Spatial light modulators with light blocking/absorbing areas

• US 20040100677A1
• Filed: 11/26/2002
• Published: 05/27/2004
• Est. Priority Date: 12/07/2000
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Reflectivity, Inc. (Texas Instruments, Inc.)
• Inventors: Patel, Satyadev R., Huibers, Andrew G.
• Granted Patent: US 6,906,847 B2
• Time in Patent Office: Days
• US Class Current: 359/290
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: B81C 1/00896 Temporary protection during separation into individual elements
• CPC Class Codes: B81C 1/00904 Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01018 Argon [Ar]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01041 : Niobium [Nb]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01054 : Xenon [Xe]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A projection system, a spatial light modulator, and a method for forming a micromirror array such as for a projection display are disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micro-mirror array. The two substrates can be bonded at the wafer level after depositing a getter material and/or solid or liquid lubricant on one or both of the wafers if desired. In one embodiment of the invention, one of the substrates is a light transmissive substrate and a light absorbing layer is provided on the light transmissive substrate to selectively block light from passing through the substrate. The light absorbing layer can form a pattern, such as a frame around an array of micro-mirrors.

Claims

1. A method for making a spatial light modulator, comprising:

providing a first substrate that is transmissive to visible light;

providing a second substrate having an array of circuitry and electrodes thereon;

depositing a light absorbing layer on the first substrate to selectively block the passage of light through the first substrate;

forming an array of deflectable reflective elements on the first or second substrate; and

positioning the first and second substrates proximate to each other to form a substrate assembly.

2. The method of claim 1, wherein the positioning of the first and second substrates proximate to each other comprises bonding the first and second substrates together to form the substrate assembly followed by singulating the substrate assembly into a set of assembly dies, each of which comprises a plurality of deflectable reflective elements.

3. The method of claim 2, wherein the deflectable reflective elements correspond to pixels in a direct-view or projection display.

4. The method of claim 1, wherein the light absorbing layer is formed as a rectangular frame on the first substrate surrounding the array of deflectable reflective elements

5. The method of claim 4, wherein light absorbing material is deposited on the first substrate to further form areas that decrease the amount of light that enters gaps between the deflectable elements.

6. The method of claim 1, wherein the light absorbing layer is formed as strips, frames or a grid on the first substrate fully or partially surrounding each deflectable element, when viewed from above, so as to decrease light that enters gaps between adjacent deflectable elements.

7. The method of claim 4, wherein the light absorbing layer is deposited prior to forming the array of deflectable reflective elements and prior to

8. The method of claim 4, wherein the light absorbing layer is deposited after forming the array of deflectable reflective elements.

9. The method of claim 1, wherein the light absorbing layer is black.

10. The method of claim 1, wherein the light absorbing layer absorbs at least 50% of the light in areas where the light absorbing layer is disposed.

11. The method of claim 10, wherein the light absorbing layer absorbs at least 75% of the light in areas where the light absorbing layer is disposed.

12. The method of claim 11, wherein the light absorbing layer absorbs at least 85% of the light in areas where the light absorbing layer is disposed.

13. The method of claim 1, wherein the light absorbing layer is a light absorbing matrix.

14. The method of claim 13, wherein the number of reflective elements in each die is from 6,000 to about 6 million.

15. The method of claim 1, wherein the first substrate is an optically transmissive substrate or a substrate having one or more layers that when removed result in an optically transmissive substrate in areas other than in the area of the light absorbing layer.

16. The method of claim 15, wherein the first substrate is glass, borosilicate, tempered glass, quartz or sapphire.

17. The method of claim 1, wherein the second substrate is a dielectric or semiconductor substrate.

18. The method of claim 17, wherein the second substrate comprises GaAs or silicon.

19. The method of claim 1, wherein the first and second substrates are bonded together with an adhesive.

20. The method of claim 19, wherein the adhesive is an epoxy.

21. The method of claim 20, wherein the epoxy comprises balls or rods of predetermined diameter.

22. The method of claim 1, wherein the substrate assembly is separated into individual dies by scribing and breaking.

23. The method of claim 1, wherein the substrate assembly is tested for abnormalities prior to separation into the individual dies.

24. The method of claim 1, further comprising providing a spacing substrate between the first and second substrates.

25. The method of claim 1, further comprising providing microfabricated spacers on one or both of the first and second substrates prior to bonding.

