Impedance qualization module

• US 20040110421A1
• Filed: 09/24/2003
• Published: 06/10/2004
• Est. Priority Date: 12/06/2002
• Status: Active Grant

• Current Assignee: Thin Film Technology Corp.
• Original Assignee: Thin Film Technology Corp.
• Inventors: Brooks, Mark, Takamura, Tsuguhiko, Howieson, Mike, Huibregtse, Brent, Broman, Mark Hamilton, Okamoto, Yasutsugu
• Granted Patent: US 7,200,010 B2
• Time in Patent Office: Days
• US Class Current: 439/610
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H01R 12/724 containing contact members forming a right angle
• CPC Class Codes: H01R 13/658 High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse] coaxial coupling devices specially adapted for high frequency H01R24/40; for flat or ribbon cable connectors H01R12/774; for coaxial cable H01R9/05
• CPC Class Codes: H01R 13/719 specially adapted for high frequency, e.g. with filters
• CPC Class Codes: H01R 2103/00 Two poles
• CPC Class Codes: H01R 24/44 comprising impedance matching means

Abstract

A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.

Claims

1. A connector for a circuit conducting high frequency signals comprising:

a) a housing including an input and an output terminal coupled to a data pathway conducting signals in excess of 1 gigahertz; and

b) a passive circuit coupled between said input and output terminals that exhibits a complementary impedance characteristic to that of said data pathway and comprised of at least one resistor and at least one capacitor and wherein said resistor is defined by a resistive layer that comprises a plate of said capacitor, whereby an extended range of intelligible data signals is obtained.

2. A connector as set forth in claim 1 wherein said housing includes a plurality of signal conducting pathways and a plurality of input and output ports respectively coupled thereto, wherein each of said data pathways includes one of said passive circuits coupled between the respective input and output ports.

3. A connector as set forth in claim 2 wherein said input and output ports are connected to individual conductors of a multi-conductor cable.

4. A device as set forth in claim 1 wherein said resistive layer is formed of a material selected from a class of materials including tantalum oxide, silicon dioxide, silicon nitride, or nickel chrome.

5. A device as set forth in claim 1 wherein said passive circuit includes a cylindrical conductive substrate containing said resistor and said capacitor and wherein said resistor and capacitor are constructed as thin film devices.

6. A device as set forth in claim 1 wherein said resistor and capacitor are coupled to one another in shunt.

7. A passive thin film circuit device for conditioning a data conducting pathway comprising a signal layer including a thin film resistor and a thin film capacitor deposited on a first surface of a dielectric substrate and coupled in shunt to one another and terminating at input and output terminals, wherein said resistor comprises a plate of said capacitor, and wherein said device is able to pass intelligible signals in excess of one gigahertz.

8. A device as set forth in claim 7 wherein said circuit device includes a plurality of capacitors and resistors and wherein said resistors and capacitors are coupled together as a filter.

9. A device as set forth in claim 7 wherein said circuit device comprises a cylindrical conductive substrate and whereon said resistor and capacitor are constructed as thin film devices.

10. A device as set forth in claim 9 wherein a resistive layer is deposited onto said substrate, such that said resistive layer defines a resistor and a first plate of said capacitor, a dielectric layer is deposited over said resistive layer and a conductive layer is deposited over said dielectric layer that defines a second plate of said capacitor.

11. A connector for high frequency signals comprising:

a) a housing including a plurality of input and output terminals coupled to a substrate containing a plurality of data pathways respectively conducting data signals in excess of 1 gigahertz between said input and output terminals; and

b) a plurality of passive thin film circuits mounted to said substrate and each serially coupled to at an input and an output port to one of said data pathways, wherein each thin film circuit exhibits a predetermined impedance characteristic complementary to that of the data pathways to data signals in excess of a predetermined frequency, and wherein each thin film circuit comprises a plurality of resistors and capacitors coupled between said input and said output port, wherein each thin film circuit comprises a substrate, first and second layers defining first and second plates of said capacitors, a dielectric layer intermediate said first and second layers, and wherein one of said first and second layers defines said resistors.

12. A device as set forth in claim 11 wherein the one of said first and second layers that defines said resistors is formed of a material selected from a class of materials including tantalum oxide, silicon dioxide, silicon nitride, or nickel chrome.

13. A thin film device for coupling to and conditioning conductive pathways to pass intelligible data signals in excess of 1 gigahertz comprising:

a) a passive thin film module including a plurality of circuits comprised exclusively of resistors and capacitors coupled between a plurality of input and an output ports, wherein said module includes an electrically insulative substrate, a first layer defining a first plate of each of said capacitors, a dielectric layer overlying each first plate, and a resistive layer overlying said dielectric layer and coextensive with each first plate and defining a resistor of said circuits and a second plate of said capacitors, whereby each circuit exhibits a predetermined impedance characteristic complementary to data signals in excess of one gigahertz; and

b) a plurality of terminations coupled to said input and output ports.

14. A device as set forth in claim 13 wherein said resistive layer is formed of a material selected from a class of materials including tantalum oxide, silicon dioxide, silicon nitride, or nickel chrome.

15. A device as set forth in claim 13 wherein said terminations comprise a ball grid array.

16. A device as set forth in claim 13 wherein portions of said resistive layer that do not overlie said first capacitor plate defines other resistors of said circuits.

17. A connector for high frequency signals comprising:

a) a connector body having a housing adapted for interconnection with input and output conductors; and

b) a core piece supported within said housing and having a substrate and a plurality of layers deposited over said substrate, wherein said layers include first and second conductive layers that define first and second plates of a capacitor, a dielectric layer sandwiched between said first and second conductive layers, and wherein one of said first and second conductive layers also defines a resistor, and wherein said core piece exhibits a predetermined impedance characteristic complementary to data signals conveyed by said input and output conductors.

18. A device as set forth in claim 17 wherein said substrate comprises a cylindrical conductive member concentrically mounted to adjacent tubular conductors connected to said input and output conductors.

19. A device as set forth in claim 17 wherein said core piece includes an annular band of conductive material that electrically couples to one of said input and output conductors.

20. A device as set forth in claim 17 wherein said substrate comprises a tubular member concentrically mounted to adjacent conductors connected to said input and output conductors.

21. A connector for high frequency signals comprising:

a) a coaxial connector body having a housing adapted for interconnection with input and output conductors; and

b) an electrically conductive core piece supported within said housing and having a plurality of layers including a first conductive layer defining a resistor and a first plate of a capacitor, a dielectric layer overlying said first conductive layer, and a second conductive layer overlying said dielectric layer and defining a second plate of said capacitor, and wherein said core piece exhibits a predetermined impedance characteristic complementary to data signals conveyed by said input and output conductors.

22. A device as set forth in claim 21 wherein said core piece comprises a cylindrical conductive substrate containing said first and second conductive layers and said dielectric layer and concentrically mounted to adjacent conductors connected to said input and output conductors.

23. A device as set forth in claim 22 wherein said core piece comprises a tubular substrate.