Lowly heat-expandable laminate
First Claim
1. A low thermal expansion laminated plate obtained by curing a laminated material of fiber-reinforced layers impregnated with a thermosetting resin composition comprising a radically polymerizable resin (a), a thermoplastic resin (b), a radically polymerizable monomer (c) and an inorganic filler (d), wherein (a) is present in an amount of 10 to 75 parts by weight, (b) is present in an amount of 2 to 30 parts by weight, (c) is present in an amount of 20 to 60 parts by weight and (d) is present in an amount of 5 to 250 parts by weight, based on 100 parts by weight of the total weight of (a), (b) and (c).
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Abstract
A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150° C. is not higher than 20×10−6/° C. can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.
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Citations
9 Claims
- 1. A low thermal expansion laminated plate obtained by curing a laminated material of fiber-reinforced layers impregnated with a thermosetting resin composition comprising a radically polymerizable resin (a), a thermoplastic resin (b), a radically polymerizable monomer (c) and an inorganic filler (d), wherein (a) is present in an amount of 10 to 75 parts by weight, (b) is present in an amount of 2 to 30 parts by weight, (c) is present in an amount of 20 to 60 parts by weight and (d) is present in an amount of 5 to 250 parts by weight, based on 100 parts by weight of the total weight of (a), (b) and (c).
Specification