Semiconductor device, display device, and light-emitting device, and methods of manufacturing the same

• US 20040099926A1
• Filed: 11/12/2003
• Published: 05/27/2004
• Est. Priority Date: 11/22/2002
• Status: Abandoned Application

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Goto, Yuugo, Tsurume, Takuya, Takayama, Toru, Yamazaki, Shunpei
• Application Number:
  US10/704,761
• Publication Number:
  US 20040099926A1
• Time in Patent Office: Days
• US Class Current: 257/632
• CPC Class Codes: G02F 1/1362 Active matrix addressed cells G02F1/134336, G02F1/134363 take precedence
• CPC Class Codes: H01L 21/0212 the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene
• CPC Class Codes: H01L 21/022 the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides adhesion layers or buffer layers H01L21/02304, H01L21/02362
• CPC Class Codes: H01L 21/3127 Layers comprising fluoro (hydro)carbon compounds, e.g. polytetrafluoroethylene
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/80 using temporary substrates

Abstract

A semiconductor device that has the structure that is capable of preventing moisture, oxygen, or the like, from outside from penetrating, in addition to the structure that is being thin, lightweight, flexible and having a curbed surface. In the present invention, the structure that is thin, lightweight, flexible, and that has a curved surface, moreover, that is capable of preventing moisture, oxygen, or the like, from outside from penetrating is realized by means that a structure is formed in which a device formation layer is covered by a fluoroplastic film and by means that TFTs included in a device formation layer is formed of an island-like semiconductor film.

Claims

1. A semiconductor device comprising:

a device formation layer including a plurality of thin film transistors, wherein the device formation layer is covered by a fluoroplastic film.

5. A semiconductor device according to any one of claims 1, 2 and 4, wherein the device formation layer has a thickness of 50 μ

m or less.

6. A semiconductor device according to any one of claims 1, 2 and 4, wherein the fluoroplastic film comprises one selected from the group consisting of polyethylene containing fluorine, polypropylene containing fluorine, polyvinylene containing fluorine, and a copolymer of these compounds.

7. A semiconductor device according to any one of claims 1, 2 and 4, wherein the device formation layer comprises one selected from the group consisting of a CPU, an MPU, a memory, a microcomputer, and an image processor.

8. A semiconductor device according to any one of claims 1, 2 and 4, wherein the semiconductor device is one selected from the group consisting of a prepaid card, a credit card, a driver'"'"'s license, and a wearable computer.

2. A semiconductor device comprising:

a device formation layer including a plurality of thin film transistors, wherein a thermal conductive layer is formed in contact with a surface of the device formation layer, and the device formation layer is covered by a fluoroplastic film.

3. A semiconductor device according to claim 2, wherein the thermal conductive layer comprises one selected from the group consisting of aluminum nitride, aluminum nitride oxide, and DLC.

4. A semiconductor device comprising:

a device formation layer comprising a plurality of thin film transistors, the thin film transistor comprising;

a semiconductor layer over a first insulating film, the semiconductor layer comprising a source region, a drain region, and a channel formation region;

a gate electrode adjacent to the semiconductor layer with a gate insulating film interposed therebetween; and

a wiring electrically connected to at least one of the source region and the drain region;

a second insulating film formed to cover the device formation layer; and

a fluoroplastic film formed in contact with the first insulating film and the second insulating film.

9. A display device comprising:

a device formation layer comprising a plurality of thin film transistors, the thin film transistor comprising;

a semiconductor layer over a first insulating film, the semiconductor layer comprising a source region, a drain region, and a channel formation region;

a gate electrode adjacent to the semiconductor layer with a gate insulating film interposed therebetween; and

a wiring electrically connected to at least one of the source region and the drain region;

a pixel portion electrically connected to the wiring;

a second insulating film formed to cover the device formation layer; and

a fluoroplastic film formed in contact with the first insulating film and the second insulating film.

10. A display device according to claim 9, wherein the device formation layer has a thickness of 50 μ

m or less.

11. A display device according to claim 9, wherein the fluoroplastic film comprises one selected from the group consisting of polyethylene containing fluorine, polypropylene containing fluorine, polyvinylene containing fluorine, and a copolymer of these compounds.

12. A display device according to claim 9, wherein the device formation layer comprises one selected from the group consisting of a liquid crystal display device, a PDP, and an FED.

13. A display device according to claim 9, wherein the display device is one selected from the group consisting of a prepaid card, a credit card, a driver'"'"'s license, or a wearable computer.

