Laser assisted machining method and device

• US 20040104207A1
• Filed: 11/19/2003
• Published: 06/03/2004
• Est. Priority Date: 11/28/2002
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Guu, Yeou-Bin, Wu, Jinn-Fa
• Granted Patent: US 7,002,100 B2
• Time in Patent Office: Days
• US Class Current: 219/121.73
• CPC Class Codes: B23K 26/0093 combined with mechanical machining or metal-working covered by other subclasses than B23K combined welding or cutting procedures or apparatus B23K28/02
• CPC Class Codes: B23K 26/0823 Devices involving rotation of the workpiece
• CPC Class Codes: B23K 28/02 Combined welding or cutting procedures or apparatus
• CPC Class Codes: B23K 37/0229 the guide member being situated alongside the workpiece
• CPC Class Codes: B23P 25/006 Heating the workpiece by laser during machining

Abstract

A laser assisted machining method and device comprise a tool mount on which a laser head is disposed. A digital thermometer is disposed in a machining tool or on the tool mount for feeding data to a system controller. A laser is used to enable the blade of the machining tool to heat and soften a workpiece instantaneously. As the machining process is in progress, the chip is rapidly removed. The temperature of the tool tip is monitored by the digital thermometer for automatic control of the temperature of heating the workpiece by the laser, thereby keeping the temperature of the tool tip in a specific allowable range. The efficiency of the machining process and the surface precision are thus enhanced.

Claims

1. A pulse laser assisted machining method comprising a fine machining process, said fine machining process comprising the following steps of:

(a)focusing a laser beam in such a manner that a focal point is located on a workpiece, and that the focal point is separated from a front of the blade of a machinning tool by a microdistance;

(b) moving the workpiece and the machining tool in relation to each other;

(c)softening a focused area by an instantaneous laser heating;

(d)advancing the machinning tool such that the machined material and the softened material are removed together, and that the same machinning mechanism is repeated until a subsequent laser emission.

2. The method as defined in claim 1, wherein the laser beam is brought into focus such that the focal point is separated from the front of the blade of the machinning tool by a distance ranging from several μ

m to more than 10 μ

m.

3. The method as defined in claim 1, wherein each pulse time of the laser is measured in unit of microsecond or nanosecond.

4. The method as defined in claim 1, wherein the focal heating range of the laser has a width of several μ

m to more than 10 μ

m, and a length of more than 10 μ

m to several hundred μ

m.

5. A laser assisted machining device comprising:

a tool mount;

a machining tool mounted on a tool mount;

a laser head mounted on the tool mount such that the laser beam of the laser head can be focused on a workpiece for instantaneously heating and softening the workpiece;

a chip spray mounted on the tool mount for removing chip by a high-pressure fluid emission.

6. The device as defined in claim 5, wherein the laser head emits pulsed or continuous laser beam.

7. The device as defined in claim 5, wherein the chip spray removes the chip by a high-pressure gas or liquid.

8. A laser assisted machining device comprising:

a tool mount;

a machining tool mounted on the tool mount;

a laser head mounted on the tool mount such that the laser beam of the laser head can be focused on a workpiece for instantaneously heating and softening the workpiece;

a chip spray mounted on the tool mount for removing chip by a high-pressure fluid emission;

a digital thermometer disposed in a handle of the machining tool or on the tool mount for monitoring the temperature of a tool tip of the machining tool; and

a system controller for receiving data of the tool tip temperature so as to control automatically laser.

9. The device as defined in claim 8, wherein the chip spray removes the chip by a high-pressure gas or liquid.

10. The device as defined in claim 8, wherein the laser head emits pulsed or continuous laser beam.

11. The device as defined in claim 8, wherein the digital thermometer is a thermocouple or infrared digital thermometer.