26. The method of claim 19, wherein the adhesive is dispensed by automated controlled liquid dispensing through a syringe.

27. The method of claim 19, wherein the adhesive is dispensed by screen, offset or roller printing.

28. The method of claim 26, wherein the syringe is moved along X-Y coordinates for dispensing.

29. The method of claim 1, wherein the first and second substrates are aligned prior to bonding, the aligning comprises registration of substrate fiducials on opposite substrates.

30. The method of claim 29, wherein the registration is accomplished with a video camera having lens magnification.

31. The method of claim 27, wherein the second substrate is a glass or quartz substrate.

32. The method of claim 1, wherein the bonding of the substrates comprises the dispensing of a UV or thermal cure epoxy.

33. The method of claim 32, wherein the bonding further comprises application of a force of 10 kg force or more.

34. The method of claim 1, wherein the aligning comprises aligning each deflectable element on the first substrate with at least one electrode on the second substrate.

35. The method of claim 1, wherein the separation of the substrate assembly comprises forming scribes on the first and second substrates.

36. The method of claim 35, wherein the scribes are placed in an offset relationship to each other in at least one direction.

37. The method of claim 35, wherein the separation further comprises breaking the substrate assembly along the scribe lines with a guillotine or fulcrum breaking machine.

38. The method of claim 2, further wherein the singulation of the substrate assembly comprises sawing partially through each substrate followed by breaking along the sawed lines.

39. The method of claim 38, wherein the sawing is done in the presence of a high-pressure jet of water.

40. The method of claim 1, wherein the bonding comprises applying a sealant near the perimeter of each array on the substrate.

41. The method of claim 40, further comprising applying a sealant around the perimeter of at least one of the substrates.

42. The method of claim 1, wherein the bonding comprises applying an adhesive and spacers, the spacers having a size of from 1 to 100 microns.

43. The method of claim 42, wherein the spacers have a size of from 1 to 20 microns.

44. The method of claim 1, wherein the plurality of deflectable elements are reflective mirror elements and are formed on the second substrate which is a light transmissive substrate when in use except in areas of the light absorbing layer.

45. The method of claim 25, wherein the microfabricated spacers comprise an organic material.

46. The method of claim 42, wherein the spacers are glass or plastic spacers.

47. The method of claim 25, wherein a plurality of microfabricated spacers are disposed throughout the array of deflectable elements.

48. The method of claim 1, wherein the plurality of deflectable elements are formed on the second substrate.

49. The method of claim 48, wherein the circuitry and plurality of electrodes are formed prior to forming the plurality of deflectable elements, wherein the plurality of deflectable elements are formed above the plurality of electrodes on the second substrate.

50. The method of claim 49, wherein a plurality of light absorbing masks are formed on the first substrate.

51. The method of claim 50, wherein when the substrate assembly is singulated into substrate assembly dies, a light absorbing mask is disposed on a first substrate portion within each substrate assembly die.

52. The method of claim 1, wherein the plurality of deflectable elements are formed on the first substrate.

53. The method of claim 52, wherein when the first and second substrates are aligned and bonded together, the deflectable elements on the first substrate are each disposed proximate to a corresponding electrode on the second substrate.

54. The method of claim 1, further comprising packaging the substrate assembly dies.

55. The method of claim 1, wherein the deflectable elements are micromirrors having jagged or zig-zag edges.

56. The method of claim 1, further comprising applying a stiction reducing agent to one or both substrates before or after bonding the two substrates together, but before singulating the substrate assembly into dies.

57. The method of claim 1, further comprising applying a getter to one or both substrates before bonding the two substrates together into a substrate assembly.

58. The method of claim 57, wherein the getter is a molecular, hydrogen and/or particle getter.

59. The method of claim 57, wherein the getter is a particulate and moisture getter.

60. The method of claim 57, wherein the getter is capable of absorbing moisture.

61. The method of claim 56, wherein the stiction reducing agent is a silane applied to the deflectable elements.

62. The method of claim 56, wherein the stiction reducing agent is a chlorosilane.

63. The method of claim 1, further comprising aligning the substrates prior to bonding and singulating the bonded substrates into multiple bonded substrate die portions.

