Method and apparatus for cleaning a semiconductor substrate

• US 20040112405A1
• Filed: 12/17/2002
• Published: 06/17/2004
• Est. Priority Date: 12/17/2002
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Kwang-wook, Hwang, In-Seak
• Granted Patent: US 6,837,943 B2
• Time in Patent Office: Days
• US Class Current: 134/1.3
• CPC Class Codes: G03F 7/425 containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
• CPC Class Codes: H01L 21/02071 the processing being a delineation, e.g. RIE, of conductive layers
• CPC Class Codes: H01L 21/31133 by chemical means
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

A stripping solution is supplied onto the surface of a substrate and an alternating magnetic flux is applied to the substrate. The alternating magnetic flux induces a current in a conductive pattern of the substrate which heats the conductive pattern while the stripping solution is in contact with the substrate. The stripping solution, containing particles to be cleaned off the substrate, is then removed from the substrate.

Claims

1. A method of cleaning a substrate which includes a conductive pattern located at a surface of the substrate, said method comprising:

supplying a stripping solution to the surface of the substrate and applying an alternating magnetic flux to the substrate, wherein the alternating magnetic flux induces a current in the conductive pattern which heats the conductive pattern while the stripping solution is in contact with the substrate; and

removing the stripping solution from the substrate.

2. The method as claimed in claim 1, further comprising rotating the substrate to distribute the stripping solution across the surface of the substrate.

3. The method as claimed in claim 1, wherein the stripping solution is removed by applying a rinsing solution to the substrate.

4. The method as claimed in claim 3, further comprising rotating the substrate during or after application of the rinsing solution.

5. The method as claimed in claim 3, further comprising rotating the substrate to dry the substrate after said application of the rinsing solution.

6. The method as claimed in claim 1, wherein the stripping solution removed from the substrate includes etch residue from a previously conducted etching process.

7. The method as claimed in claim 1, wherein the stripping solution is heated to a temperature of 30°

C. to 90°

C. in a vicinity of the conductor.

8. The method as claimed in claim 1, wherein the conductive pattern is heated to a temperature of 35°

to 135°

C.

9. The method as claimed in claim 1, wherein the stripping solution comprises an organic solvent mixed with an amine-based reducing agent.

10. The method as claimed in claim 8, wherein the stripping solution is devoid of fluorine.

11. The method as claimed in claim 9, wherein the substrate further includes a BPSG layer underlying the conductive layer.

12. A method of cleaning a substrate which includes a conductive pattern located at a surface of the substrate, said method comprising:

loading the substrate onto a rotatable chuck;

supplying a stripping solution to the surface of the substrate and rotating the substrate to distribute the stripping solution across the surface of the substrate;

applying an alternating magnetic flux to the substrate, wherein the alternating magnetic flux induces a current in the conductive pattern which heats the conductive pattern while the stripping solution is in contact with the substrate, and wherein the stripping solution is locally heated at the conductive pattern;

removing the stripping solution by applying a rinsing solution to the substrate and rotating the substrate; and

drying the substrate.

13. The method as claimed in claim 12, wherein application of the alternating magnetic flux is initiated prior to supply of the stripping solution.

14. The method as claimed in claim 13, wherein said applying the alternating magnetic flux, said supplying the stripping solution, and said removing the stripping solution, are repeated in sequence a plurality of times prior to said drying the substrate.

15. The method as claimed in claim 12, wherein supply of the stripping solution is initiated before application of the alternating magnetic flux.

16. The method as claimed in claim 15, wherein said supplying the stripping solution, said applying the alternating magnetic flux, and said removing the stripping solution, are repeated in sequence a plurality of times prior to said drying the substrate.

17. The method as claimed in claim 12, wherein the alternating magnetic flux is applied by applying an alternating current to a coil positioned below the chuck relative to the substrate.

18. The method as claimed in claim 12, wherein the alternating magnetic flux is applied by applying an alternating current to a coil embedded within the chuck.

19. The method as claimed in claim 12, wherein the chuck is electrically non-conductive.

20. The method as claimed in claim 12, wherein a frequency of the alternating magnetic flux is in a range of 1 kHz to 1 MHz.

21. The method as claimed in claim 12, wherein the stripping solution removed from the substrate includes etch residue from a previously conducted etching processes.

22. A method of cleaning a substrate which includes a conductive pattern located at a surface of the substrate, said method comprising:

applying an alternating magnetic flux to the substrate, wherein the alternating magnetic flux induces a current in the conductive pattern which heats the conductive pattern;

supplying a stripping solution to the surface of the substrate; and

removing the stripping solution from the substrate.

23. An apparatus for cleaning a substrate, said apparatus comprising:

a rotatable chuck having a substrate support surface;

a stripping solution supply mechanism positioned over the substrate support surface of the rotatable chuck;

a coil; and

an alternating current power supply coupled to the coil so as to supply an alternating current to the coil, wherein the alternating current of the coil creates an alternating magnetic flux over the substrate support surface, and wherein the alternating magnetic flux is sufficient to heat a conductive pattern of a substrate placed on the substrate support surface.

24. An apparatus as claimed in claim 23, wherein the rotatable chuck is made of an electrically non-conductive material.

25. An apparatus as claimed in claim 24, wherein the coil is located below chuck opposite the substrate support surface.

26. An apparatus as claimed in claim 24, wherein the coil is embedded within the chuck.

27. An apparatus as claimed in claim 23, wherein the stripping solution supply mechanism includes a nozzle outlet located over a center region of the substrate support surface of the rotatable chuck.

28. An apparatus as claimed in claim 26, further comprising a rinsing solution nozzle outlet located over the center region of the substrate support surface of the chuck.

29. An apparatus as claimed in claim 23, further comprising a motor for rotating the chuck.

30. An apparatus as claimed in claim 23, wherein a frequency of the alternating current supplied by the alternating current supply is in a range of 1 kHz to 1 MHz.