Interwoven manifolds for pressure drop reduction in microchannel heat exchangers

• US 20040104010A1
• Filed: 05/16/2003
• Published: 06/03/2004
• Est. Priority Date: 11/01/2002
• Status: Active Grant

• Current Assignee: Vertiv Corporation (Vertiv Holdings Co.)
• Original Assignee: Cooligy Incorporated (Emerson Electric Company)
• Inventors: Munch, Mark, Zhou, Peng, Corbin, David, Upadhya, Girish, Goodson, Kenneth, Kenny, Thomas W., Shook, James Gill
• Granted Patent: US 6,986,382 B2
• Time in Patent Office: Days
• US Class Current: 165/80.4
• CPC Class Codes: F04B 19/006 Micropumps F04B43/043 and F04B43/095 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

Claims

1. A heat exchanger comprising:

a. an interface layer for cooling a heat source, wherein the interface layer is configured to pass fluid therethrough; and

b. a manifold layer for circulating fluid to and from the interface layer, the manifold layer having a first set fingers and a second set of fingers, wherein the first set of fingers are disposed in parallel with the second set of fingers and arranged to reduce pressure drop within the heat exchanger.

2. The heat exchanger according to claim 1 wherein the fluid is in single phase flow condition.

3. The heat exchanger according to claim 1 wherein the fluid is in two phase flow fluid conditions.

4. The heat exchanger according to claim 1 wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the interface layer.

5. The heat exchanger according to claim 1 wherein a particular finger in the first set is spaced apart by an appropriate dimension from a particular finger in the second set to minimize the pressure drop in the heat exchanger.

6. The heat exchanger according to claim 1 wherein each of the fingers have the same length and width dimensions.

7. The heat exchanger according to claim 1 wherein at least one of the fingers has a different dimension than the remaining fingers.

8. The heat exchanger according to claim 1 wherein the fingers are arranged non-periodically in at least one dimension in the manifold layer.

9. The heat exchanger according to claim 1 wherein at least one of the fingers has at least one varying dimension along a length of the manifold layer.

10. The heat exchanger according to claim 1 wherein the manifold layer includes more than three and less than 10 parallel fingers.

11. The heat exchanger according to claim 1 wherein the fingers in the first set and second set are alternately disposed along a dimension of the manifold layer.

12. The heat exchanger according to claim 1 wherein the manifold layer is configured to cool at least one interface hot spot region.

13. The heat exchanger according to claim 1 further comprising at least one first port in communication with the first set of fingers, wherein fluid enters the heat exchanger through the at least one first port.

14. The heat exchanger according to claim 13 further comprising at least one second port in communication with the second set of fingers, wherein fluid exits the heat exchanger through the at least one second port.

15. The heat exchanger according to claim 1 wherein the manifold layer is positioned above the interface layer, wherein fluid flows downward through the first set of fingers and upward though the second set of fingers.

16. The heat exchanger according to claim 13 further comprising a first port passage in communication with the first port and the first set of fingers, the first port passage configured to channel fluid from the first port to the first set of fingers.

17. The heat exchanger according to claim 16 further comprising a second port passage in communication with the second port and the second set of fingers, the second port passage configured to channel fluid from the second set of fingers to the second port.

18. The heat exchanger according to claim 1 wherein the interface layer is integrally formed with the heat source.

19. The heat exchanger according to claim 1 wherein the interface layer is coupled to the heat source.

20. The heat exchanger according to claim 1 further comprising an intermediate layer for channeling fluid to and from one or more predetermined positions in the interface layer via at least one conduit, the intermediate layer positioned between the interface layer and the manifold layer.

21. The heat exchanger according to claim 20 wherein the intermediate layer is coupled to the interface layer and the manifold layer.

22. The heat exchanger according to claim 20 wherein the intermediate layer is integrally formed with the interface layer and the manifold layer.

23. The heat exchanger according to claim 20 wherein the at least one conduit has at least one varying dimension along the intermediate layer.

24. The heat exchanger according to claim 1 wherein the interface layer includes a coating thereupon, wherein the coating provides an appropriate thermal conductivity of at least 20 W/m-K.

25. The heat exchanger according to claim 1 wherein the interface layer has a thermal conductivity is at least 20 W/m-K.

26. The heat exchanger according to claim 1 further comprising a plurality of pillars configured in a predetermined pattern along the interface layer.

27. The heat exchanger according to claim 1 wherein the interface layer has a roughened surface.

28. The heat exchanger according to claim 1 wherein the interface layer includes a micro-porous structure disposed thereon.

29. The heat exchanger according to claim 1 further comprises a plurality of microchannels configured in a predetermined pattern along the interface layer.