64. The method of claim 63, wherein the aligning of the substrates has an accuracy of 1 micron or less.

65. The method of claim 2, further comprising the singulated die into a projection system that comprises a light source, a color sequencer and projection optics.

66. The method of claim 1, wherein the light absorbing layer is provided as a grid or matrix on the light transmissive substrate.

67. The method of claim 1, wherein the light absorbing layer is provided as strips or bands on the light transmissive substrate.

68. The method of claim 1, wherein the light absorbing layer is black nickel or black chrome.

69. The method of claim 1, wherein the light absorbing layer is a black or dark colored metal or metal alloy.

70. The method of claim 1, wherein the light absorbing layer is a carbon containing polymer.

71. The method of claim 1, wherein the light absorbing layer is deposited by sputtering.

72. The method of claim 1, wherein the light absorbing layer is a carbon containing film.

73. The method of claim 1, wherein the light absorbing layer comprises a carbon compound.

74. The method of claim 1, wherein the light absorbing layer is a multilayer laminate.

75. The method of claim 1, wherein the light transmissive substrate comprises an AR coating on a surface opposite to the surface having the light absorbing layer.

76. The method of claim 1, wherein the light absorbing layer is a light absorbing frame around each die area.

77. The method of claim 1, wherein the light absorbing layer is a light absorbing frame surrounding each micro-mirror.

78. The method of claim 1, wherein the light absorbing layer comprises a plurality of light blocking strips, each of which are proximate to a gap between adjacent micromirrors.

79. The method of claim 76, wherein the light absorbing layer is a set of light absorbing frames, each of which surrounding a micro-mirror.

80. The method of claim 79, wherein the light absorbing frame surrounding each micromirror is on the same side of the first substrate as the micromirrors.

81. The method of claim 80, wherein the light absorbing frame is on a side of the first substrate opposite to the side on which the micromirrors are formed.

82. The method of claim 1, wherein the first substrate is bonded to the second substrate at a distance of 75 microns or less from the second substrate.

83. The method of claim 82, wherein the first substrate is bonded to the second substrate at a distance of less than 10 microns from the second substrate.

84. The method of claim 83, wherein the first substrate is bonded to the second substrate at a distance of from 1 to 10 microns from the second substrate.

85. The method of claim 82, wherein the first substrate is a glass or quartz substrate and the second substrate is a silicon substrate and wherein the substrates are bonded together by an organic or hybrid organic-inorganic adhesive.

86. A spatial light modulator, comprising:

a first substrate that is transmissive to visible light;

a second substrate having an array of circuitry and electrodes thereon;

a light absorbing layer on the first substrate disposed to selectively block the passage of light through the first substrate; and

an array of deflectable reflective elements on the first or second substrate;

wherein the first and second substrates are positioned proximate to each other as a substrate assembly.

87. The spatial light modulator of claim 86, wherein the reflective elements correspond to pixels in a direct-view or projection display.

88. The spatial light modulator of claim 86, wherein the light absorbing layer is formed as a rectangular frame on the first substrate surrounding the array of deflectable reflective elements as viewed from above.

89. The spatial light modulator of claim 88, wherein a further light absorbing area is formed as strips, frames or a grid for blocking light between adjacent deflectable elements.

90. The spatial light modulator of claim 86, wherein the first and second substrates are bonded together.

91. The spatial light modulator of claim 86, wherein the light absorbing layer is black.

92. The spatial light modulator of claim 86, wherein the light absorbing layer absorbs at least 50% of the light in areas where the light absorbing layer is disposed.

93. The spatial light modulator of claim 92, wherein the light absorbing layer absorbs at least 75% of the light in areas where the light absorbing layer is disposed.

94. The spatial light modulator of claim 93, wherein the light absorbing layer absorbs at least 85% of the light in areas where the light absorbing layer is disposed.

95. The spatial light modulator of claim 86, wherein the light absorbing layer is a light absorbing matrix.

96. The spatial light modulator of claim 95, wherein the number of reflective elements in a die area is from 6,000 to about 6 million.

97. The spatial light modulator of claim 86, wherein the first substrate is an optically transmissive substrate in areas other than in the area of the light absorbing layer.

98. The spatial light modulator of claim 97, wherein the first substrate is glass, borosilicate, tempered glass, quartz or sapphire.

