of said body; and

a pedestal formed on said body.

16. The heat spreader of claim 15, wherein the heat conductive material is further plated with nickel.

17. The heat spreader of claim 15, wherein the heat conductive material is coated with a heat-conductive organic material.

18. A semiconductor package, comprising:

a substrate having a top surface;

at least one semiconductor device attached to said top surface of said substrate;

a cover secured to said substrate creating a space therebetween, said semiconductor device residing within said space, said cover having a flat top surface with standoffs attached thereon and an external bottom surface; and

said cover further comprised of a heat conductive material.

1. A heat spreader, comprising:

a body formed from heat conductive material; and

a plurality of standoffs formed on said body.

2. The heat spreader of claim 1, wherein the heat conductive material is further plated with nickel.

3. The heat spreader of claim 1, wherein the heat conductive material is further coated with heat-conductive organic material.

4. The heat spreader of claim 1, wherein the body has a plurality of mechanical attachment structures bonded to the surface.

19. The semiconductor package of claim 18, wherein the cover is a heat spreader.

20. The semiconductor package of claim 19, wherein the cover is attached to the substrate using polymeric sealant material.

21. The semiconductor package of claim 20, wherein the cover has mechanical attachment structures bonded to the surface.

22. The semiconductor package of claim 18, wherein the heat spreader is attached to the substrate using a wall structure.

22-1. The semiconductor package of claim 18, wherein the flat top surface has a pedestal.