30. The heat exchanger according to claim 29 wherein the plurality of microchannels are coupled to the interface layer.

31. The heat exchanger according to claim 29 wherein the plurality of microchannels are integrally formed with the interface layer.

32. The heat exchanger according to claim 29 wherein the plurality of microchannels are divided into segmented arrays with at least one groove disposed therebetween, wherein the at least one groove is aligned with a corresponding finger.

33. The heat exchanger according to claim 29 wherein the plurality of microchannels include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 20 W/m-K.

34. A heat exchanger for cooling a heat source comprising:

a. a manifold layer including a first set of fingers in a first configuration, wherein each finger in the first set channels fluid at a first temperature, the manifold layer further including a second set of fingers in a second configuration, wherein each finger in the second set channels fluid at a second temperature, the first set and second set of fingers arranged parallel to each other; and

b. an interface layer configured to receive fluid at the first temperature at a plurality of first locations, wherein each first location is associated with a corresponding finger in the first set, the interface layer passing fluid along a plurality of predetermined paths to a plurality of second locations, wherein each second location is associated with a corresponding finger in the second set.

35. The heat exchanger according to claim 34 wherein the fluid is in single phase flow conditions.

36. The heat exchanger according to claim 34 wherein the fluid is in two phase flow conditions.

37. The heat exchanger according to claim 34 wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the interface layer.

38. The heat exchanger according to claim 34 wherein a particular finger in the first set is spaced apart by an appropriate dimension from a particular finger in the second set, wherein the appropriate dimension reduces the pressure drop in the heat exchanger.

39. The heat exchanger according to claim 34 further comprising at least one first port in communication with the first set of fingers, wherein fluid enters the heat exchanger through the at least one first port.

40. The heat exchanger according to claim 39 further comprising at least one second port in communication with the second set of fingers, wherein fluid exits the heat exchanger through the at least one second port.

41. The heat exchanger according to claim 34 wherein the manifold layer is positioned above the interface layer, wherein fluid flows downward through the first set of fingers and upward through the second set of fingers.

42. The heat exchanger according to claim 34 wherein the interface layer is integrally formed with the heat source.

43. The heat exchanger according to claim 34 wherein the interface layer is coupled to the heat source.

44. The heat exchanger according to claim 34 wherein the fingers in the first set are positioned in an alternating configuration with the fingers in the second set.

45. The heat exchanger according to claim 34 wherein each of the fingers have the same length and width dimensions.

46. The heat exchanger according to claim 34 wherein at least one of the fingers has a different dimension than the remaining fingers.

47. The heat exchanger according to claim 34 wherein the fingers are arranged non-periodically in at least one dimension in the manifold layer.

48. The heat exchanger according to claim 34 wherein at least one of the fingers has at least one varying dimension along a length of the manifold layer.

49. The heat exchanger according to claim 34 wherein the manifold layer includes more than three and less than 10 parallel fingers.

50. The heat exchanger according to claim 40 further comprising a first port passage in communication with the first port and the first set of fingers, the first port passage configured to channel fluid from the first port to the first set of fingers.

51. The heat exchanger according to claim 50 further comprising a second port passage in communication with the second port and the second set of fingers, the second port passage configured to channel fluid from the second set of fingers to the second port.

52. The heat exchanger according to claim 34 further comprising an intermediate layer for channeling fluid to and from one or more predetermined positions in the interface layer via at least one conduit, the intermediate layer positioned between the interface layer and the manifold layer.

53. The heat exchanger according to claim 52 wherein the conduit is arranged in a predetermined configuration to channel fluid to one or more interface hot spot regions in the interface layer.

54. The heat exchanger according to claim 52 wherein the conduit is arranged in a predetermined configuration to channel fluid from one or more interface hot spot regions in the interface layer.

55. The heat exchanger according to claim 52 wherein the intermediate layer is coupled to the interface layer and the manifold layer.

56. The heat exchanger according to claim 52 wherein the intermediate layer is integrally formed with the interface layer and the manifold layer.

57. The heat exchanger according to claim 52 wherein the conduit has at least one varying dimension in the intermediate layer.

58. The heat exchanger according to claim 34 wherein the interface layer includes a coating thereupon, wherein the coating provides an appropriate thermal conductivity of at least 20 W/m-K.

59. The heat exchanger according to claim 34 wherein the interface layer has a thermal conductivity is at least 20 W/m-K.

60. The heat exchanger according to claim 34 further comprising a plurality of pillars configured in a predetermined pattern along the interface layer.

61. The heat exchanger according to claim 34 wherein the interface layer has a roughened surface.

62. The heat exchanger according to claim 34 wherein the interface layer includes a micro-porous structure disposed thereon.