99. The spatial light modulator of claim 86, wherein the second substrate is a glass or quartz substrate.

100. The spatial light modulator of claim 86, wherein the second substrate is a dielectric or semiconductor substrate.

101. The spatial light modulator of claim 100, wherein the second substrate comprises GaAs or silicon.

102. The spatial light modulator of claim 86, wherein the first and second substrates are bonded together with an adhesive.

103. The spatial light modulator of claim 86, wherein the second substrate is a glass substrate.

104. The spatial light modulator of claim 86, wherein the plurality of deflectable elements are reflective mirror elements and are held on the second substrate which is a light transmissive substrate.

105. The spatial light modulator of claim 86, wherein the plurality of deflectable elements are formed on the second substrate.

106. The spatial light modulator of claim 105, wherein the circuitry and plurality of electrodes are disposed on the second substrate, wherein the plurality of deflectable elements are formed spaced above the plurality of electrodes on the second substrate.

107. The spatial light modulator of claim 106, wherein a plurality of light absorbing masks are formed on the first substrate.

108. The spatial light modulator of claim 107, wherein the substrate assembly is a substrate assembly die having a light absorbing mask disposed on a first substrate portion within the substrate assembly die.

109. The spatial light modulator of claim 86, wherein the plurality of deflectable elements are formed on the first substrate.

110. The spatial light modulator of claim 86, wherein the deflectable elements are micromirrors having jagged or zig-zag edges.

111. The spatial light modulator of claim 86, further comprising a stiction reducing agent on one or both substrates.

112. The spatial light modulator of claim 86, further comprising a getter on one or both substrates.

113. The spatial light modulator of claim 112, wherein the getter is a molecular, hydrogen and/or particle getter.

114. The spatial light modulator of claim 112, wherein the getter is a particulate and moisture getter.

115. The spatial light modulator of claim 112, wherein the getter is capable of absorbing moisture.

116. The spatial light modulator of claim 86, wherein the light absorbing layer is provided as strips or bands on the light transmissive substrate.

117. The spatial light modulator of claim 86, wherein the light absorbing layer is black nickel or black chrome.

118. The spatial light modulator of claim 86, wherein the light absorbing layer is a black or dark colored metal or metal alloy.

119. The spatial light modulator of claim 86, wherein the light absorbing layer is a carbon containing polymer.

120. The spatial light modulator of claim 86, wherein the light absorbing layer is deposited by sputtering.

121. The spatial light modulator of claim 86, wherein the light absorbing layer is a carbon containing film.

122. The spatial light modulator of claim 86, wherein the light absorbing layer comprises a carbon compound.

123. The spatial light modulator of claim 86, wherein the light absorbing layer is a multilayer laminate.

124. The spatial light modulator of claim 86, wherein the light transmissive substrate comprises an AR coating on a surface opposite to the surface having the light absorbing layer.

125. The spatial light modulator of claim 86, wherein the light absorbing layer is a light absorbing frame around each die area.

126. The spatial light modulator of claim 86, wherein the light absorbing layer is a light absorbing frame surrounding each micro-mirror.

127. The spatial light modulator of claim 86, wherein the light absorbing layer comprises light absorbing strips proximate to gaps between adjacent micromirrors.

128. The spatial light modulator of claim 125, wherein the light absorbing layer is a light absorbing frame surrounding each micromirror.

129. The spatial light modulator of claim 128, wherein the light absorbing frame surrounding each micromirror is on the same side of the first substrate as the micromirrors.

130. The spatial light modulator of claim 129, wherein the light absorbing frame surrounding each die is on a side of the first substrate opposite to the side on which the micromirrors are formed.

131. The spatial light modulator of claim 86, wherein the first substrate is bonded to the second substrate at a distance of 75 microns or less from the second substrate.

132. The spatial light modulator of claim 131, wherein the first substrate is bonded to the second substrate at a distance of less than 10 microns from the second substrate.

133. The spatial light modulator of claim 132, wherein the first substrate is bonded to the second substrate at a distance of from 1 to 10 microns from the second substrate.

134. A projection system, comprising:

a light source;

a spatial light modulator for reflecting a beam of light from the light source; and

projection optics for projecting light reflected off of the spatial light modulator;

wherein the spatial light modulator comprises;

a first substrate that is transmissive to visible light;

a second substrate having an array of circuitry and electrodes thereon;

a light absorbing layer on the first substrate disposed to selectively block the passage of light through the first substrate; and

an array of deflectable reflective elements on the first or second substrate;

wherein the first and second substrates are positioned proximate to each other as a substrate assembly.

