Method for surface treatment of processed copper workpiece

• US 20040112763A1
• Filed: 03/20/2003
• Published: 06/17/2004
• Est. Priority Date: 07/13/2001
• Status: Abandoned Application

• Current Assignee: Jipukomu Kabushiki Kaisha, Kabushiki Kaisha Zainao
• Original Assignee: Jipukomu Kabushiki Kaisha, Kabushiki Kaisha Zainao
• Inventors: Nishio, Yasuaki, Itoh, Jin-Ichi
• Application Number:
  US10/380,477
• Publication Number:
  US 20040112763A1
• Time in Patent Office: Days
• US Class Current: 205/746
• CPC Class Codes: C02F 1/461 by electrolysis
• CPC Class Codes: C02F 1/4618 for producing "ionised" acidic or basic water
• CPC Class Codes: C02F 1/66 by neutralisation; pH adjustment for degassing C02F1/20; using ion-exchange C02F1/42; for flocculation or precipitation of suspended impurities C02F1/52; for removing dissolved compounds C02F1/58
• CPC Class Codes: C02F 2103/02 Non-contaminated water, e.g. for industrial water supply
• CPC Class Codes: C23F 1/18 for etching copper or alloys thereof
• CPC Class Codes: C23G 1/00 Cleaning or pickling metallic material with solutions or molten salts with organic solvents C23G5/02
• CPC Class Codes: H05K 2203/0392 Pretreatment of metal, e.g. before finish plating, etching
• CPC Class Codes: H05K 2203/0789 Aqueous acid solution, e.g. for cleaning or etching
• CPC Class Codes: H05K 2203/0793 Aqueous alkaline solution, e.g. for cleaning or etching
• CPC Class Codes: H05K 2203/1509 Horizontally held PCB
• CPC Class Codes: H05K 3/22 Secondary treatment of printed circuits H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107
• CPC Class Codes: H05K 3/3489 Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
• CPC Class Codes: H05K 3/383 by microetching

Abstract

The present invention provides a soft etching technique for degreasing and removal of oxide layers on the surface of a processed copper article and for improvement of adhesion with a resist film, and a technique by which the waste water treatment accompanying the soft etching can be made non-polluting. Namely, the surface of the processed copper article is treated with at first an electrolyzed alkaline water, then an electrolyzed acidic water and further an electrolyzed alkaline water, sequentially, and then subjected to washing with water and a drying treatment, and the waste water by the treatment with the electrolyzed acidic water and the waste water by the treatment with the electrolyzed alkaline water are mixed and neutralized, and from the thus obtained neutralized water, copper ions are recovered.

Claims

1. A method for surface treatment of a processed copper article, which comprises treating a surface of a processed copper article by using an electrolyzed acidic water.

2. The method for surface treatment of a processed copper article according to claim 1, wherein after the treatment with the electrolyzed acidic water, a treatment with an electrolyzed alkaline water is carried out.

3. The method for surface treatment of a processed copper article according to claim 1, wherein after the treatment with an electrolyzed acidic water, a washing treatment with water is carried out.

4. The method for surface treatment of a processed copper article according to claim 2, wherein after the treatment with the electrolyzed acidic water, the treatment with the electrolyzed alkaline water is carried out, and further a washing treatment with water is carried out,

5. The method for surface treatment of a processed copper article according to any one of claims 2 to 4, wherein after the treatment with the electrolyzed acidic water, the treatment with the electrolyzed alkaline water or the washing treatment with water is carried out immediately after the treatment with the electrolyzed acidic water.

6. The method for surface treatment of a processed copper article according to any one of claims 1 to 5, wherein before the treatment with the electrolyzed acidic water, a pre-treatment with an electrolyzed alkaline water is carried out.

7. The method for surface treatment of a processed copper article according to any one of claims 1 to 6, wherein further a drying treatment is carried out.

8. The method for surface treatment of a processed copper article according to any one of claims 1 to 7, wherein the electrolyzed acidic water is an electrolyzed acidic water having pH of at most 3, a residual chlorine concentration of at most 20 PPM and an oxidation-reduction potential of 1,000 to 1,300 mV, obtainable by electrolyzing water having incorporated as an electrolyte, a compound capable of liberating chlorine ions when dissolved in water, using an electrolysis tank having an ion permeable diaphragm between an anode and a cathode.

9. The method for surface treatment of a processed copper article according to any one of claims 1 to 7, wherein the electrolyzed acidic water is an electrolyzed acidic water having pH of at most 3 and an oxidation-reduction potential of 1,000 to 1,300 mV, obtainable by electrolyzing water having incorporated as an electrolyte, a compound capable of liberating sulfate ions when dissolved in water, using an electrolysis tank having an ion permeable diaphragm between an anode and a cathode.

10. The method for surface treatment of a processed copper article according to any one of claims 2 and 6 to 9, wherein the electrolyzed alkaline water to be used for the treatment with the electrolyzed alkaline water subsequent to the treatment with the electrolyzed acidic water is an electrolyzed alkaline water having pH of at least 10 and an oxidation-reduction potential of −

150 to −

900 mV, obtainable by electrolyzing water by using an electrolysis tank having an ion permeable diaphragm between an anode and a cathode.

11. The method for surface treatment of a processed copper article according to any one of claims 6 to 10, wherein the electrolyzed alkaline water to be used for the pre-treatment before the treatment with the electrolyzed acidic water is an electrolyzed alkaline water heated to at least 40 °

C., having pH of at least 10, an oxidation-reduction potential of −

150 to −

900 mV and a surface tension of at most 670 dyne/cm, which is obtainable by electrolyzing water by using an electrolysis tank having an ion permeable diaphragm between an anode and a cathode.

12. The method for surface treatment of a processed copper article according to any one of claims 1 to 11, wherein a waste water after the treatment with the electrolyzed acidic water is neutralized, and recovered or reused as a neutral water.

13. The method for surface treatment of a processed copper article according to claim 12, wherein a waste water after the treatment with the electrolyzed acidic water and a waste water after the treatment with the electrolyzed alkaline water are mixed and treated, and recovered or reused as a neutral water.

14. The method for surface treatment of a processed copper article according to any one of claims 1 to 13, wherein copper ions are separated and recovered from a waste water after the treatment with the electrolyzed acidic water or a neutral water obtainable by neutralizing said waste water.

15. The method for surface treatment of a processed copper article according to claim 14, wherein a waste water after the treatment with the electrolyzed acidic water or a neutral water obtainable by neutralizing said waste water is led into a copper ion recovery tank to separate and recover copper ions as copper hydroxide.

16. The method for surface treatment of a processed copper article according to any one of claims 1 to 15, wherein the processed copper article is one formed as a surface conductive electrode on a circuit board as an electronic part.