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Etch resist using printer technology

  • US 20040099167A1
  • Filed: 11/18/2003
  • Published: 05/27/2004
  • Est. Priority Date: 10/29/2001
  • Status: Active Grant
First Claim
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1. An inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate, comprising the steps of:

  • feeding a copper-clad substrate into the printer;

    printing an inverse circuit image on the copper-clad substrate;

    allowing the inverse circuit image to dry;

    immersing the copper-clad substrate in a tinning solution to adhere a resist mask to exposed, uninked copper to form a tinned circuit image; and

    etching the copper-clad substrate to remove copper forming the inverse circuit image.

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