Methods for preparing ball grid array substrates via use of a laser
First Claim
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1. A semiconductor device formed by a laser etching process comprising:
- providing a substrate having a surface;
forming resist on at least a portion of the surface; and
etching the resist from the surface of the substrate using a laser.
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Abstract
The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
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Citations
17 Claims
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1. A semiconductor device formed by a laser etching process comprising:
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providing a substrate having a surface;
forming resist on at least a portion of the surface; and
etching the resist from the surface of the substrate using a laser. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of enhancing the adhesion of a compound to a surface of a substrate comprising:
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providing said substrate having said surface; and
roughening the surface of the substrate. - View Dependent Claims (8)
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9. An automolding system comprising:
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providing a substrate having a surface;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using a laser. - View Dependent Claims (10, 11)
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12. A semiconductor device formed by a laser etching process on a substrate having a surface comprising:
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forming resist on at least a portion of the surface; and
etching the resist from the surface of the substrate using a laser. - View Dependent Claims (13, 14, 15, 16, 17)
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Specification