Process for forming a patterned thin film structure for in-mold decoration

• US 20040112237A1
• Filed: 09/19/2003
• Published: 06/17/2004
• Est. Priority Date: 04/24/2002
• Status: Active Grant

• Current Assignee: ETANSI, Inc.
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated)
• Inventors: Liang, Rong-Chang, Chaug, Yi-Shung, Wang, Xiaojia, Kiluk, Sean, Tseng, Scott, Zang, Hongmei
• Granted Patent: US 7,156,945 B2
• Time in Patent Office: Days
• US Class Current: 101/483
• CPC Class Codes: B29C 45/14811 Multilayered articles B29C45/14827 takes precedence
• CPC Class Codes: B29K 2995/002 Coloured
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 14/20 on organic substrates
• CPC Class Codes: G02F 1/13439 characterised by their electrical, optical, physical properties; materials therefor; method of making
• CPC Class Codes: G09F 7/165 obtained by a treatment of the support
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2203/0257 Brushing, e.g. cleaning the conductive pattern by brushing or wiping
• CPC Class Codes: H05K 2203/0264 Peeling insulating layer, e.g. foil, or separating mask
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/0746 Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
• CPC Class Codes: H05K 3/04 the conductive material being removed mechanically, e.g. by punching
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern
• CPC Class Codes: H05K 3/146 By vapour deposition
• CPC Class Codes: H05K 3/16 by cathodic sputtering
• CPC Class Codes: H05K 3/184 using masks
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H10K 71/611 using printing deposition, e.g. ink jet printing
• CPC Class Codes: Y10S 156/922 : Specified electronic component delaminating in preparation for recycling
• CPC Class Codes: Y10T 156/11 : Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 156/1189 : with shearing during delaminating

Abstract

A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.

Claims

1. A process for forming a patterned thin film structure on a substrate, comprising:

printing a pattern on the substrate using a strippable material comprising 5-80% by weight of a re-dispersible particulate, the printed strippable material defining an area on the substrate where the thin film structure is to be formed by comprising a negative image of a decorative design to be formed on the substrate using the thin film material, such that the printed strippable material is present in areas on the substrate where the thin film structure is not to be formed and the printed strippable material is substantially not present in the area on the substrate where the thin film structure is to be formed;

depositing a thin film of material on the patterned substrate; and

stripping the strippable material from the substrate;

whereby the strippable material and any thin film material formed thereon are removed by said stripping leaving behind the thin film structure formed on the substrate in the shape of said decorative design; and

wherein the substrate and the patterned thin film design formed thereon are suitable for use as an in-mold decoration (IMD) decorated film.

2. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the strippable material comprises 10-60% by weight of re-dispersible particulate.

3. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the strippable material comprises a water soluble or water dispersible polymer as a binder.

4. The process for forming a patterned thin film structure on a substrate as recited in claim 3, wherein said water soluble or water dispersible polymer is selected from the group consisting of polyvinyl alcohol, polyvinylpyrrolidone, polyvinyl pyridine, polyacrylic acid, polymethacrylic acid, polyacrylamide, polyethylene glycol, poly(ethylene-co-maleic anhydride), poly (vinyl ether-co-maleic anhydride), poly(styrene-co-maleic anhydride), poly(butyelene-co-itaconic acid), PEOX, polystyrene sulfonate, cellulose derivatives such as hydroxyethyl cellulose, hydroxypropyl cellulose, methyl cellulose, carboxymethyl cellulose, xanthan gum, gum Arabic, gelatin, lecitin, and their copolymers.

5. The process for forming a patterned thin film structure on a substrate as recited in claim 3, wherein said water soluble or water dispersible polymer comprises a water dispersible polymer selected from the group consisting of water- or alkaline-dispersible waxes, polyolefin, or acrylic latexes or dispersions.

6. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the strippable material comprises a solvent soluble or solvent dispersible polymer as a binder.

7. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the re-dispersible particulate is derived from silica, CaCO₃, CaSO₄, BaSO₄, Al₂O₃, TiO₂, hollow-spheres, non-film-forming latexes or dispersions, inorganic pigment, or organic pigment.

8. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the particulate is a polymeric particle or a polymeric composite particle.

9. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the strippable material comprises an additive selected from the group consisting of surfactants, dyes, curing agents, and plasticizers;

whereby the presence of said additive facilitates the stripping of the strippable material subsequent to the deposition of the thin film.

10. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of stripping comprises using a solvent to remove the strippable material.

11. The process for forming a patterned thin film structure on a substrate as recited in claim 10, wherein the solvent is selected from the group consisting of water, aqueous solutions, alcohols, ketones, esters, ethers, amides, hydrocarbons, alkyl benzenes, pyrrolidones, sulfones, DMSO, and their mixtures and derivatives.

12. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the thin film material is non-conductive.

13. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the thin film material is semi-conductive.

14. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the thin film material is conductive.

15. The process for forming a patterned thin film structure on a substrate as recited in claim 14, wherein the conductive thin film material is a material selected from the group consisting of metals, metal oxides, and their alloys and multilayer composites.

16. The process for forming a patterned thin film structure on a substrate as recited in claim 14, wherein the conductive material is a metal selected from the group consisting of aluminum, copper, zinc, tin, molybdenum, nickel, chromium, silver, gold, iron, indium, thallium, titanium, tantalum, tungsten, rhodium, palladium, platinum and cobalt.

17. The process for forming a patterned thin film structure on a substrate as recited in claim 14, wherein the conductive material is a metal oxide or sulfide selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide, gadolinium indium oxide, tin oxide, fluorine-doped indium oxide or zinc sulfide.

18. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of depositing a thin film comprises sputtering.

19. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of depositing a thin film comprises vapor deposition.

20. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of depositing a thin film comprises vacuum deposition.

21. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of depositing a thin film comprises electroplating.

22. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of depositing a thin film comprises electro-less plating.

23. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of depositing a thin film comprises electroforming.

24. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises flexographic printing.

25. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises driographic printing.

26. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises electro photographic printing.

27. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises lithographic printing.

28. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises gravure printing.

29. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises thermal printing.

30. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises ink-jet printing.

31. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises screen printing.

32. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises stamp printing.

33. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the substrate comprises a plastic substrate.

34. The process for forming a patterned thin film structure on a substrate as recited in claim 33, wherein the plastic substrate comprises a portion of a roll of plastic substrate.

35. The process for forming a patterned thin film structure on a substrate as recited in claim 34, wherein the process for forming a patterned thin film structure on a substrate is a component part of a roll-to-roll process for fabricating a in-mold decoration film.

36. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the substrate comprises a polyethylene terephthalate (PET) film.

37. The process for forming a patterned thin film structure on a substrate as recited in claim 36, further comprising performing the following steps prior to forming the patterned thin film structure on the substrate:

treating or coating the PET film with a release agent or coating; and

coating the treated or coated PET film with a durable layer to provide oil and scratch resistance.

38. The process for forming a patterned thin film structure on a substrate as recited in claim 36, further comprising printing on the substrate a second decorative design using a printable material other than the thin film material.

39. The process for forming a patterned thin film structure on a substrate as recited in claim 36, further comprising coating the IMD decorated film with an adhesive to form an in-mold transfer film.

40. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the substrate comprises a polycarbonate (PC) substrate.

41. The process for forming a patterned thin film structure on a substrate as recited in claim 40, further comprising coating the decorated substrate with a thin protective layer.

51. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of stripping comprises using solvent to remove the strippable material.

52. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of stripping comprises using mechanical pressure to remove the strippable material.

53. The process for forming a patterned thin film structure on a substrate as recited in claim 52, wherein using mechanical pressure comprises brushing.

54. The process for forming a patterned thin film structure on a substrate as recited in claim 52, wherein using mechanical pressure comprises using a spray nozzle.

55. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of stripping comprises:

applying an adhesive layer having a higher adhesive strength with respect to the thin film and/or strippable material than the adhesive strength of the strippable material to the substrate; and

removing the strippable material and any thin film formed thereon by peeling off the adhesive layer.

56. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of stripping comprises:

applying an adhesive layer to the substrate after the thin film deposition step; and

removing the thin film on the area with the first printed material by peeling off the adhesive layer.

57. The method of claim 56, wherein the cohesion strength of the thin film and the adhesion strength between thin film and the substrate are stronger than any of the three forces:

the cohesion strength of the strippable material, the adhesion strength between the thin film and the strippable material, and the adhesion strength between the strippable material and the substrate.

42. A process for forming a patterned thin film structure on a substrate, comprising:

printing on the substrate with a printable first material a pattern that defines the area where the thin film structure is to be formed by comprising a positive image of a decorative design to be formed on the substrate such that the printable first material is printed in the area where the thin film structure is to be formed, the printable first material being strippable using a first solvent;

overcoating the printed surface of the substrate with a second material that is not strippable using the first solvent;

stripping the first material away using the first solvent in a process that strips away the first material and any portions of the second material formed on the first material without stripping away the portions of the second material formed directly on the substrate, such that the second material remains coated on the portions of the substrate where the first material was not present, thereby defining the boundaries of the thin film structure by comprising a negative image thereof such that the second material is not present in and the first material has been stripped from the area where the thin film structure is to be formed;

depositing a thin film layer on the patterned top surface of the substrate; and

stripping the second material to form the thin film structure in the shape of the decorative design;

wherein the substrate and the patterned thin film design formed thereon are suitable for use as an in-mold decoration (IMD) decorated film.

43. The process for forming a patterned thin film structure on a substrate as recited in claim 42, wherein the first material repels the second material such that the second material fills in the areas of the substrate between the areas where the first material has been printed without coating the areas where the first material is present.

44. The process for forming a patterned thin film structure on a substrate as recited in claim 42, wherein the first solvent is an aqueous solution or water.

45. The process for forming a patterned thin film structure on a substrate as recited in claim 42, wherein the first solvent is a non-aqueous solvent or solution.

46. The process for forming a patterned thin film structure on a substrate as recited in claim 42, wherein the first solvent is an aqueous basic solution, and the step of stripping the second material comprises using a second solvent comprising an aqueous acidic solution, an aqueous neutral solution, or water.

47. The process for forming a patterned thin film structure on a substrate as recited in claim 42, wherein the first solvent is an aqueous acidic solution and the step of stripping the second material comprises using a second solvent comprising an aqueous basic solution, an aqueous neutral solution, or water.

48. The process for forming a patterned thin film structure on a substrate as recited in claim 42, wherein the first solvent is an aqueous neutral solution or water and the step of stripping the second material comprises using a second solvent comprising an aqueous acidic solution or an aqueous basic solution.

49. A process for forming a patterned thin film structure on a substrate, comprising:

printing a first pattern on a first surface of the substrate using a strippable material comprising 10-60% by weight of a re-dispersible particulate, the first pattern of strippable material defining an area on the first surface of the substrate where a first thin film structure is to be formed;

depositing a thin film of thin film material on the patterned first surface of the substrate;

stripping the first pattern of strippable material from the substrate;

printing a second pattern on a second surface of the substrate using a strippable material comprising 10-60% by weight of a re-dispersible particulate, the second pattern of strippable material defining an area on the second surface of the substrate where a second thin film structure is to be formed;

depositing a thin film of thin film material on the patterned second surface of the substrate; and

stripping the second pattern of strippable material from the substrate;

whereby the first pattern of strippable material, the second pattern of strippable material, and any thin film material formed on either the first or the second pattern of strippable material are removed leaving behind the first thin film structure on the first surface of the substrate and the second thin film structure on the second surface of the substrate;

wherein the first thin film structure comprises a first decorative design, the second thin film structure comprises a second decorative design, and the substrate and the patterned thin film designs formed thereon are suitable for use as an in-mold decoration (IMD) decorated film.

