Image sensor and digital camera
First Claim
1. A color solid-state image pickup device including a plurality of photoelectric conversion areas provided in an array pattern on a surface of a semiconductor substrate, wherein the inside of each of said photoelectric conversion areas is two-dimensionally partitioned into a plurality of segments which output a plurality of photoelectric conversion signals of different spectral sensitivities.
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Accused Products
Abstract
A color solid-state image pickup device includes a plurality of photoelectric conversion areas provided in an array pattern on a surface of a semiconductor substrate. The inside of each of photoelectric conversion areas 10 is two-dimensionally partitioned into a plurality of segments R, G1, G2, and B which output a plurality of photoelectric conversion signals of different spectral sensitivities. As a result, occurrence of a false signal and a false color is suppressed, and high-sensitivity, high-resolution image data having superior color reproducibility can be obtained.
314 Citations
44 Claims
- 1. A color solid-state image pickup device including a plurality of photoelectric conversion areas provided in an array pattern on a surface of a semiconductor substrate, wherein the inside of each of said photoelectric conversion areas is two-dimensionally partitioned into a plurality of segments which output a plurality of photoelectric conversion signals of different spectral sensitivities.
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2. A color solid-state image pickup device including a plurality of photoelectric conversion areas provided in an array pattern on a surface of a semiconductor substrate, wherein an inside of each of said photoelectric conversion areas is two-dimensionally partitioned into a plurality of segments which store signal electric charges of different spectral sensitivities, and transfer channels are formed beside said photoelectric conversion areas for transferring said signal electric charges read from a plurality of said segments.
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19. A MOS image sensor having a plurality of photoelectric conversion areas provided in an array pattern on a surface of a semiconductor substrate, wherein
an inside of each of said photoelectric conversion areas is two-dimensionally partitioned into a plurality of segments which output photoelectric conversion signals having a plurality of different spectral sensitivities, and peripheral circuits connected to said segments are arranged around said photoelectric conversion areas.
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43. An image pickup device including image capturing means for outputting a plurality of photoelectric conversion signals of different spectral sensitivities, wherein said image capturing means includes a plurality of photoelectric conversion areas provided in an array pattern on a surface of a semiconductor substrate, inside of each of said photoelectric conversion areas being two-dimensionally partitioned into a plurality of segments.
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44. An image pickup device for outputting a plurality of photoelectric conversion signals of different spectral sensitivities comprising:
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signal storing means for storing electric charges of different spectral sensitivities in a plurality of segments which are partitioned by dividing an inside of a plurality of photoelectric conversion areas being formed in an array pattern on a surface of a semiconductor substrate, and signal transfer means for transferring said electric charges read from a plurality of said segments through channels being formed beside said photoelectric conversion areas.
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Specification