Semiconductor device and process for fabricating the same
First Claim
1. A semiconductor device, comprising:
- a plurality of semiconductor chips mounted on a substrate;
an insulation film provided on said substrate, wherein said plurality of semiconductor chips are incrusted in said insulation film; and
wiring provided on said insulation film, wherein said wiring is connected to said plurality of semiconductor chips through a connection hole formed on said insulation film.
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Accused Products
Abstract
A semiconductor device of MCM type allowing high-density assembly and a process of fabricating the same is provided.
There are provided semiconductor chips mounted on a supporting substrate and incrusted in an insulation film on the supporting substrate and wiring formed in the insulation film so as to connect to each semiconductor chip through connection holes provided in the insulation film. Then, an interlayer dielectric covers such wiring that is connected to an upper layer wiring, through connection holes provided in such interlayer dielectric.
In addition, an upper layer insulation film covers the upper layer wiring, and an electrode, connected to such upper layer wiring through another connection hole, is provided on such upper layer insulation film.
38 Citations
21 Claims
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1. A semiconductor device, comprising:
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a plurality of semiconductor chips mounted on a substrate;
an insulation film provided on said substrate, wherein said plurality of semiconductor chips are incrusted in said insulation film; and
wiring provided on said insulation film, wherein said wiring is connected to said plurality of semiconductor chips through a connection hole formed on said insulation film. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device, comprising:
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a plurality of semiconductor chips;
an insulation layer supporting said plurality of semiconductor chips, wherein a surface of said plurality of semiconductor chips is incrusted in said insulation layer and another surface of said plurality of semiconductor chips are exposed; and
wiring provided on said insulation layer, wherein said wiring is connected to each semiconductor chip of said plurality of semiconductor chips through a connection hole formed on said insulation layer. - View Dependent Claims (8, 9, 10, 11, 12)
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- 13. A semiconductor device, comprising a plurality of semiconductor chips mounted on a substrate, wherein a circuit of a semiconductor chip among said plurality of semiconductor chips is a shared circuit, shared with another semiconductor chip of said plurality of semiconductor chips.
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17. A method of fabrication of a semiconductor device, comprising the steps of:
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die bonding of a plurality of semiconductor chips on a substrate;
forming of an insulation film on said substrate, wherein said plurality of semiconductor chips is incrusted in said insulation film;
forming of a connection hole reaching a semiconductor chip of said plurality of semiconductor chips on said insulation film; and
forming of wiring on said insulation film, wherein said wiring is connected to said semiconductor chip through said connection hole. - View Dependent Claims (18, 19, 20, 21)
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Specification