Stackable ceramic FBGA for high thermal applications
First Claim
Patent Images
1. A stackable assembly comprising:
- a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and a plurality of circuits located in a portion of the cavity extending to the at least one aperture;
a semiconductor device having an active surface having a plurality of bond pads thereon, the semiconductor device located within the cavity of the first carrier;
a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads on the active surface of the semiconductor device;
encapsulant material filling the portion of the cavity in the first carrier; and
connector material located in the at least one aperture in the first carrier.
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Accused Products
Abstract
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
60 Citations
24 Claims
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1. A stackable assembly comprising:
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a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and a plurality of circuits located in a portion of the cavity extending to the at least one aperture;
a semiconductor device having an active surface having a plurality of bond pads thereon, the semiconductor device located within the cavity of the first carrier;
a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads on the active surface of the semiconductor device;
encapsulant material filling the portion of the cavity in the first carrier; and
connector material located in the at least one aperture in the first carrier. - View Dependent Claims (2, 3, 4, 5)
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6. A stackable semiconductor device assembly comprising:
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a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and a plurality of circuits located in a portion of the cavity extending to the at least one aperture;
a semiconductor device having an active surface having a plurality of bond pads thereon, the semiconductor device located within the cavity of the first carrier;
a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads on the active surface of the semiconductor device;
encapsulant material filling a portion of the cavity in the first carrier; and
connector material located in the at least one aperture in the first carrier. - View Dependent Claims (7, 8, 9, 10)
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11. A stackable assembly comprising:
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a substrate having an upper surface, a lower surface, and a plurality of circuits on the upper surface thereof;
a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and a plurality of circuits located in a portion of the cavity extending to the at least one aperture;
a semiconductor device having an active surface having a plurality of bond pads thereon, the semiconductor device located within the cavity of the first carrier;
a first connector between at least one circuit of a plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads on the active surface of the semiconductor device;
encapsulant material filling the portion of the cavity in the first carrier;
connector material located in the at least one aperture in the first carrier; and
at least one second connector connected to the connector material in the at least one aperture in the first carrier and at least one circuit of the plurality of circuits on the upper surface of the substrate. - View Dependent Claims (12, 13, 14)
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15. A stackable semiconductor device assembly comprising:
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a substrate having an upper surface, a lower surface, and a plurality of first circuits on the upper surface thereof;
a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and a plurality of second circuits located in a portion of the cavity extending to the at least one aperture;
a semiconductor device having an active surface having a plurality of bond pads thereon, the semiconductor device located within the cavity of the first carrier;
a first connector between at least one second circuit of the plurality of second circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads on the active surface of the semiconductor device;
encapsulant material filling the portion of the cavity in the first carrier;
connector material located in the at least one aperture in the first carrier; and
at least one second connector connected to the connector material in the at least one aperture in the first carrier and at least one first circuit of the plurality of first circuits on the upper surface of the substrate. - View Dependent Claims (16, 17, 18)
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19. A stackable assembly comprising:
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a substrate having an upper surface, a lower surface, and a plurality of circuits on the upper surface thereof;
a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and a plurality of circuits located in a portion of the cavity extending to the at least one aperture;
a first semiconductor device having an active surface having a plurality of bond pads thereon, the first semiconductor device located within the cavity of the first carrier;
a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads on the active surface of the first semiconductor device;
encapsulant material filling the portion of the cavity in the first carrier;
a first connector material located in the at least one aperture in the first carrier;
at least one second connector connected to the first connector material in the at least one aperture in the first carrier and at least one circuit of the plurality of circuits on the upper surface of the substrate;
a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier and further having a cavity therein, an upper surface, a lower surface, a plurality of connection pads on the upper surface thereof, a plurality of connection pads on the lower surface thereof, at least one first circuit of a plurality of first circuits connecting at least one connection pad of the plurality of connection pads on the upper surface thereof to at least one connection pad of the plurality of connections pads on the lower surface thereof, and at least one second circuit of a plurality of second circuits located in a portion of the cavity therein connected to the at least one connection pad of the plurality of connection pads on the upper surface thereof and the at least one connection pad of the plurality of connection pads on the lower surface;
a second semiconductor device having an active surface having a plurality of bond pads thereon, the second semiconductor device located within the cavity of the second carrier;
a third connector between the at least one second circuit of the plurality of second circuits located in the portion of the cavity of the second carrier and at least one bond pad of the plurality of bond pads on the active surface of the second semiconductor device;
encapsulant material filling the portion of the cavity in the second carrier;
at least one fourth connector connected to the at least one connection pad of the plurality of connection pads on the lower surface of the second carrier and at least one circuit of a plurality of circuits on the lower surface of the substrate. - View Dependent Claims (20, 21)
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22. A stackable semiconductor device assembly comprising:
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a substrate having an upper surface, a lower surface, and a plurality of circuits on the upper surface thereof;
a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and a plurality of circuits located in a portion of the cavity extending to the at least one aperture;
a first semiconductor device having an active surface having a plurality of bond pads thereon, the first semiconductor device located within the cavity of the first carrier;
a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads on the active surface of the first semiconductor device;
encapsulant material filling the portion of the cavity in the first carrier;
a first connector material located in the at least one aperture in the first carrier;
at least one second connector connected to the first connector material located in the at least one aperture in the first carrier and at least one circuit of the plurality of circuits on the upper surface of the substrate;
a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier and further having a cavity therein, an upper surface, a lower surface, a plurality of connection pads on the upper surface thereof, a plurality of connection pads on the lower surface thereof, at least one first circuit of a plurality of first circuits connecting at least one connection pad of the plurality of connection pads on the upper surface thereof to at least one connection pad of the plurality of connection pads on the lower surface thereof, and at least one second circuit of a plurality of second circuits located in a portion of the cavity therein connected to the at least one connection pad of the plurality of connection pads on the upper surface thereof and the at least one connection pad of the plurality of connection pads on the lower surface thereof;
a second semiconductor device having an active surface having a plurality of bond pads thereon, the second semiconductor device located within the cavity of the second carrier;
a third connector between the at least one second circuit of the plurality of second circuits located in the portion of the cavity of the second carrier and at least one bond pad of the plurality of bond pads on the active surface of the second semiconductor device;
encapsulant material filling the portion of the cavity in the second carrier;
at least one fourth connector connected to the at least one connection pad of the plurality of connection pads on the lower surface of the second carrier and at least one circuit of a plurality of circuits on the lower surface of the substrate. - View Dependent Claims (23, 24)
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Specification