Stacked low profile cooling system and method for making same

• US 20040099407A1
• Filed: 01/15/2003
• Published: 05/27/2004
• Est. Priority Date: 11/26/2002
• Status: Active Grant

• Current Assignee: The Thermotek Incorporated
• Original Assignee: The Thermotek Incorporated
• Inventors: Quisenberry, Tony, Parish, Overton L. IV
• Granted Patent: US 7,198,096 B2
• Time in Patent Office: Days
• US Class Current: 165/104.14
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.

Claims

1. A cooling system for removing heat from at least one heat generating component, said cooling system comprising:

a plurality of low profile phase plane heat pipes disposed in thermal contact one with the other, said low profile phase plane heat pipes having a plurality of micro tubes disposed therein;

a heat transfer fluid contained within said plurality of micro tubes; and

a coupling element adapted for coupling said plurality of low profile phase plane heat pipes at a first end thereof, said coupling element having a surface in thermal contact with the heat generating component.

2. The cooling system of claim 1, further comprising a fin stock in thermal contact with a portion of the outer surface of said plurality of heat pipes.

3. A method of removing heat from at least one heat generating component, comprising the steps of:

providing a plurality of phase plane heat pipes each having a plurality of micro tubes internally comprising a heat transfer fluid, and each having a first portion and a second portion;

coupling said first portions of said plurality of heat pipes in thermal contact one with the other with a coupling element to improve the thermal efficiency thereof; and

securing said coupling element adjacent to said heat generating elements.