Impedance qualization module
First Claim
1. A connector for a circuit conducting high frequency signals comprising:
- a) a housing including an input and an output terminal coupled to a data pathway conducting signals in excess of 1 gigahertz; and
b) a passive circuit coupled between said input and output terminals that exhibits a complementary impedance characteristic to that of said data pathway and comprised of at least one resistor and at least one capacitor and wherein said resistor is defined by a resistive layer that comprises a plate of said capacitor, whereby an extended range of intelligible data signals is obtained.
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Accused Products
Abstract
A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.
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Citations
23 Claims
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1. A connector for a circuit conducting high frequency signals comprising:
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a) a housing including an input and an output terminal coupled to a data pathway conducting signals in excess of 1 gigahertz; and
b) a passive circuit coupled between said input and output terminals that exhibits a complementary impedance characteristic to that of said data pathway and comprised of at least one resistor and at least one capacitor and wherein said resistor is defined by a resistive layer that comprises a plate of said capacitor, whereby an extended range of intelligible data signals is obtained. - View Dependent Claims (2, 3, 4, 5, 6)
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- 7. A passive thin film circuit device for conditioning a data conducting pathway comprising a signal layer including a thin film resistor and a thin film capacitor deposited on a first surface of a dielectric substrate and coupled in shunt to one another and terminating at input and output terminals, wherein said resistor comprises a plate of said capacitor, and wherein said device is able to pass intelligible signals in excess of one gigahertz.
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11. A connector for high frequency signals comprising:
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a) a housing including a plurality of input and output terminals coupled to a substrate containing a plurality of data pathways respectively conducting data signals in excess of 1 gigahertz between said input and output terminals; and
b) a plurality of passive thin film circuits mounted to said substrate and each serially coupled to at an input and an output port to one of said data pathways, wherein each thin film circuit exhibits a predetermined impedance characteristic complementary to that of the data pathways to data signals in excess of a predetermined frequency, and wherein each thin film circuit comprises a plurality of resistors and capacitors coupled between said input and said output port, wherein each thin film circuit comprises a substrate, first and second layers defining first and second plates of said capacitors, a dielectric layer intermediate said first and second layers, and wherein one of said first and second layers defines said resistors. - View Dependent Claims (12)
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13. A thin film device for coupling to and conditioning conductive pathways to pass intelligible data signals in excess of 1 gigahertz comprising:
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a) a passive thin film module including a plurality of circuits comprised exclusively of resistors and capacitors coupled between a plurality of input and an output ports, wherein said module includes an electrically insulative substrate, a first layer defining a first plate of each of said capacitors, a dielectric layer overlying each first plate, and a resistive layer overlying said dielectric layer and coextensive with each first plate and defining a resistor of said circuits and a second plate of said capacitors, whereby each circuit exhibits a predetermined impedance characteristic complementary to data signals in excess of one gigahertz; and
b) a plurality of terminations coupled to said input and output ports. - View Dependent Claims (14, 15, 16)
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17. A connector for high frequency signals comprising:
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a) a connector body having a housing adapted for interconnection with input and output conductors; and
b) a core piece supported within said housing and having a substrate and a plurality of layers deposited over said substrate, wherein said layers include first and second conductive layers that define first and second plates of a capacitor, a dielectric layer sandwiched between said first and second conductive layers, and wherein one of said first and second conductive layers also defines a resistor, and wherein said core piece exhibits a predetermined impedance characteristic complementary to data signals conveyed by said input and output conductors. - View Dependent Claims (18, 19, 20)
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21. A connector for high frequency signals comprising:
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a) a coaxial connector body having a housing adapted for interconnection with input and output conductors; and
b) an electrically conductive core piece supported within said housing and having a plurality of layers including a first conductive layer defining a resistor and a first plate of a capacitor, a dielectric layer overlying said first conductive layer, and a second conductive layer overlying said dielectric layer and defining a second plate of said capacitor, and wherein said core piece exhibits a predetermined impedance characteristic complementary to data signals conveyed by said input and output conductors. - View Dependent Claims (22, 23)
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Specification