Electrical leadframes, surface mountable semiconductor components, leadframe strips, and their method of manufacture
First Claim
1. A method for producing an electrical leadframe (10) for a light-emitting diode component, the electrical leadframe having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3), the method comprising:
- a) producing a layer composite comprising an electrically insulating carrier layer (101) and an electrically conductive connection conductor layer (102);
b) patterning of the carrier layer (101) in such a way that a contact-making window (7) to the connection conductor layer (102) is produced in said carrier layer; and
c) patterning of the connection conductor layer (102) in such a way that the first electrical connection conductor (2) and the second electrical connection conductor (3) are produced, and at least one of first and second electrical connection conductors can be electrically connected through the contact-making window (7).
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Accused Products
Abstract
The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3). The method includes a) production of a layer composite comprising an electrically insulating carrier layer (101) and an electrically conductive connection conductor layer (102), b) patterning of the carrier layer (101) in such a way that at least one contact-making window (7) toward the connection conductor layer (102) is produced in said carrier layer, and c) patterning of the connection conductor layer (102), in such a way that the first electrical connection conductor (2) and the second electrical connection conductor (3) are produced, at least one of which can be electrically connected through the contact-making window (7). The invention also relates to a leadframe strip having a connection conductor layer and a connection carrier layer, on which an array with a multiplicity of component regions is formed, the connection conductor layer being at least partly removed along separating lines between two adjacent component regions.
49 Citations
45 Claims
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1. A method for producing an electrical leadframe (10) for a light-emitting diode component, the electrical leadframe having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3), the method comprising:
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a) producing a layer composite comprising an electrically insulating carrier layer (101) and an electrically conductive connection conductor layer (102);
b) patterning of the carrier layer (101) in such a way that a contact-making window (7) to the connection conductor layer (102) is produced in said carrier layer; and
c) patterning of the connection conductor layer (102) in such a way that the first electrical connection conductor (2) and the second electrical connection conductor (3) are produced, and at least one of first and second electrical connection conductors can be electrically connected through the contact-making window (7). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for producing a surface-mountable semiconductor component having at least one semiconductor chip (1), at least two external electrical connection conductors (2, 3), which are connected to at least two electrical contacts (4, 5) of the semiconductor chip (1), and having a chip housing (11) having a connection carrier (9) and a chip encapsulation (6), the method comprising:
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a) applying an electrically insulating carrier layer (101) to an electrically conductive connection conductor layer (102), patterning at least one chip window (7) and at least one wire connection window (8) in the carrier layer (101), and patterning the external electrical connection conductors (2,3) into the connection conductor layer (102);
b) mounting the semiconductor chip (1) into the chip window (7);
c) electrically connecting at least one electrical contact (5) of the semiconductor chip (1) to a connection conductor (3) by means of a bonding wire (50) through the wire connection window (8);
d) placing the composite comprising patterned connection conductor layer (102), patterned carrier layer (101), semiconductor chip (1) and bonding wire (50) into an injection mold; and
e) encapsulating the semiconductor chip (1) including bonding wire (50) with an encapsulation material (6) by injection molding, which material is subsequently at least partly cured or incipiently cured. - View Dependent Claims (22, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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23. A method for producing a surface-mountable semiconductor component having at least one semiconductor chip (1), at least two external electrical connection conductors (2, 3), which are connected to at least two electrical contacts (4, 5) of the semiconductor chip (1), and having a chip housing (11) having a connection carrier (9) and a chip encapsulation (6), the method comprising:
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a) applying an electrically insulating carrier layer (101) to an electrically conductive connection conductor layer (102), patterning at least one chip window (7) in the carrier layer (101), and patterning the external electrical connection conductors (2, 3) into the connection conductor layer (102), the two connection conductors (2, 3) partly overlapping the chip window (7);
b) mounting the semiconductor chip onto the external electrical connection conductors (2, 3) in the chip window (7), in such a way that a first contact (4) and a second contact (5) of the semiconductor chip (1) bear on the first (2) and, respectively, on the second of the two connection conductors (3) and are electrically connected thereto;
c) placing the composite comprising patterned connection conductor layer (102), patterned carrier layer (101) and semiconductor chip (1) into an injection mold (500); and
d) encapsulating the semiconductor chip (1) with an encapsulation material (6) by injection molding, which material is subsequently at least partly cured or incipiently cured. - View Dependent Claims (24)
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- 41. A leadframe strip (200) having a connection conductor layer (102) and a carrier layer (101), on which an array (201) with a multiplicity of component regions (202) is formed, the connection conductor layer (101) being at least partly removed along separating lines (110) between adjacent component regions (202).
Specification