50. A process for forming a patterned thin film structure on a substrate, comprising:

printing a first pattern on a first surface of the substrate using a strippable material comprising 10-60% by weight of a re-dispersible particulate, the first pattern of strippable material defining an area on the first surface of the substrate where a first thin film structure is to be formed;

printing a second pattern on a second surface of the substrate using a strippable material comprising 10-60% by weight of a re-dispersible particulate, the second pattern of strippable material defining an area on the second surface of the substrate where a second conductive thin film structure is to be formed;

depositing a thin film of material on the patterned first surface and on the patterned second surface of the substrate; and

stripping the first pattern and second pattern of strippable material from the substrate;

whereby the first pattern of strippable material, the second pattern of strippable material, and any thin film material formed on either the first or the second pattern of strippable material are removed leaving behind the first thin film structure on the first surface of the substrate and the second thin film structure on the second surface of the substrate; and

wherein the first thin film structure comprises a first decorative design, the second thin film structure comprises a second decorative design, and the substrate and the patterned thin film designs formed thereon are suitable for use as an in-mold decoration (IMD) decorated film.

58. A process for forming on a substrate a patterned thin film structure in the shape of a decorative design, comprising:

printing with a printable material on the top surface of the substrate a pattern that defines the area where the thin film structure is to be formed by comprising a positive image of the decorative design such that the printable material is printed in the area where the thin film structure is to be formed;

depositing a thin film layer on the patterned top surface of the substrate, wherein the thin film, the printable material, and the substrate are chosen so that the thin film adheres more strongly to the printable material than to the substrate; and

stripping from the substrate the portions of the thin film formed directly on the substrate using a stripping process that does not strip the thin film from the printable material such that the thin film structure remains formed on the printable material used to define the area in which the thin film structure was to be formed;

wherein the substrate and the patterned thin film design formed thereon are suitable for use as an in-mold decoration (IMD) decorated film.

59. The process for forming a patterned thin film structure on a substrate as recited in claim 58, wherein the printable material comprises a primer coating, adhesive, tie coat, or adhesion promoting material.

60. The process for forming a patterned thin film structure on a substrate as recited in claim 58, wherein the printable material comprises ink.

61. The process for forming a patterned thin film structure on a substrate as recited in claim 58, wherein the printable material is radiation curable.

62. The process for forming a patterned thin film structure on a substrate as recited in claim 58, wherein the printable material is thermal curable.

63. The process for forming a patterned thin film structure on a substrate as recited in claim 58, wherein the step of stripping comprises using solvent to remove the portions of the thin film material formed directly on the substrate.

64. The process for forming a patterned thin film structure on a substrate as recited in claim 58, wherein the step of stripping comprises using mechanical pressure to remove the portions of the thin film formed directly on the substrate.

65. The process for forming a patterned thin film structure on a substrate as recited in claim 64, wherein using mechanical pressure comprises brushing.

66. The process for forming a patterned thin film structure on a substrate as recited in claim 64, wherein using mechanical pressure comprises using a spray nozzle.

67. The process for forming a patterned thin film structure on a substrate as recited in claim 58, wherein the printable material comprises a first adhesive, adhesion promoting or tie material and the step of stripping comprises:

applying a second adhesive layer to the substrate after the thin film deposition step; and

removing the thin film material on the area without the first printed adhesive or adhesion promoting material by peeling off the second adhesive layer.

68. The method of claim 67, wherein the adhesion strength between thin film and the substrate is the weakest as compared to the cohesion strength of the second adhesive layer, the cohesion strength of the first adhesive or adhesion promoting material, the cohesion strength of the thin film, the adhesion strength between the thin film and the second adhesive layer, and the adhesion between the thin film and the first adhesive or adhesion promoting material.