14. A light-emitting device comprising:

a thin film transistor formed over a first insulating film;

an interlayer insulating film formed over the thin film transistor;

a first electrode electrically connected to the thin film transistor via the interlayer insulating film;

an electroluminescent film formed over the first electrode;

a second electrode formed over the electroluminescent film; and

a fluoroplastic film formed in contact with the first insulating film and the second electrode.

15. A light-emitting device according to claim 14, wherein the light-emitting device is one selected from the group consisting of a prepaid card, a credit card, a driver'"'"'s license, and a wearable computer.

16. A method for manufacturing a semiconductor device comprising:

forming a device formation layer including a plurality of thin film transistors over a first substrate;

forming a first adhesive layer in contact with the device formation layer;

bonding a second substrate to the first adhesive layer, and sandwiching the device formation layer between the first substrate and the second substrate;

splitting and removing the first substrate from the device formation layer by a physical means;

forming a first fluoroplastic film over an exposed surface by sputtering;

bonding a third substrate to the first fluoroplastic film with a second adhesive layer interposed therebetween;

splitting and removing the first adhesive layer and the second substrate from the device formation layer;

forming a second fluoroplastic film over an exposed surface of the device formation layer by sputtering; and

splitting and removing the second adhesive layer and the third substrate from the device formation layer.

18. A method for manufacturing a semiconductor device according to claim 16 or 17, wherein the first adhesive layer and the second adhesive layer use a material that its adhesiveness weaken by light irradiation or a material that is soluble in water.

17. A method for manufacturing a semiconductor device comprising:

forming a metal layer over a first substrate;

forming an oxide layer over the metal layer;

forming a first insulating film over the oxide layer;

forming an amorphous semiconductor film containing hydrogen over the first insulating film;

heating the semiconductor film for diffusing hydrogen;

forming a device formation layer including a plurality of thin film transistors using the semiconductor film;

forming a first adhesive layer in contact with the device formation layer, bonding a second substrate to the first adhesive layer, and sandwiching the device formation layer between the first substrate and the second substrate;

splitting and removing the first substrate and the metal layer from the device formation layer by a physical means;

forming a first fluoroplastic film over an exposed surface of the device formation layer by sputtering;

bonding a third substrate to the first fluoroplastic film with a second adhesive layer interposed therebetween;

splitting and removing the first adhesive layer and the second substrate from the device formation layer;

forming a second fluoroplastic film over an exposed surface of the device formation layer by sputtering; and

splitting and removing the second adhesive layer and the third substrate from the device formation layer.

19. A method for manufacturing a display device comprising:

forming a metal layer over a first substrate;

forming an oxide layer over the metal layer;

forming a first insulating film over the oxide layer;

forming an amorphous semiconductor film containing hydrogen over the first insulating film;

heating the semiconductor film for diffusing hydrogen;

forming a thin film transistor using the semiconductor film;

forming a first electrode electrically connected to the thin film transistor via an interlayer insulating film;

forming a first adhesive layer in contact with the first electrode;

bonding a second substrate to the first adhesive layer;

splitting and removing the first substrate and the metal layer from an interface between the metal layer and the first insulating film by a physical means;

forming a first fluoroplastic film over an exposed surface by sputtering;

bonding a third substrate to the first fluoroplastic film with a second adhesive layer interposed therebetween;

splitting and removing the first adhesive layer and the second substrate from a surface of the first electrode;

forming a device including the first electrode over an exposed surface of the first electrode by sputtering;

forming a second fluoroplastic film over the device by sputtering; and

splitting and removing the second adhesive layer and the third substrate from the first fluoroplastic film.

20. A method for manufacturing a light-emitting device comprising:

forming a metal layer over a first substrate;

forming an oxide layer over the metal layer;

forming a first insulating film over the oxide layer;

forming an amorphous semiconductor film containing hydrogen over the first insulating film;

heating the semiconductor film for diffusing hydrogen;

forming a thin film transistor using the semiconductor film;

forming a first electrode electrically connected to the thin film transistor via an interlayer insulating film;

forming a first adhesive layer in contact with the first electrode;

bonding a second substrate to the first adhesive layer;

splitting and removing the first substrate and the metal layer from an interface between the metal layer and the first insulating film by a physical means;

forming a first fluoroplastic film over an exposed surface by sputtering;

bonding a third substrate to the first fluoroplastic film with a second adhesive layer interposed therebetween;

splitting and removing the first adhesive layer and the second substrate from a surface of the first electrode;

forming an electroluminescent film over an exposed surface of the first electrode;

forming a second electrode over the electroluminescent film;

forming a second fluoroplastic film over the second electrode by sputtering; and

splitting and removing the second adhesive layer and the third substrate from the first fluoroplastic film.