63. The heat exchanger according to claim 34 further comprises a plurality of microchannels configured in a predetermined pattern along the interface layer.

64. The heat exchanger according to claim 63 wherein the microchannels are coupled to the interface layer.

65. The heat exchanger according to claim 63 wherein the microchannels are integrally formed with the interface layer.

66. The heat exchanger according to claim 63 wherein the microchannels are divided into segments along a dimension of the interface layer, at least one groove disposed in between the divided microchannel segments.

67. The heat exchanger according to claim 63 wherein the microchannels are continuous along a dimension of the interface layer.

68. The heat exchanger according to claim 66 wherein the at least one groove is aligned with a corresponding finger.

69. The heat exchanger according to claim 63 wherein the plurality of microchannels include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 20 W/m-K.

70. A manifold structure configureable to be coupled to a heat exchanger, wherein the heat exchanger is configured to cool a heat source, the manifold structure comprising:

a first set of fingers for providing fluid at a first temperature to a heat exchange region of the heat exchanger, wherein the fluid in the heat exchange region performs thermal exchange with the heat source and flows toward a second set of fingers in the manifold structure at a second temperature, each finger disposed parallel to each other along a dimension and spaced apart by an appropriate distance to reduce pressure drop in the heat exchanger.

71. The manifold structure according to claim 70 wherein the fluid is in single phase flow conditions.

72. The manifold structure according to claim 70 wherein the fluid is in two phase flow conditions.

73. The manifold structure according to claim 70 wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the interface layer.

74. The manifold structure according to claim 70 wherein the heat exchange region is integrally formed with the heat source.

75. The manifold structure according to claim 70 wherein the heat exchange region is coupled to the heat source.

76. The manifold structure according to claim 70 further comprising at least one first port in communication with the first set of fingers, wherein fluid enters the manifold structure through the at least one first port.

77. The manifold structure according to claim 76 further comprising at least one second port in communication with the second set of fingers, wherein fluid exits the manifold structure through the at least one second port.

78. The manifold structure according to claim 70 wherein the manifold structure is positioned above the heat exchange region, wherein fluid flows downward to the heat exchange region via the first set of fingers and upward to the heat exchange region via the second set of fingers.

79. The manifold structure according to claim 70 further comprising a first port passage in communication with the first port and the first set of fingers, the first port passage configured to channel fluid from the first port to the first set of fingers.

80. The manifold structure according to claim 79 further comprising a second port passage in communication with the second port and the second set of fingers, the second port passage configured to channel fluid from the second set of fingers to the second port.

81. The manifold structure according to claim 70 further comprising an intermediate layer for channeling fluid to and from one or more predetermined positions in the heat exchange region via at least one conduit, the intermediate layer positioned between the manifold structure and the heat exchange region.

82. The manifold structure according to claim 81 wherein the conduit is arranged in a predetermined configuration to channel fluid to one or more hot spots in the heat exchange region.

83. The manifold structure according to claim 81 wherein the intermediate layer is coupled to the manifold structure.

84. The manifold structure according to claim 81 wherein the intermediate layer is integrally formed with the manifold structure.

85. The manifold structure according to claim 81 wherein the conduit has at least one varying dimension in the intermediate layer.

86. The manifold structure according to claim 70 wherein the heat exchange region includes a coating thereupon, wherein the coating provides an appropriate thermal conductivity of at least 20 W/m-K.

87. The manifold structure according to claim 70 wherein the at least one finger includes a varying dimension along the manifold structure.

88. The manifold structure according to claim 70 wherein each of the fingers have the same length and width dimensions.

89. The manifold structure according to claim 70 wherein at least one of the fingers has a different dimension than the remaining fingers.

90. The manifold structure according to claim 70 wherein the fingers are arranged non-periodically in at least one dimension in the manifold layer.

91. The manifold structure according to claim 70 wherein at least one of the fingers has at least one varying dimension along a length of the manifold layer.

92. A method of cooling a heat source, the method comprising:

a. providing fluid at a first temperature to a heat exchange region via a first set of fingers in a first configuration;

b. channeling the fluid along a plurality of flow paths along the heat exchange region, wherein the fluid is channeled to a second set of fingers in a second configuration, wherein the first and second configuration are arranged in parallel to minimize pressure drop therebetween; and

c. removing fluid at a second temperature from the heat exchange region via the second set of fingers.

93. The method according to claim 92 wherein the first set and second set of fingers are disposed along the heat exchange region.

94. The method according to claim 92 wherein the first set and second set of fingers are disposed above the heat exchange region.

95. The method according to claim 92 wherein the at least one finger in the first set is arranged adjacent to at least one finger in the second set by an appropriate distance to reduce pressure drop therebetween.