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Package for microchips

  • US 20040108588A1
  • Filed: 09/24/2003
  • Published: 06/10/2004
  • Est. Priority Date: 09/24/2002
  • Status: Abandoned Application
First Claim
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1. A package for protecting an integrated circuit device having an active side, said package comprising:

  • a substrate for mounting the integrated circuit device;

    a plastic cap mounted on the substrate to form an enclosed space for the active side of the integrated circuit device;

    a thermal bond formed between the substrate and the plastic cap to effectively seal the enclosed space so as to prevent the ingress of moisture or particulates.

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