135. The projection system of claim 134, wherein the reflective elements correspond to pixels in a direct-view or projection display.

136. The projection system of claim 134, wherein the light absorbing layer is formed as a rectangular frame on the first substrate surrounding the array of deflectable reflective elements.

137. The projection system of claim 136, further comprising light absorbing material disposed as frames or a grid for absorbing light blocking light between each deflectable element.

138. The projection system of claim 134, wherein the light absorbing layer is formed as a grid on the first substrate surrounding each deflectable element, and as a rectangular frame on the first substrate surrounding the array of deflectable reflective elements.

139. The projection system of claim 134, wherein the light absorbing layer is black.

140. The projection system of claim 134, wherein the light absorbing layer absorbs at least 50% of the light in areas where the light absorbing layer is disposed.

141. The projection system of claim 140, wherein the light absorbing layer absorbs at least 75% of the light in areas where the light absorbing layer is disposed.

142. The projection system of claim 141, wherein the light absorbing layer absorbs at least 85% of the light in areas where the light absorbing layer is disposed.

143. The projection system of claim 134, wherein the light absorbing layer is a light absorbing matrix.

144. The projection system of claim 143, wherein the number of reflective elements in a die area is from 6,000 to about 6 million.

145. The projection system of claim 134, wherein the first substrate is an optically transmissive substrate in areas other than in the area of the light absorbing layer.

146. The projection system of claim 145, wherein the first substrate is glass, borosilicate, tempered glass, quartz or sapphire.

147. The projection system of claim 134, wherein the second substrate is a glass or quartz substrate.

148. The projection system of claim 134, wherein the second substrate is a dielectric or semiconductor substrate.

149. The projection system of claim 148, wherein the second substrate comprises GaAs or silicon.

150. The projection system of claim 134, wherein the first and second substrates are bonded together with an adhesive.

151. The projection system of claim 134, wherein the first substrate is a glass substrate.

152. The projection system of claim 134, wherein the plurality of deflectable elements are reflective mirror elements and are held on the second substrate which is a light transmissive substrate.

153. The projection system of claim 134, wherein the plurality of deflectable elements are formed on the second substrate.

154. The projection system of claim 153, wherein the circuitry and plurality of electrodes are disposed on the second substrate, wherein the plurality of deflectable elements are formed spaced above the plurality of electrodes on the second substrate.

155. The projection system of claim 154, wherein a plurality of light absorbing masks are formed on the first substrate.

156. The projection system of claim 155, wherein the substrate assembly is a substrate assembly die having a light absorbing mask disposed on a first substrate portion within the substrate assembly die.

157. The projection system of claim 134, wherein the plurality of deflectable elements are formed on the first substrate.

158. The projection system of claim 134, wherein the deflectable elements are micromirrors having jagged or zig-zag edges.

159. The projection system of claim 134, further comprising a stiction reducing agent on one or both substrates.

160. The projection system of claim 134, further comprising a getter on one or both substrates.

161. The projection system of claim 160, wherein the getter is a molecular, hydrogen and/or particle getter.

162. The projection system of claim 160, wherein the getter is a particulate and moisture getter.

163. The projection system of claim 160, wherein the getter is capable of absorbing moisture.

164. The projection system of claim 136, wherein the light absorbing layer is provided as strips or bands on the light transmissive substrate.

165. The projection system of claim 134, wherein the light absorbing layer is black nickel or black chrome.

166. The projection system of claim 134, wherein the light absorbing layer is a black or dark colored metal or metal alloy.

167. The projection system of claim 134, wherein the light absorbing layer is a carbon containing polymer.

168. The projection system of claim 134, wherein the light absorbing layer is deposited by sputtering.

169. The projection system of claim 134, wherein the light absorbing layer is a carbon containing film.

170. The projection system of claim 134, wherein the light absorbing layer comprises a carbon compound.

171. The projection system of claim 134, wherein the light absorbing layer is a multilayer laminate.

172. The projection system of claim 134, wherein the light transmissive substrate comprises an AR coating on a surface opposite to the surface having the light absorbing layer.

173. The projection system of claim 134, wherein the light absorbing layer is a light absorbing frame around each die area.

