LASER TRIMMING OF ANNULAR PASSIVE COMPONENTS

• US 20040099646A1
• Filed: 11/21/2002
• Published: 05/27/2004
• Est. Priority Date: 11/21/2002
• Status: Active Grant

• Current Assignee: Hadco Santa Clara Incorporated (Sanmina-SCI Corporation)
• Original Assignee: US Bank National Association (US Bancorp)
• Inventors: Biunno, Nicholas, Patel, Atul, Dudnikov, George, Ogle, Ken
• Granted Patent: US 6,972,391 B2
• Time in Patent Office: Days
• US Class Current: 219/121.68
• CPC Class Codes: H01C 17/242 by laser trimming by laser in general B23K26/351
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2203/171 Tuning, e.g. by trimming of printed components or high frequency circuits
• CPC Class Codes: H05K 3/027 the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Abstract

Improved systems and methods for laser trimming annular resistors printed on a circuit board are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each annular resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each annular resistor with their respective target value. The laser drill uses the laser trim files to trim the annular resistors within each bin in accordance with the laser trim file assigned to that bin.

Claims

1. A method for laser trimming annular resistors printed on a circuit board, the method comprising:

measuring a resistance value for each annular resistor;

sorting the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each annular resistor;

assigning a laser trim file to each bin based on a predictive trim formulation, each laser trim file defining a set of configuration parameters for a laser drill to conform each annular resistor with their respective target value; and

using the laser drill to trim the annular resistors within each bin in accordance with the laser trim file assigned to that bin.

2. The method of claim 1, wherein the configuration parameters defined by the laser trim file include at least a spot size and power level for the laser drill.

3. The method of claim 1, wherein the laser trim file further defines a drill pattern on the annular resistor to form a planar channel within the annular resistor.

4. The method of claim 3, wherein the laser drill file includes at least a step size, an overlap factor and number of revolutions around the annular resistor to form the planar channel.

5. The method of claim 1, further comprising:

measuring a resistance value of each trimmed annular resistor associated with a particular bin; and

adjusting the laser trim file associated with the particular bin based on a distribution of the measured resistance values of the trimmed annular resistors within the particular bin.

6. The method of claim 1, further comprising:

measuring a resistance value of each trimmed annular resistor associated with a particular bin; and

displaying a distribution of the trimmed resistance values to assess performance of the laser drill file associated with the particular bin.

7. The method of claim 1, further comprising displaying a distribution of the measured resistance values associated with each bin to assess performance of an underlying screen printing process.

8. A system for laser trimming annular resistors printed on a circuit board, the system comprising:

a tester configured to measure a resistance value for each annular resistor;

a trim application configured to;

sort the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each annular resistor; and

assign a laser trim file to each bin based on a predictive trim formulation to conform each annular resistor with their respective target value; and

a laser drill configured to trim the annular resistors within each bin in accordance with the laser trim file assigned to that bin, each laser trim file defining a set of configuration parameters for the laser drill.

9. The system of claim 8, wherein the configuration parameters defined by the laser trim file include at least a spot size and power level for the laser drill.

10. The system of claim 8, wherein the laser trim file further defines a drill pattern on the annular resistor to form a planar channel within the annular resistor.

11. The system of claim 10, wherein the laser drill file includes at least a step size, an overlap factor and number of revolutions around the annular resistor to form the planar channel.

12. The system of claim 8, wherein the tester is further configured to measure a resistance value of each trimmed annular resistor associated with a particular bin

13. The system of claim 12, wherein the laser trim application is further configured to adjust the laser trim file associated with the particular bin based on a distribution of the measured resistance values of the trimmed annular resistors within the particular bin.

14. The system of claim 12, wherein the laser trim application is further configured to display a distribution of the trimmed resistance values to assess performance of the laser drill file associated with the particular bin.

15. The system of claim 8, wherein the laser trim application is further configured to display a distribution of the measured resistance values associated with each bin to assess performance of an underlying screen printing process.