174. The projection system of claim 134, wherein the light absorbing layer is a light absorbing frame surrounding each micromirror.

175. The projection system of claim 134, wherein the light absorbing layer comprises light absorbing strips proximate to gaps between adjacent micromirrors.

176. The projection system of claim 173, wherein the light absorbing layer is a light absorbing frame surrounding each micromirror.

177. The projection system of claim 176, wherein the light absorbing frame surrounding each micromirror is on the same side of the first substrate as the micromirrors.

178. The projection system of claim 177, wherein the light absorbing frame surrounding each die is on a side of the first substrate opposite to the side on which the micromirrors are formed.

179. The projection system of claim 134, wherein the first substrate is bonded to the second substrate at a distance of 75 microns or less from the second substrate.

180. The projection system of claim 179, wherein the first substrate is bonded to the second substrate at a distance of less than 10 microns from the second substrate.

181. The projection system of claim 180, wherein the first substrate is bonded to the second substrate at a distance of from 1 to 10 microns from the second substrate.

182. A method for making a spatial light modulator, comprising:

providing a first substrate and a second substrate;

forming an array of circuitry and electrodes on the second substrate;

forming a plurality of strips or frame areas on the first substrate to absorb at least 50% of the light incident on the strips or frame areas;

forming an array of deflectable reflective elements on the first or second substrate; and

bonding the first and second substrates together to form a substrate assembly.

183. A spatial light modulator, comprising:

a first substrate and a second substrate;

an array of circuitry and electrodes on the second substrate;

an opaque layer that forms a pattern on the first substrate in order to absorb at least 50% of the light that is incident on the opaque layer; and

an array of deflectable reflective elements on the first or second substrate;

wherein the first and second substrates are positioned proximate to each other as a substrate assembly.

184. A spatial light modulator comprising:

a first substrate and a second substrate disposed proximate to each other;

circuitry, electrodes and micromirrors formed on the second substrate; and

wherein the first substrate is a substrate transmissive to visible light and is disposed at a distance from the first substrate of 75 microns or less.

185. The spatial light modulator of claim 184, wherein the first substrate is disposed at a distance of 50 microns or less from the second substrate.

186. The spatial light modulator of claim 185, wherein the first substrate is disposed at a distance of 10 microns or less from the second substrate.

187. The spatial light modulator of claim 184, wherein the first and second substrates are bonded together.

188. The spatial light modulator of claim 187, wherein a light absorbing layer is present on the light transmissive substrate and is disposed to selectively block the passage of light through the light transmissive substrate;

189. The spatial light modulator of claim 184, wherein the micromirrors correspond to pixels in a direct-view or projection display.

190. The spatial light modulator of claim 188, wherein the light absorbing layer is formed as a rectangular frame on the first substrate surrounding the array of deflectable reflective elements.

191. The spatial light modulator of claim 190, wherein the light absorbing layer is further formed as a grid for blocking light between each deflectable element.

192. The spatial light modulator of claim 188, wherein the light absorbing layer is formed as strips, frames, or a grid on the first substrate surrounding each deflectable element to decrease light that enters between adjacent deflectable elements, and as a rectangular frame on the first substrate surrounding the array of deflectable reflective elements.

193. The spatial light modulator of claim 188, wherein the light absorbing layer is black.

194. The spatial light modulator of claim 188, wherein the light absorbing layer absorbs at least 50% of the light incident thereon.

195. The spatial light modulator of claim 194, wherein the light absorbing layer blocks at least 75% of the light incident thereon.

196. The spatial light modulator of claim 195, wherein the light absorbing layer blocks at least 85% of the light incident thereon.

197. The spatial light modulator of claim 188, wherein the light absorbing layer is a light absorbing matrix.

198. The spatial light modulator of claim 197, wherein the number of reflective elements in a die area is from 6,000 to about 6 million.

199. A projection system, comprising:

a light source;

a spatial light modulator for reflecting a beam of light from the light source; and

a series of projection optics for projecting light reflected off of the spatial light modulator;

wherein the spatial light modulator comprises;

a first substrate and a second substrate within or forming a MEMS package; and

an array of circuitry, electrodes and micromirrors on the second substrate; and

wherein the first substrate is a substrate transmissive to visible light and is disposed at a distance from the first substrate of 75 microns or less.